View source for 18456652. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)

=SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:Kioxia Corporation|Kioxia Corporation]]


[[Category:Kioxia Corporation]]

==Inventor(s)==

[[:Category:Fuyuma Ito of Yokkaichi Mie (JP)|Fuyuma Ito of Yokkaichi Mie (JP)]][[Category:Fuyuma Ito of Yokkaichi Mie (JP)]]

[[:Category:Jun Takagi of Yokkaichi Mie (JP)|Jun Takagi of Yokkaichi Mie (JP)]][[Category:Jun Takagi of Yokkaichi Mie (JP)]]

[[:Category:Ai Mori of Yokkaichi Mie (JP)|Ai Mori of Yokkaichi Mie (JP)]][[Category:Ai Mori of Yokkaichi Mie (JP)]]

[[:Category:Yosuke Maruyama of Yokkaichi Mie (JP)|Yosuke Maruyama of Yokkaichi Mie (JP)]][[Category:Yosuke Maruyama of Yokkaichi Mie (JP)]]

[[:Category:Yuya Akeboshi of Yokkaichi Mie (JP)|Yuya Akeboshi of Yokkaichi Mie (JP)]][[Category:Yuya Akeboshi of Yokkaichi Mie (JP)]]

[[:Category:Takashi Watanabe of Yokkaichi Mie (JP)|Takashi Watanabe of Yokkaichi Mie (JP)]][[Category:Takashi Watanabe of Yokkaichi Mie (JP)]]

[[:Category:Hiroyasu Iimori of Nagoya Aichi (JP)|Hiroyasu Iimori of Nagoya Aichi (JP)]][[Category:Hiroyasu Iimori of Nagoya Aichi (JP)]]

==SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18456652 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

==Simplified Explanation==

The patent application describes a substrate processing apparatus with roller pairs for rotating substrates, circulation grooves for supplying chemical solution, rinse solution, and drying fluid to the substrates.

* The substrate processing apparatus includes roller pairs for rotating substrates side by side with a predetermined interval.
* The apparatus has circulation grooves for supplying chemical solution, rinse solution, and drying fluid to the outer peripheral portions of the substrates.

== Potential Applications ==
This technology could be used in semiconductor manufacturing, flat panel display production, and other industries requiring precise substrate processing.

== Problems Solved ==
This technology solves the problem of efficiently and effectively processing multiple substrates in a controlled manner, ensuring uniformity and quality in the final product.

== Benefits ==
The benefits of this technology include improved processing efficiency, enhanced substrate quality, and reduced chemical waste in the manufacturing process.

== Potential Commercial Applications ==
Potential commercial applications of this technology include semiconductor fabrication facilities, display panel manufacturing plants, and other high-tech industries requiring advanced substrate processing equipment.

== Possible Prior Art ==
One possible prior art for this technology could be similar substrate processing apparatus with circulation grooves, but with different configurations or functionalities.

== Unanswered Questions ==
=== How does this technology compare to traditional substrate processing methods? ===
This article does not provide a direct comparison between this technology and traditional substrate processing methods. It would be interesting to know the specific advantages and disadvantages of this new apparatus compared to existing techniques.

=== What are the maintenance requirements for this substrate processing apparatus? ===
The article does not mention the maintenance requirements for this technology. Understanding the maintenance procedures and costs associated with this apparatus would be crucial for potential users.


==Original Abstract Submitted==

A substrate processing apparatus includes: a plurality of roller pairs configured to place a plurality of substrates, respectively, wherein the substrates are arranged side by side in a horizontal direction with a predetermined interval, and rotate the plurality of substrates, respectively, in a circumferential direction; a first, second, and third circulation groove that are disposed along outer peripheral portions of each of the plurality of substrates; a chemical solution supplier configured to supply a chemical solution to the outer peripheral portions of the plurality of substrates through the first circulation groove; a rinse solution supplier configured to supply a rinse solution to the outer peripheral portions of the plurality of substrates through the second circulation groove; and a fluid supplier configured to supply a fluid for drying the rinse solution to the outer peripheral portions of the plurality of substrates through the third circulation groove.



[[Category:H01L21/67]]
[[Category:H01L21/311]]
[[Category:H01L21/3213]]