View source for 20240025009. POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY simplified abstract (Applied Materials, Inc.)

=POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:Aniruddh Jagdish Khanna of Fremont CA (US)|Aniruddh Jagdish Khanna of Fremont CA (US)]][[Category:Aniruddh Jagdish Khanna of Fremont CA (US)]]

[[:Category:Jason G. Fung of Santa Clara CA (US)|Jason G. Fung of Santa Clara CA (US)]][[Category:Jason G. Fung of Santa Clara CA (US)]]

[[:Category:Puneet Narendra Jawali of San Jose CA (US)|Puneet Narendra Jawali of San Jose CA (US)]][[Category:Puneet Narendra Jawali of San Jose CA (US)]]

[[:Category:Rajeev Bajaj of Fremont CA (US)|Rajeev Bajaj of Fremont CA (US)]][[Category:Rajeev Bajaj of Fremont CA (US)]]

[[:Category:Adam Wade Manzonie of Eagle ID (US)|Adam Wade Manzonie of Eagle ID (US)]][[Category:Adam Wade Manzonie of Eagle ID (US)]]

[[:Category:Nandan Baradanahalli Kenchappa of Santa Clara CA (US)|Nandan Baradanahalli Kenchappa of Santa Clara CA (US)]][[Category:Nandan Baradanahalli Kenchappa of Santa Clara CA (US)]]

[[:Category:Veera Raghava Reddy Kakireddy of Santa Clara CA (US)|Veera Raghava Reddy Kakireddy of Santa Clara CA (US)]][[Category:Veera Raghava Reddy Kakireddy of Santa Clara CA (US)]]

[[:Category:Joonho An of Pyeongtaek (KR)|Joonho An of Pyeongtaek (KR)]][[Category:Joonho An of Pyeongtaek (KR)]]

[[:Category:Jaeseok Kim of Cupertino CA (US)|Jaeseok Kim of Cupertino CA (US)]][[Category:Jaeseok Kim of Cupertino CA (US)]]

[[:Category:Mayu Yamamura of San Mateo CA (US)|Mayu Yamamura of San Mateo CA (US)]][[Category:Mayu Yamamura of San Mateo CA (US)]]

==POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240025009 titled 'POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY

==Simplified Explanation==

The abstract describes a patent application for polishing pads that have discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material. In one embodiment, the polishing pad includes multiple polishing elements, each with a polishing surface and sidewalls that create channels between them. Some of the polishing elements are made of a continuous phase of polymer material with regions of different porosity.

* The polishing pad has regions of varying porosity within a continuous phase of polymer material.
* The polishing elements have polishing surfaces and sidewalls that define channels between them.
* Some of the polishing elements are made of a continuous phase of polymer material with regions of different porosity.
* The second porosity is less than the first porosity.

Potential Applications:
* Polishing and finishing of various materials, such as metals, ceramics, and glass.
* Semiconductor manufacturing processes.
* Optical lens polishing.
* Precision machining and surface preparation.

Problems Solved:
* Provides improved control over the polishing process.
* Allows for selective polishing of different materials or surfaces.
* Reduces the risk of over-polishing or damage to delicate surfaces.
* Enhances the efficiency and effectiveness of polishing operations.

Benefits:
* Increased precision and accuracy in polishing operations.
* Reduced time and cost in achieving desired surface finishes.
* Enhanced surface quality and smoothness.
* Improved control over material removal rates.
* Versatility in polishing different materials and surfaces.


==Original Abstract Submitted==

polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. in one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.



[[Category:B24B37/20]]
[[Category:B24B37/04]]