View source for 18465803. LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE simplified abstract (NICHIA CORPORATION)

=LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE=


==Organization Name==

[[:Category:NICHIA CORPORATION|NICHIA CORPORATION]]


[[Category:NICHIA CORPORATION]]

==Inventor(s)==

[[:Category:Shota Takase of Tokushima-shi (JP)|Shota Takase of Tokushima-shi (JP)]][[Category:Shota Takase of Tokushima-shi (JP)]]

[[:Category:Masanori Uemura of Anan-shi (JP)|Masanori Uemura of Anan-shi (JP)]][[Category:Masanori Uemura of Anan-shi (JP)]]

[[:Category:Masakazu Sakamoto of Tokushima-shi (JP)|Masakazu Sakamoto of Tokushima-shi (JP)]][[Category:Masakazu Sakamoto of Tokushima-shi (JP)]]

[[:Category:Yosuke Noda of Tokushima-shi (JP)|Yosuke Noda of Tokushima-shi (JP)]][[Category:Yosuke Noda of Tokushima-shi (JP)]]

==LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18465803 titled 'LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE

==Simplified Explanation==

The abstract describes a patent application for a light-emitting module that includes light-emitting devices and a wiring substrate. Each light-emitting device has light-emitting elements and a package with a wiring region on its lower surface. The wiring substrate consists of a metal portion, an electrode portion, and an insulating portion, with first through holes defined. The wiring region of the light-emitting devices is bonded to the electrode portion of the wiring substrate.

* Light-emitting module with light-emitting devices and wiring substrate
* Light-emitting devices have light-emitting elements and packages with wiring regions
* Wiring substrate has metal, electrode, and insulating portions with first through holes
* Wiring region of light-emitting devices bonded to electrode portion of wiring substrate

== Potential Applications ==
The technology could be applied in:
* LED lighting systems
* Display panels
* Automotive lighting

== Problems Solved ==
This technology helps in:
* Efficiently connecting light-emitting devices to a wiring substrate
* Ensuring proper electrical connections
* Enhancing the overall performance of light-emitting modules

== Benefits ==
The benefits of this technology include:
* Improved reliability and durability of light-emitting modules
* Simplified manufacturing processes
* Enhanced electrical connectivity

== Potential Commercial Applications ==
The technology could find commercial applications in:
* Lighting industry
* Electronics manufacturing
* Automotive sector

== Possible Prior Art ==
One possible prior art could be the use of traditional wiring methods for connecting light-emitting devices, which may not be as efficient or reliable as the described technology.

=== Unanswered Questions ===

=== How does this technology compare to existing methods of connecting light-emitting devices to wiring substrates? ===
This article does not provide a direct comparison with existing methods, leaving the reader to wonder about the specific advantages or differences.

=== What specific industries or applications could benefit the most from this technology? ===
The article does not delve into the specific industries or applications that could see the most significant advantages from implementing this technology.


==Original Abstract Submitted==

A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.



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