View source for 18081102. WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Byung Hoon Ko of Suwon-si (KR)|Byung Hoon Ko of Suwon-si (KR)]][[Category:Byung Hoon Ko of Suwon-si (KR)]]

[[:Category:Seung Woo Noh of Suwon-si (KR)|Seung Woo Noh of Suwon-si (KR)]][[Category:Seung Woo Noh of Suwon-si (KR)]]

[[:Category:Sang Yun Park of Suwon-si (KR)|Sang Yun Park of Suwon-si (KR)]][[Category:Sang Yun Park of Suwon-si (KR)]]

[[:Category:Jin Woo Choi of Suwon-si (KR)|Jin Woo Choi of Suwon-si (KR)]][[Category:Jin Woo Choi of Suwon-si (KR)]]

[[:Category:Youn Ho Kim of Suwon-si (KR)|Youn Ho Kim of Suwon-si (KR)]][[Category:Youn Ho Kim of Suwon-si (KR)]]

==WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18081102 titled 'WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR

==Simplified Explanation==

The abstract describes a wafer-type sensor for wafer alignment, which includes a dummy wafer, a sensor module placed in the dummy wafer, and a processor that controls the sensor module to measure the distance between a side surface of the dummy wafer and a ring formed around the periphery of an electrostatic chuck. The measurement is based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.

* The sensor is designed for wafer alignment.
* It includes a dummy wafer, a sensor module, and a processor.
* The sensor module is placed inside the dummy wafer.
* The processor controls the sensor module to measure the distance between the dummy wafer and a ring around the electrostatic chuck.
* The measurement is based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.

Potential Applications:
* Semiconductor manufacturing: The wafer-type sensor can be used in semiconductor manufacturing processes to ensure accurate alignment of wafers, improving the quality and yield of semiconductor devices.
* Nanotechnology: The sensor can be utilized in nanotechnology applications where precise alignment of wafers is crucial for the fabrication of nanoscale devices.

Problems Solved:
* Alignment accuracy: The wafer-type sensor solves the problem of accurately aligning wafers by providing a measurement of the distance between the dummy wafer and the ring around the electrostatic chuck.
* Process optimization: By ensuring precise alignment, the sensor helps optimize manufacturing processes, reducing errors and improving overall efficiency.

Benefits:
* Improved yield: Accurate wafer alignment leads to improved yield in semiconductor manufacturing, reducing the number of defective devices and increasing overall productivity.
* Cost savings: The sensor helps minimize errors and optimize processes, resulting in cost savings by reducing material waste and improving operational efficiency.
* Enhanced quality control: The wafer-type sensor enables better quality control by ensuring accurate alignment, leading to higher quality semiconductor devices.


==Original Abstract Submitted==

A wafer-type sensor for wafer alignment includes a dummy wafer; a sensor module disposed in the dummy wafer, and a processor configured to control the sensor module to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.



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