View source for 18456970. UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD simplified abstract (FUJIFILM Corporation)

=UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD=


==Organization Name==

[[:Category:FUJIFILM Corporation|FUJIFILM Corporation]]


[[Category:FUJIFILM Corporation]]

==Inventor(s)==

[[:Category:Junji Kawaguchi of Haibara-gun (JP)|Junji Kawaguchi of Haibara-gun (JP)]][[Category:Junji Kawaguchi of Haibara-gun (JP)]]

==UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18456970 titled 'UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCONNECTION BOARD, AND MANUFACTURING METHOD OF MULTILAYER INTERCONNECTION BOARD

==Simplified Explanation==

The present invention is an underfill composition for multilayer interconnection boards that offers excellent temporal stability and strong metal adhesiveness. The composition contains a polymer with a cyano group and a maleimide compound with a maleimide group. The cyano group content in 1 gram of the polymer ranges from 0.1 to 6 mmol/g.

* The underfill composition provides excellent temporal stability and good metal adhesiveness.
* It contains a polymer with a cyano group and a maleimide compound with a maleimide group.
* The cyano group content in the polymer is between 0.1 to 6 mmol/g.

== Potential Applications ==
* Manufacturing of multilayer interconnection boards
* Electronics industry
* Semiconductor packaging

== Problems Solved ==
* Lack of temporal stability in underfill compositions
* Weak metal adhesiveness in underfill compositions

== Benefits ==
* Improved temporal stability
* Strong metal adhesiveness
* Enhanced performance of multilayer interconnection boards


==Original Abstract Submitted==

An object of the present invention is to provide an underfill composition having excellent temporal stability and good metal adhesiveness, a coating film formed of the underfill composition, a cured film, a multilayer interconnection board, and a manufacturing method of a multilayer interconnection board. The underfill composition of the present invention is an underfill composition containing a polymer and a maleimide compound having a maleimide group, in which the polymer has a cyano group, and a content of the cyano group included in 1 g of the polymer is 0.1 to 6 mmol/g.



[[Category:C08K5/3415]]
[[Category:H01L23/00]]
[[Category:C08L33/20]]