View source for Qualcomm incorporated (20240096750). SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION simplified abstract

=SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION=


==Organization Name==

[[:Category:qualcomm incorporated|qualcomm incorporated]]


[[Category:qualcomm incorporated]]

==Inventor(s)==

[[:Category:Qingqing Liang of San Diego CA (US)|Qingqing Liang of San Diego CA (US)]][[Category:Qingqing Liang of San Diego CA (US)]]

[[:Category:Periannan Chidambaram of San Diego CA (US)|Periannan Chidambaram of San Diego CA (US)]][[Category:Periannan Chidambaram of San Diego CA (US)]]

[[:Category:George Pete Imthurn of San Diego CA (US)|George Pete Imthurn of San Diego CA (US)]][[Category:George Pete Imthurn of San Diego CA (US)]]

[[:Category:Stanley Seungchul Song of San Diego CA (US)|Stanley Seungchul Song of San Diego CA (US)]][[Category:Stanley Seungchul Song of San Diego CA (US)]]

==SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240096750 titled 'SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION

==Simplified Explanation==

The patent application describes integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules, resulting in smaller and denser TSVs with low mechanical stress. The denser TSVs allow for more flexible wiring options.

* Through-substrate vias (TSVs) are formed using self-aligned contact modules.
* Smaller and denser TSVs are achieved with low mechanical stress.
* Denser TSVs enable more flexible wiring options.

== Potential Applications ==
The technology could be applied in:
* High-performance computing
* Telecommunications
* Automotive electronics

== Problems Solved ==
The technology addresses:
* Limitations in wiring options due to TSV size and density
* Mechanical stress issues in TSV formation

== Benefits ==
The benefits of this technology include:
* Improved circuit performance
* Enhanced flexibility in wiring configurations
* Reduced mechanical stress on the integrated circuit

== Potential Commercial Applications ==
The technology could be utilized in:
* Semiconductor manufacturing
* Electronic device production
* Aerospace industry applications

== Possible Prior Art ==
One possible prior art could be the use of traditional TSV processing methods with larger vias and higher mechanical stress.

=== Unanswered Questions ===

=== How does this technology compare to existing TSV processing methods in terms of cost-effectiveness? ===
The article does not provide information on the cost-effectiveness of this technology compared to traditional TSV processing methods.

=== What impact does the use of self-aligned contact modules have on the overall performance of the integrated circuits? ===
The article does not discuss the specific impact of self-aligned contact modules on the performance of the integrated circuits.


==Original Abstract Submitted==

disclosed are integrated circuit structures with through-substrate vias (tsvs) processed through self-aligned contact modules. as a result, much smaller and/or denser tsvs are formed with low mechanical stress. the denser tsvs allow for more flexible wiring options.



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