View source for 20240009668. MICROFLUIDIC CHANNELS IN A SUBSTRATE WITH A SURFACE COVERED BY A LAYER STACK simplified abstract (GlobalFoundries U.S. Inc.)

=MICROFLUIDIC CHANNELS IN A SUBSTRATE WITH A SURFACE COVERED BY A LAYER STACK=


==Organization Name==

[[:Category:GlobalFoundries U.S. Inc.|GlobalFoundries U.S. Inc.]]


[[Category:GlobalFoundries U.S. Inc.]]

==Inventor(s)==

[[:Category:Ramsey Hazbun of Colchester VT (US)|Ramsey Hazbun of Colchester VT (US)]][[Category:Ramsey Hazbun of Colchester VT (US)]]

[[:Category:Siva P. Adusumilli of South Burlington VT (US)|Siva P. Adusumilli of South Burlington VT (US)]][[Category:Siva P. Adusumilli of South Burlington VT (US)]]

[[:Category:Mark Levy of Williston VT (US)|Mark Levy of Williston VT (US)]][[Category:Mark Levy of Williston VT (US)]]

[[:Category:Bartlomiej Jan Pawlak of Leuven (BE)|Bartlomiej Jan Pawlak of Leuven (BE)]][[Category:Bartlomiej Jan Pawlak of Leuven (BE)]]

==MICROFLUIDIC CHANNELS IN A SUBSTRATE WITH A SURFACE COVERED BY A LAYER STACK - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240009668 titled 'MICROFLUIDIC CHANNELS IN A SUBSTRATE WITH A SURFACE COVERED BY A LAYER STACK

==Simplified Explanation==

The patent application describes structures and methods for forming a microfluidic channel. The structure includes a semiconductor substrate with a trench and a layer stack on top. The layer stack consists of a first layer, a second layer between the first layer and the substrate, and an opening that goes through both layers to the trench. Inside the opening, there is a third layer made of semiconductor material that obstructs the opening and creates a cavity within the trench.

* The structure includes a semiconductor substrate with a trench and a layer stack on top.
* The layer stack consists of a first layer, a second layer, and an opening that penetrates through both layers to the trench.
* Inside the opening, there is a third layer made of semiconductor material.
* The third layer obstructs the opening and defines a cavity within the trench.

Potential applications of this technology:

* Microfluidic devices for biomedical research and diagnostics.
* Lab-on-a-chip systems for chemical analysis and drug discovery.
* Microscale fluid handling and manipulation in various industries, such as pharmaceuticals and biotechnology.

Problems solved by this technology:

* Provides a structure for microfluidic channels that can be integrated with semiconductor substrates.
* Enables precise control and manipulation of fluids at a microscale level.
* Facilitates the development of miniaturized and portable analytical devices.

Benefits of this technology:

* Improved efficiency and accuracy in fluid handling and analysis.
* Integration with existing semiconductor fabrication processes.
* Enables the development of compact and portable microfluidic devices.
* Potential for automation and high-throughput analysis.


==Original Abstract Submitted==

structures for a microfluidic channel and methods of forming a structure for a microfluidic channel. the structure comprises a semiconductor substrate including a trench and a layer stack on the semiconductor substrate. the layer stack includes a first layer, a second layer between the first layer and the semiconductor substrate, and an opening penetrating through the first layer and the second layer to the trench. the structure further comprises a third layer inside the opening in the layer stack. the third layer, which comprises a semiconductor material, obstructs the opening to define a cavity inside the trench.



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