View source for 17937487. SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:MYUNG-SOO Hwang of Seoul (KR)|MYUNG-SOO Hwang of Seoul (KR)]][[Category:MYUNG-SOO Hwang of Seoul (KR)]]

[[:Category:KWANGSUB Yoon of Yongin-si (KR)|KWANGSUB Yoon of Yongin-si (KR)]][[Category:KWANGSUB Yoon of Yongin-si (KR)]]

==SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17937487 titled 'SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME

==Simplified Explanation==

The abstract describes a spin coater used in semiconductor fabrication, which includes a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing consists of a lower housing with a solvent storage groove and an upper housing with a nozzle insert hole and a gas supply hole.

* The spin coater is used in the process of semiconductor fabrication.
* It includes a spin chuck, nozzle, nozzle housing, purge gas supply, and organic solvent supply.
* The nozzle housing has a lower housing with a solvent storage groove and an upper housing with a nozzle insert hole and a gas supply hole.
* The organic solvent is stored in the solvent storage groove.
* The nozzle is inserted into the nozzle insert hole and connected to the gas supply hole.
* The spin coater is used to apply a thin layer of organic solvent onto a semiconductor wafer.
* The purge gas supply is used to remove excess solvent from the wafer surface.

== Potential Applications ==
* Semiconductor fabrication processes
* Thin film deposition

== Problems Solved ==
* Efficient and controlled application of organic solvent onto semiconductor wafers
* Removal of excess solvent from the wafer surface

== Benefits ==
* Improved quality and consistency of semiconductor fabrication
* Reduced waste of organic solvent
* Increased efficiency in the fabrication process


==Original Abstract Submitted==

Systems and methods for semiconductor fabrication are described. A spin coater comprises a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing includes a lower housing including a solvent storage groove in which the organic solvent is stored, and an upper housing on the lower housing. The upper housing includes a nozzle insert hole on the solvent storage groove and receives the nozzle, and a gas supply hole connected to one side of the nozzle insert hole.



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