View source for 18070825. INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)

=INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Taeyang Na of Suwon-si (KR)|Taeyang Na of Suwon-si (KR)]][[Category:Taeyang Na of Suwon-si (KR)]]

[[:Category:Kicheol Bae of Suwon-si (KR)|Kicheol Bae of Suwon-si (KR)]][[Category:Kicheol Bae of Suwon-si (KR)]]

[[:Category:Chulwoo Park of Suwon-si (KR)|Chulwoo Park of Suwon-si (KR)]][[Category:Chulwoo Park of Suwon-si (KR)]]

==INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18070825 titled 'INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF

==Simplified Explanation==

==Abstract Explanation==
The abstract describes a patent application for an integrated circuit package and a method for manufacturing it. The method involves attaching elements to a substrate, molding the substrate, grinding the mold, attaching additional elements and connection members to the substrate, and attaching an interposer substrate with landing pads for electrical connection to a printed circuit board.

* The patent application is for an integrated circuit package and a method for manufacturing it.
* The method involves attaching elements to a substrate.
* The substrate is then molded using a mold.
* The mold is then ground.
* Additional elements and connection members are attached to the substrate.
* An interposer substrate with landing pads for electrical connection is attached to the substrate.

==Potential Applications==
* Electronic devices
* Integrated circuits
* Printed circuit boards

==Problems Solved==
* Efficient manufacturing of integrated circuit packages
* Improved electrical connection between components
* Enhanced functionality of electronic devices

==Benefits==
* Simplified manufacturing process
* Stronger electrical connections
* Increased functionality and performance of electronic devices


==Original Abstract Submitted==

Various embodiments of the disclosure relate to an integrated circuit package, an electronic device including same, and a manufacturing method therefor, the method comprising: attaching at least one first element to a first surface of a substrate; molding the first surface using a first mold; grinding the first mold; attaching at least one second element and at least one connection member comprising a conductive material to a second surface of the substrate; and attaching an interposer substrate including landing pads for an electrical connection with a printed circuit board included in an electronic device to the second surface of the substrate.



[[Category:H01L23/498]]
[[Category:H01L25/16]]
[[Category:H01L23/31]]
[[Category:H01L21/48]]
[[Category:H01L21/56]]