View source for 18151033. Signal Communication Through Optical-Engine Based Interconnect Component simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=Signal Communication Through Optical-Engine Based Interconnect Component=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Hsing-Kuo Hsia of Jhubei City (TW)|Hsing-Kuo Hsia of Jhubei City (TW)]][[Category:Hsing-Kuo Hsia of Jhubei City (TW)]]

[[:Category:Chen-Hua Yu of Hsinchu (TW)|Chen-Hua Yu of Hsinchu (TW)]][[Category:Chen-Hua Yu of Hsinchu (TW)]]

[[:Category:Chih-Wei Tseng of Hsinchu (TW)|Chih-Wei Tseng of Hsinchu (TW)]][[Category:Chih-Wei Tseng of Hsinchu (TW)]]

[[:Category:Jui Lin Chao of New Taipei City (TW)|Jui Lin Chao of New Taipei City (TW)]][[Category:Jui Lin Chao of New Taipei City (TW)]]

==Signal Communication Through Optical-Engine Based Interconnect Component - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18151033 titled 'Signal Communication Through Optical-Engine Based Interconnect Component

==Simplified Explanation==

The method described in the patent application involves encapsulating two device dies in an encapsulant, forming an interconnect structure that electrically connects to the device dies, creating a waveguide in the interconnect structure, and bonding an optical-engine based interconnect component to the structure to form a signal path between the device dies.

* Encapsulating two device dies in an encapsulant
* Forming an interconnect structure to connect to the device dies
* Creating a waveguide within the interconnect structure
* Bonding an optical-engine based interconnect component to the structure
* Establishing a signal path between the device dies

== Potential Applications ==
* High-speed data transmission
* Optical communication systems
* Integrated circuit packaging

== Problems Solved ==
* Improving signal transmission speed and efficiency
* Enhancing data processing capabilities
* Reducing signal interference

== Benefits ==
* Increased data transfer rates
* Enhanced signal reliability
* Compact and efficient design


==Original Abstract Submitted==

A method includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over and electrically connecting to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical-engine based interconnect component is bonded to the interconnect structure. The optical-engine based interconnect component forms a part of a signal path that connects the first device die to the second device die.



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