View source for 17956793. COMPONENT COOLER WITH MULTIPLE FLUID PATHS simplified abstract (ADVANCED MICRO DEVICES, INC.)

=COMPONENT COOLER WITH MULTIPLE FLUID PATHS=


==Organization Name==

[[:Category:ADVANCED MICRO DEVICES, INC.|ADVANCED MICRO DEVICES, INC.]]


[[Category:ADVANCED MICRO DEVICES, INC.]]

==Inventor(s)==

[[:Category:CHRISTOPHER M. Jaggers of AUSTIN TX (US)|CHRISTOPHER M. Jaggers of AUSTIN TX (US)]][[Category:CHRISTOPHER M. Jaggers of AUSTIN TX (US)]]

[[:Category:ROBERT EDWARD Radke of AUSTIN TX (US)|ROBERT EDWARD Radke of AUSTIN TX (US)]][[Category:ROBERT EDWARD Radke of AUSTIN TX (US)]]

[[:Category:CHRISTOPHER M. Helberg of AUSTIN TX (US)|CHRISTOPHER M. Helberg of AUSTIN TX (US)]][[Category:CHRISTOPHER M. Helberg of AUSTIN TX (US)]]

==COMPONENT COOLER WITH MULTIPLE FLUID PATHS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17956793 titled 'COMPONENT COOLER WITH MULTIPLE FLUID PATHS

==Simplified Explanation==

The apparatus described in the patent application is designed to cool components by using a manifold to split a single fluid flow into two separate flows that are directed to different heat transfer elements.

* The apparatus includes a first heat transfer element that is connected to a heat-generating component.
* A second heat transfer element is also connected to the same heat-generating component.
* A manifold is used to divide a single fluid flow of a heat transfer medium into two separate flows.
* One flow is directed to the first heat transfer element, while the other flow is directed to the second heat transfer element.

== Potential Applications ==
The technology described in this patent application could be applied in various industries where cooling of components is essential, such as:
* Electronics manufacturing
* Automotive industry
* Aerospace industry

== Problems Solved ==
This technology helps to efficiently cool heat-generating components by providing dedicated cooling to each element, preventing overheating and potential damage.

== Benefits ==
The benefits of this technology include:
* Improved cooling efficiency
* Enhanced component longevity
* Reduced risk of overheating and malfunctions

== Potential Commercial Applications ==
With its ability to efficiently cool components, this technology could be used in various commercial applications, such as:
* Data centers
* Electric vehicles
* Industrial machinery

== Possible Prior Art ==
One possible prior art for this technology could be similar cooling systems used in the automotive industry or data centers. However, the specific design and method of splitting the fluid flow may be unique to this patent application.

=== Unanswered Questions ===

=== How does this technology compare to traditional cooling methods? ===
This article does not provide a direct comparison between this technology and traditional cooling methods. Further research or testing may be needed to determine the efficiency and effectiveness of this apparatus compared to existing cooling systems.

=== What is the potential impact of this technology on energy consumption? ===
The article does not address the potential impact of this technology on energy consumption. It would be important to understand if this apparatus could lead to energy savings or increased energy usage in practical applications.


==Original Abstract Submitted==

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.



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