View source for 18255037. SUBSTRATE FOR CARRYING WAFER simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)

=SUBSTRATE FOR CARRYING WAFER=


==Organization Name==

[[:Category:NIPPON TELEGRAPH AND TELEPHONE CORPORATION|NIPPON TELEGRAPH AND TELEPHONE CORPORATION]]


[[Category:NIPPON TELEGRAPH AND TELEPHONE CORPORATION]]

==Inventor(s)==

[[:Category:Shoko Tatsumi of Musashino-shi, Tokyo (JP)|Shoko Tatsumi of Musashino-shi, Tokyo (JP)]][[Category:Shoko Tatsumi of Musashino-shi, Tokyo (JP)]]

[[:Category:Masahiro Nada of Musashino-shi, Tokyo (JP)|Masahiro Nada of Musashino-shi, Tokyo (JP)]][[Category:Masahiro Nada of Musashino-shi, Tokyo (JP)]]

[[:Category:Yasuhiko Nakanishi of Musashino-shi, Tokyo (JP)|Yasuhiko Nakanishi of Musashino-shi, Tokyo (JP)]][[Category:Yasuhiko Nakanishi of Musashino-shi, Tokyo (JP)]]

==SUBSTRATE FOR CARRYING WAFER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18255037 titled 'SUBSTRATE FOR CARRYING WAFER

==Simplified Explanation==

The present disclosure is for a wafer carrier substrate designed to carry a wafer with multiple chips, each containing elements to be measured. The substrate includes a vacuuming hole for securing the wafer, a wafer alignment guide for positioning the wafer correctly, and a mark for determining probe contact position.

* Vacuuming hole for securing the wafer
* Wafer alignment guide for correct positioning
* Mark for determining probe contact position

== Potential Applications ==
This technology could be applied in semiconductor manufacturing processes where precise measurements of elements within chips are required.

== Problems Solved ==
This innovation solves the issue of identifying specific shots on a semiconductor wafer without the need for additional processing.

== Benefits ==
The wafer carrier substrate simplifies the measurement process by providing clear positioning and contact points for probes.

== Potential Commercial Applications ==
This technology could be utilized in semiconductor fabrication facilities to improve efficiency and accuracy in chip testing processes.

== Possible Prior Art ==
There may be prior art related to wafer carrier substrates with similar features for chip testing purposes.

== Unanswered Questions ==
=== How does this technology compare to existing wafer carrier substrates in terms of accuracy and efficiency? ===
This article does not provide a direct comparison with existing technologies in the market.

=== Are there any limitations to the size or type of wafer that can be used with this substrate? ===
The article does not address any potential limitations regarding the size or type of wafers compatible with this substrate.


==Original Abstract Submitted==

The present disclosure is to provide a wafer carrier substrate for carrying a wafer on which a plurality of chips is formed, elements to be measured being built in the plurality of chips. The wafer carrier substrate includes: a vacuuming hole for vacuuming of the wafer placed on the wafer carrier substrate; a wafer alignment guide for determining a predetermined position of the wafer placed on the wafer carrier substrate; and a mark for determining a probe contact position. It is possible to recognize a specific shot, without any additional processing of the semiconductor wafer.



[[Category:H01L21/677]]
[[Category:H01L21/68]]
[[Category:H01L21/683]]