View source for 18127531. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Youngja Kim of Suwon-si (KR)|Youngja Kim of Suwon-si (KR)]][[Category:Youngja Kim of Suwon-si (KR)]]

[[:Category:Donguk Kwon of Suwon-si (KR)|Donguk Kwon of Suwon-si (KR)]][[Category:Donguk Kwon of Suwon-si (KR)]]

[[:Category:Youngmin Lee of Suwon-si (KR)|Youngmin Lee of Suwon-si (KR)]][[Category:Youngmin Lee of Suwon-si (KR)]]

[[:Category:Byungkeun Kang of Suwon-si (KR)|Byungkeun Kang of Suwon-si (KR)]][[Category:Byungkeun Kang of Suwon-si (KR)]]

[[:Category:Gongmyeong Kim of Suwon-si (KR)|Gongmyeong Kim of Suwon-si (KR)]][[Category:Gongmyeong Kim of Suwon-si (KR)]]

[[:Category:Chaein Moon of Suwon-si (KR)|Chaein Moon of Suwon-si (KR)]][[Category:Chaein Moon of Suwon-si (KR)]]

==SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18127531 titled 'SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

==Simplified Explanation==

The abstract describes a method of manufacturing an electronic device using a substrate with mounting regions for electronic components. Vapor passage holes are formed in the substrate, and the electronic components are disposed on the substrate using bumps. A first heat transfer fluid is heated to generate a second heat transfer fluid in a vapor state. At least a portion of the second heat transfer fluid is supplied through the vapor passage holes, and the bumps are soldered using the second heat transfer fluid in the vapor state.

* The method involves providing a substrate with mounting regions for electronic components.
* Vapor passage holes are formed in the substrate to allow the flow of heat transfer fluid.
* Electronic components are mounted on the substrate using bumps.
* A first heat transfer fluid is heated to generate a second heat transfer fluid in a vapor state.
* The second heat transfer fluid in the vapor state is supplied through the vapor passage holes.
* The bumps are soldered using the second heat transfer fluid in the vapor state.

Potential applications of this technology:
* Manufacturing of electronic devices such as smartphones, tablets, and computers.
* Production of circuit boards for various electronic systems.
* Assembly of electronic components in automotive and aerospace industries.

Problems solved by this technology:
* Efficient heat transfer during the soldering process.
* Improved reliability and performance of electronic devices.
* Enhanced manufacturing process for electronic components.

Benefits of this technology:
* Faster and more efficient soldering of electronic components.
* Improved heat dissipation and thermal management.
* Enhanced reliability and longevity of electronic devices.
* Cost-effective manufacturing process for electronic components.


==Original Abstract Submitted==

A method of manufacturing an electronic device, includes: providing a substrate including a plurality of mounting regions on which electronic components are mounted respectively; forming a plurality of vapor passage holes that penetrate the substrate; disposing the electronic components on the substrate via bumps; heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state; supplying at least a portion of the second heat transfer fluid in the vapor state through the vapor passage holes of the substrate; and soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state.



[[Category:H05K3/34]]
[[Category:H01L23/00]]