View source for 18400761. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)

=MICROELECTRONIC STRUCTURES INCLUDING BRIDGES=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Omkar G. Karhade of Chandler AZ (US)|Omkar G. Karhade of Chandler AZ (US)]][[Category:Omkar G. Karhade of Chandler AZ (US)]]

[[:Category:Edvin Cetegen of Chandler AZ (US)|Edvin Cetegen of Chandler AZ (US)]][[Category:Edvin Cetegen of Chandler AZ (US)]]

[[:Category:Anurag Tripathi of Gilbert AZ (US)|Anurag Tripathi of Gilbert AZ (US)]][[Category:Anurag Tripathi of Gilbert AZ (US)]]

[[:Category:Nitin A. Deshpande of Chandler AZ (US)|Nitin A. Deshpande of Chandler AZ (US)]][[Category:Nitin A. Deshpande of Chandler AZ (US)]]

==MICROELECTRONIC STRUCTURES INCLUDING BRIDGES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18400761 titled 'MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

==Simplified Explanation==

The patent application describes microelectronic structures with bridges, related assemblies, and methods. A microelectronic structure may consist of a substrate and a bridge.

* Microelectronic structures with bridges
* Assemblies incorporating the described structures
* Methods for manufacturing and utilizing these structures

== Potential Applications ==
The technology could be applied in:
* Microelectronics
* Nanotechnology
* Semiconductor industry

== Problems Solved ==
The technology addresses:
* Improved structural integrity
* Enhanced electrical connectivity
* Miniaturization of electronic devices

== Benefits ==
The technology offers:
* Increased efficiency in electronic components
* Enhanced performance in microelectronic devices
* Potential for smaller and more powerful devices

== Potential Commercial Applications ==
The technology could be utilized in:
* Consumer electronics
* Medical devices
* Aerospace industry

== Possible Prior Art ==
Prior art in microelectronic structures with bridges may include:
* Existing patents on similar structures
* Research papers on bridge structures in microelectronics

== Unanswered Questions ==
=== How does the technology compare to existing bridge structures in microelectronics? ===
The article does not provide a direct comparison to other bridge structures in the field.

=== What are the specific manufacturing methods used to create the bridges in the microelectronic structures? ===
The article does not delve into the detailed manufacturing processes involved in creating the bridges.


==Original Abstract Submitted==

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.



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