View source for 18108657. MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)

=MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE=


==Organization Name==

[[:Category:SK hynix Inc.|SK hynix Inc.]]


[[Category:SK hynix Inc.]]

==Inventor(s)==

[[:Category:Won Ha Choi of Gyeonggi-do (KR)|Won Ha Choi of Gyeonggi-do (KR)]][[Category:Won Ha Choi of Gyeonggi-do (KR)]]

[[:Category:Han Suk Ko of Gyeonggi-do (KR)|Han Suk Ko of Gyeonggi-do (KR)]][[Category:Han Suk Ko of Gyeonggi-do (KR)]]

[[:Category:Uksong Kang of Gyeonggi-do (KR)|Uksong Kang of Gyeonggi-do (KR)]][[Category:Uksong Kang of Gyeonggi-do (KR)]]

==MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18108657 titled 'MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE

==Simplified Explanation==

The abstract of the patent application describes a memory package that includes a substrate, a memory chip, and a buffer chip integrated over the substrate. The memory chip contains an interface modulator embedded within, specifically a serializing modulator with a multi-level amplitude modulator.

* The memory package includes a substrate, memory chip, and buffer chip integrated over the substrate.
* The memory chip contains an interface modulator embedded within, which is a serializing modulator with a multi-level amplitude modulator.

== Potential Applications ==
This technology could be applied in:
* High-speed data storage devices
* Networking equipment
* Embedded systems

== Problems Solved ==
This technology helps address:
* Data transfer speed limitations
* Signal integrity issues
* Integration challenges in memory packages

== Benefits ==
The benefits of this technology include:
* Improved data transfer rates
* Enhanced signal quality
* Simplified integration processes

== Potential Commercial Applications ==
* Data centers
* Telecommunications industry
* Consumer electronics market

== Possible Prior Art ==
One possible prior art could be the use of interface modulators in memory packages for improving data transfer speeds and signal quality.

== Unanswered Questions ==

=== How does the interface modulator impact power consumption in the memory package? ===
The abstract does not provide information on the power consumption implications of the interface modulator.

=== Are there any specific industry standards or protocols that this technology aligns with? ===
The abstract does not mention any industry standards or protocols that the technology may adhere to.


==Original Abstract Submitted==

A single memory package includes: a substrate; and a memory chip and a buffer chip that are integrated over the substrate, wherein the memory chip includes an interface modulator embedded therein, and the interface modulator is a serializing modulator including a multi-level amplitude modulator.



[[Category:H10B80/00]]
[[Category:G11C5/06]]
[[Category:H01L23/00]]
[[Category:H01L23/48]]