View source for 20240042539. Soldering Apparatus And Method Of Detecting Failures Of Gasket simplified abstract (SENJU METAL INDUSTRY CO., LTD.)

=Soldering Apparatus And Method Of Detecting Failures Of Gasket=


==Organization Name==

[[:Category:SENJU METAL INDUSTRY CO., LTD.|SENJU METAL INDUSTRY CO., LTD.]]


[[Category:SENJU METAL INDUSTRY CO., LTD.]]

==Inventor(s)==

[[:Category:Tsutomu Hiyama of Tokyo (JP)|Tsutomu Hiyama of Tokyo (JP)]][[Category:Tsutomu Hiyama of Tokyo (JP)]]

[[:Category:Nobuhiro Kojima of Tokyo (JP)|Nobuhiro Kojima of Tokyo (JP)]][[Category:Nobuhiro Kojima of Tokyo (JP)]]

==Soldering Apparatus And Method Of Detecting Failures Of Gasket - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240042539 titled 'Soldering Apparatus And Method Of Detecting Failures Of Gasket

==Simplified Explanation==

The patent application describes a soldering apparatus that includes a furnace body with a processing chamber for processing boards. The furnace body is equipped with a gasket that seals the furnace body. A sealed space is created by the furnace body and the gasket, which is isolated from the processing chamber. The apparatus also includes a gas supply apparatus that supplies a first gas into the sealed space, and a measuring apparatus that measures either the pressure in the sealed space or the concentration of a second gas in the sealed space.

* The soldering apparatus includes a furnace body with a processing chamber for processing boards.
* A gasket is provided on at least a part of the furnace body to seal it.
* The furnace body and the gasket define a sealed space that is isolated from the processing chamber.
* A gas supply apparatus is included to supply a first gas into the sealed space.
* A measuring apparatus is included to measure either the pressure in the sealed space or the concentration of a second gas in the sealed space.

Potential applications of this technology:

* Soldering and processing of boards in a controlled environment.
* Creation of a sealed space for specific gas treatments during soldering processes.
* Monitoring and control of gas pressure or gas concentration during soldering operations.

Problems solved by this technology:

* Ensures a controlled and sealed environment for soldering and processing boards.
* Allows for precise gas treatments during soldering processes.
* Provides accurate measurement and control of gas pressure or gas concentration.

Benefits of this technology:

* Improved soldering and processing quality due to the controlled environment.
* Enhanced reliability and consistency of soldering results.
* Increased efficiency and productivity in soldering operations.
* Enables the use of specific gas treatments for desired soldering outcomes.


==Original Abstract Submitted==

provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.



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