View source for Samsung electronics co., ltd. (20240096820). METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract

=METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:Young Lyong Kim of Suwon-si (KR)|Young Lyong Kim of Suwon-si (KR)]][[Category:Young Lyong Kim of Suwon-si (KR)]]

[[:Category:Hyun Soo Chung of Suwon-si (KR)|Hyun Soo Chung of Suwon-si (KR)]][[Category:Hyun Soo Chung of Suwon-si (KR)]]

[[:Category:In Hyo Hwang of Suwon-si (KR)|In Hyo Hwang of Suwon-si (KR)]][[Category:In Hyo Hwang of Suwon-si (KR)]]

==METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240096820 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF

==Simplified Explanation==

The method for manufacturing a semiconductor package involves mounting semiconductor chips on an interposer, forming a molding part between the chips, surrounding bumps with underfill, forming sacrificial and wafer level molding layers, planarizing the layers, removing sacrificial pattern, sawing the package, mounting the interposer on a package board, surrounding bumps with underfill, and attaching a stiffener to the board.

* Mount semiconductor chips on an interposer
* Form molding part between semiconductor chips
* Surround bumps with first underfill
* Form sacrificial layer covering chips
* Form wafer level molding layer covering sacrificial layer
* Planarize to expose upper sides of chips
* Form sacrificial pattern and wafer level molding pattern
* Remove sacrificial pattern
* Saw off outer edge of semiconductor package
* Mount interposer on package board
* Surround bumps with second underfill
* Attach stiffener to outer portion of package board

== Potential Applications ==
This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices such as smartphones, tablets, and computers.

== Problems Solved ==
This method solves the problem of efficiently and effectively packaging semiconductor chips in a compact and durable manner, ensuring proper functionality and reliability of electronic devices.

== Benefits ==
The benefits of this technology include improved thermal management, increased durability, enhanced electrical performance, and overall cost-effectiveness in semiconductor packaging processes.

== Potential Commercial Applications ==
The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing companies, and consumer electronics companies looking to enhance the performance and reliability of their products.

== Possible Prior Art ==
One possible prior art in semiconductor packaging is the use of flip chip technology, which involves mounting semiconductor chips directly onto a substrate without the need for wire bonding. This method offers improved electrical performance and thermal management compared to traditional packaging methods.

=== Unanswered Questions ===

=== How does this method compare to traditional semiconductor packaging techniques? ===
This article does not provide a direct comparison between this method and traditional semiconductor packaging techniques. It would be helpful to understand the specific advantages and disadvantages of this new method in comparison to existing practices.

=== What are the specific electronic devices that can benefit from this advanced semiconductor packaging technology? ===
The article does not specify the electronic devices that can benefit from this technology. It would be interesting to explore the potential applications in different industries and products.


==Original Abstract Submitted==

a method for manufacturing a semiconductor package includes mounting semiconductor chips on an interposer, forming a molding part between the semiconductor chips, surrounding a plurality of bumps between the semiconductor chips and the interposer with a first underfill, forming a sacrificial layer that covers the semiconductor chips, forming a wafer level molding layer that covers the sacrificial layer, performing a planarization process to expose upper sides of the semiconductor chips, form the sacrificial layer into a sacrificial pattern, and form the wafer level molding layer into a wafer level molding pattern, removing the sacrificial pattern, performing a sawing process to remove an outer edge of the semiconductor package, mounting the interposer on a side of a package board, surrounding a plurality of bumps between the package board and the interposer with a second underfill, and attaching a stiffener to an outer portion of the package board.



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