View source for 18464258. COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM simplified abstract (FUJIFILM Corporation)

=COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM=


==Organization Name==

[[:Category:FUJIFILM Corporation|FUJIFILM Corporation]]


[[Category:FUJIFILM Corporation]]

==Inventor(s)==

[[:Category:Yuta Watanabe of Saitama-shi (JP)|Yuta Watanabe of Saitama-shi (JP)]][[Category:Yuta Watanabe of Saitama-shi (JP)]]

[[:Category:Yoshihiro Hayashi of Saitama-shi (JP)|Yoshihiro Hayashi of Saitama-shi (JP)]][[Category:Yoshihiro Hayashi of Saitama-shi (JP)]]

[[:Category:Nobuaki Suzuki of Saitama-shi (JP)|Nobuaki Suzuki of Saitama-shi (JP)]][[Category:Nobuaki Suzuki of Saitama-shi (JP)]]

[[:Category:Kouhei Awazu of Saitama-shi (JP)|Kouhei Awazu of Saitama-shi (JP)]][[Category:Kouhei Awazu of Saitama-shi (JP)]]

==COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18464258 titled 'COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM

==Simplified Explanation==

The abstract describes a cooling device for electronic apparatus that includes a heat sink with fins for heat radiation and an attachment mechanism for attaching the heat sink to the outer surface of the apparatus. The attachment mechanism overlaps with the fins.

* The cooling device includes a heat sink with fins for heat radiation.
* An attachment mechanism is provided to attach the heat sink to the outer surface of an electronic apparatus.
* The attachment mechanism overlaps with the fins of the heat sink.

== Potential Applications ==
* Cooling electronic devices such as computers, laptops, servers, or gaming consoles.
* Cooling power electronics, such as inverters or motor drives.
* Cooling LED lighting systems or other heat-generating components in various industries.

== Problems Solved ==
* Overheating of electronic devices due to insufficient cooling systems.
* Difficulty in attaching and detaching heat sinks securely to electronic apparatus.
* Limited space for heat sink attachment due to the presence of other components.

== Benefits ==
* Efficient heat dissipation to prevent overheating and improve device performance.
* Secure attachment mechanism ensures stability and reliability.
* Overlapping attachment mechanism allows for better utilization of limited space.


==Original Abstract Submitted==

There is provided a cooling device including: a heat sink on which a plurality of fins for heat radiation are formed; and an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins.



[[Category:G03B17/55]]
[[Category:H05K7/20]]
[[Category:H04N23/53]]
[[Category:H04N23/52]]