View source for 20240047271. METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS simplified abstract (Micro Technology, Inc.)

=METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS=


==Organization Name==

[[:Category:Micro Technology, Inc.|Micro Technology, Inc.]]


[[Category:Micro Technology, Inc.]]

==Inventor(s)==

[[:Category:Chih Kai Wang of Changhua County (TW)|Chih Kai Wang of Changhua County (TW)]][[Category:Chih Kai Wang of Changhua County (TW)]]

==METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240047271 titled 'METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS

==Simplified Explanation==

The abstract describes a system and method for stealth dicing a semiconductor wafer. The method involves implanting dopant ions into the wafer from the back side, creating a modified layer in the material of the wafer. The wafer is then fractured along the boundaries defined by the modified layer.

* The method involves implanting dopant ions into a semiconductor wafer from the back side.
* A laser beam is focused on an inside portion of the wafer through the back surface.
* The laser beam forms a modified layer in the material of the wafer near the implanted dopant ions.
* The wafer is fractured along the boundaries defined by the modified layer.

Potential applications of this technology:

* Semiconductor manufacturing: This method can be used in the production of semiconductor wafers, allowing for stealth dicing and separation of individual chips.
* Integrated circuit packaging: The stealth dicing technique can be applied to separate integrated circuits from a wafer, enabling their packaging into individual components.

Problems solved by this technology:

* Improved yield: The stealth dicing method reduces the risk of damage to the semiconductor wafer during the dicing process, leading to higher yield rates.
* Enhanced chip separation: The modified layer created by the laser beam allows for precise and controlled fracturing of the wafer, resulting in clean and accurate chip separation.

Benefits of this technology:

* Cost reduction: The stealth dicing method eliminates the need for expensive and time-consuming mechanical dicing processes, reducing manufacturing costs.
* Increased productivity: The use of laser beam technology enables faster and more efficient dicing, improving overall production throughput.
* Enhanced chip quality: The controlled fracturing along the modified layer ensures clean and precise chip separation, leading to higher quality chips.


==Original Abstract Submitted==

a system and method for stealth dicing a semiconductor wafer. the method may include implanting dopant ions to a first depth in the semiconductor wafer through a back side of the semiconductor wafer. the method may further include focusing a laser beam at an inside portion of the wafer through the back surface of the wafer to form a modified layer in material of the semiconductor wafer proximate the first depth. the method may also include fracturing the semiconductor wafer along boundaries defined by the modified layer.



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