View source for 18303659. SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)

=SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company Limited|Taiwan Semiconductor Manufacturing Company Limited]]


[[Category:Taiwan Semiconductor Manufacturing Company Limited]]

==Inventor(s)==

[[:Category:Harry-Hak-Lay Chuang of Zhubei City (TW)|Harry-Hak-Lay Chuang of Zhubei City (TW)]][[Category:Harry-Hak-Lay Chuang of Zhubei City (TW)]]

[[:Category:Yuan-Jen Lee of Hsinchu (TW)|Yuan-Jen Lee of Hsinchu (TW)]][[Category:Yuan-Jen Lee of Hsinchu (TW)]]

[[:Category:Kuo-An Liu of Hsinchu City (TW)|Kuo-An Liu of Hsinchu City (TW)]][[Category:Kuo-An Liu of Hsinchu City (TW)]]

[[:Category:Ching-Huang Wang of Pingjhen City (TW)|Ching-Huang Wang of Pingjhen City (TW)]][[Category:Ching-Huang Wang of Pingjhen City (TW)]]

[[:Category:C.T. Kuo of Hsinchu City (TW)|C.T. Kuo of Hsinchu City (TW)]][[Category:C.T. Kuo of Hsinchu City (TW)]]

[[:Category:Tien-Wei Chiang of Taipei City (TW)|Tien-Wei Chiang of Taipei City (TW)]][[Category:Tien-Wei Chiang of Taipei City (TW)]]

==SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18303659 titled 'SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME

==Simplified Explanation==

The patent application describes devices and methods for forming a shielding assembly that includes a magnetic shield surrounding chip package structures sensitive to magnetic interference (MI) and electromagnetic interference (EMI). The shield is made of magnetic shielding materials such as silicon steel or Mu-metal, providing both EMI and MI protection to multiple chip package structures with varying susceptibilities to interference.

* Magnetic shield made of silicon steel or Mu-metal
* Provides EMI and MI protection to chip package structures
* Surrounds sidewalls and top surfaces of sensitive chip package structures

== Potential Applications ==
The technology can be applied in various electronic devices where protection against both electromagnetic and magnetic interference is required, such as in medical devices, communication equipment, and automotive electronics.

== Problems Solved ==
1. Protects sensitive chip package structures from both EMI and MI interference.
2. Ensures reliable performance of electronic devices in environments with high interference levels.

== Benefits ==
1. Enhanced reliability and performance of electronic devices.
2. Cost-effective solution for mitigating EMI and MI issues in multiple chip package structures.

== Potential Commercial Applications ==
"EMI and MI Shielding Technology for Electronic Devices"

== Possible Prior Art ==
There are existing solutions for EMI and MI shielding in electronic devices, but the use of specific materials like silicon steel or Mu-metal for shielding multiple chip package structures with varying susceptibilities to interference may be a novel aspect of this technology.

=== Unanswered Questions ===

=== How does the shielding material impact the overall size and weight of the electronic device? ===
The article does not address how the choice of shielding material affects the physical characteristics of the device.

=== Are there any limitations to the effectiveness of the shielding in extreme interference environments? ===
The article does not discuss the potential limitations of the shielding technology in highly intense interference environments.


==Original Abstract Submitted==

Devices and method for forming a shielding assembly including a first chip package structure sensitive to magnetic interference (MI), a second chip package structure sensitive to electromagnetic interference (EMI), and a shield surrounding sidewalls and top surfaces of the first chip package structure and the second chip package structure, in which the shield is a magnetic shielding material. In some embodiments, the shield may include silicon steel, in some embodiments, the shield may include Mu-metal. The silicon-steel-based or Mu-metal-based shield may provide both EMI and MI protection to multiple chip package structures with various susceptibilities to EMI and MI.



[[Category:H01L23/552]]
[[Category:H01L25/00]]
[[Category:H01L25/065]]
[[Category:H10B80/00]]