View source for 18184559. SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE simplified abstract (SK hynix Inc.)

=SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE=


==Organization Name==

[[:Category:SK hynix Inc.|SK hynix Inc.]]


[[Category:SK hynix Inc.]]

==Inventor(s)==

[[:Category:Bok Gyu Min of Icheon-si Gyeonggi-do (KR)|Bok Gyu Min of Icheon-si Gyeonggi-do (KR)]][[Category:Bok Gyu Min of Icheon-si Gyeonggi-do (KR)]]

[[:Category:Beom Sang Cho of Icheon-si Gyeonggi-do (KR)|Beom Sang Cho of Icheon-si Gyeonggi-do (KR)]][[Category:Beom Sang Cho of Icheon-si Gyeonggi-do (KR)]]

==SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18184559 titled 'SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK STRUCTURE INCLUDING SEMICONDUCTOR DIES STACKED ON THE SUBSTRATE

==Simplified Explanation==

The abstract describes a substrate with specific alignment and position marks for die stacking.

* The substrate includes a first die alignment mark with a cross shape, consisting of a vertical bar and a horizontal bar intersecting perpendicularly.
* The substrate also includes a first die position mark with a main position mark and a branch position mark, each with different areas.

== Potential Applications ==
The technology described in the patent application could be used in semiconductor manufacturing for precise alignment and positioning of dies in a stack.

== Problems Solved ==
This technology solves the problem of accurately aligning and positioning multiple dies in a stack during the manufacturing process.

== Benefits ==
The benefits of this technology include improved efficiency in die stacking processes, leading to higher yields and better overall performance of semiconductor devices.

== Potential Commercial Applications ==
A potential commercial application of this technology could be in the production of advanced microprocessors and memory chips for various electronic devices.

== Possible Prior Art ==
One possible prior art could be the use of similar alignment and position marks in the semiconductor industry for die stacking processes.

=== Unanswered Questions ===

=== How does this technology compare to existing die alignment methods in terms of accuracy and efficiency? ===
This article does not provide a direct comparison to existing die alignment methods, leaving the reader to wonder about the advantages of this new technology over current practices.

=== What impact could this technology have on the cost of semiconductor manufacturing? ===
The article does not address the potential cost implications of implementing this technology in semiconductor manufacturing processes, leaving a gap in understanding the overall economic impact.


==Original Abstract Submitted==

A substrate includes: a first die alignment mark and a first die position mark defining a die stack region. The first die alignment mark has substantially a cross shape having substantially a vertical bar and substantially a horizontal bar intersecting each other substantially perpendicularly, and the first die position mark includes a first main position mark having a first area and a first branch position mark having a second area different from the first area.



[[Category:H01L23/544]]
[[Category:H01L25/065]]