View source for 20240036010. ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM simplified abstract (Hitachi Power Solutions Co., Ltd.)

=ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM=


==Organization Name==

[[:Category:Hitachi Power Solutions Co., Ltd.|Hitachi Power Solutions Co., Ltd.]]


[[Category:Hitachi Power Solutions Co., Ltd.]]

==Inventor(s)==

[[:Category:Kaoru Sakai of Tokyo (JP)|Kaoru Sakai of Tokyo (JP)]][[Category:Kaoru Sakai of Tokyo (JP)]]

[[:Category:Masayuki Kobayashi of Tokyo (JP)|Masayuki Kobayashi of Tokyo (JP)]][[Category:Masayuki Kobayashi of Tokyo (JP)]]

[[:Category:Natsuki Sugaya of Ibaraki (JP)|Natsuki Sugaya of Ibaraki (JP)]][[Category:Natsuki Sugaya of Ibaraki (JP)]]

[[:Category:Koutaro Kikukawa of Ibaraki (JP)|Koutaro Kikukawa of Ibaraki (JP)]][[Category:Koutaro Kikukawa of Ibaraki (JP)]]

==ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240036010 titled 'ULTRASONIC INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM

==Simplified Explanation==

The ultrasonic inspection device and method described in the patent application aim to generate a clear image of a desired bonding interface without an S-gate. The device includes a controller that performs several steps to achieve this:

* The controller defines a first gate, indicating a time range, to extract a part of a reflected wave based on a predetermined condition.
* The controller also defines one or more second gates, each indicating a time width smaller than that of the first gate, before the end time of the first gate.
* For each measurement point of the inspection object, the device detects a lower layer echo or a local peak and adjusts the reception time of the reflected wave based on this information.
* Finally, the device generates a cross-sectional image of the inspection object based on the reflected wave.

Potential applications of this technology:

* Non-destructive testing and inspection of bonding interfaces in various industries such as aerospace, automotive, and manufacturing.
* Quality control and assurance in the production of bonded components.
* Detection and analysis of defects or anomalies in bonding interfaces.

Problems solved by this technology:

* Overcoming the limitations of conventional ultrasonic inspection methods that rely on S-gates, which can result in unclear or distorted images of bonding interfaces.
* Providing a more accurate and reliable inspection technique for bonding interfaces without the need for S-gates.
* Enhancing the ability to detect and analyze defects or anomalies in bonding interfaces.

Benefits of this technology:

* Improved image quality and clarity of bonding interfaces, leading to better analysis and interpretation of inspection results.
* Increased efficiency and accuracy in the inspection process, reducing the need for rework or additional inspections.
* Enhanced reliability and confidence in the quality of bonding interfaces, ensuring the integrity and performance of bonded components.


==Original Abstract Submitted==

provided is an ultrasonic inspection device and method capable of generating a clear image of a desired bonding interface without an s-gate. the controller in the ultrasonic inspection device is configured to: (a) define a first gate indicating a time range in which a part of a reflected wave is extracted based on a predetermined condition received; (b) define one or more second gates each indicating a time width smaller than that of the first gate before an end time of the first gate; (c) for each of a plurality of measurement points of an inspection object, (c1) detect a lower layer echo or a local peak, (c2) adjust a reception time of the reflected wave based on the lower layer echo or the local peak; and (d) generate a cross-sectional image of the inspection object based on the reflected wave.



[[Category:G01N29/06]]