View source for 18387351. FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)

=FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Bumhee Bae of Suwon-si (KR)|Bumhee Bae of Suwon-si (KR)]][[Category:Bumhee Bae of Suwon-si (KR)]]

[[:Category:Kiman Kim of Suwon-si (KR)|Kiman Kim of Suwon-si (KR)]][[Category:Kiman Kim of Suwon-si (KR)]]

[[:Category:Junggil Kim of Suwon-si (KR)|Junggil Kim of Suwon-si (KR)]][[Category:Junggil Kim of Suwon-si (KR)]]

[[:Category:Younghun Seong of Suwon-si (KR)|Younghun Seong of Suwon-si (KR)]][[Category:Younghun Seong of Suwon-si (KR)]]

[[:Category:Jeongnam Cheon of Suwon-si (KR)|Jeongnam Cheon of Suwon-si (KR)]][[Category:Jeongnam Cheon of Suwon-si (KR)]]

==FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18387351 titled 'FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME

==Simplified Explanation==

The patent application describes a flexible circuit board and a foldable electronic device with a highly bendable region between two multi-layer regions.

* Structure includes stacked copper clad laminates (CCLs) in the first and second multi-layer regions.
* Highly bendable region has a single CCL stacked from one CCL in the first and second multi-layer regions.
* Single CCL configured for transmitting a single RF signal with ground wires and sub wires.

Potential Applications:
* Foldable smartphones and tablets
* Wearable technology
* Flexible displays

Problems Solved:
* Increased durability of foldable electronic devices
* Improved flexibility in design and form factor
* Enhanced signal transmission in bendable devices

Benefits:
* Greater versatility in electronic device design
* Longer lifespan for foldable devices
* Improved signal quality in flexible electronics


==Original Abstract Submitted==

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.



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