View source for 17892846. INTEGRATION OF SOLAR CELL AND IMAGE SENSOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=INTEGRATION OF SOLAR CELL AND IMAGE SENSOR=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Feng-Chien Hsieh of Pingtung County (TW)|Feng-Chien Hsieh of Pingtung County (TW)]][[Category:Feng-Chien Hsieh of Pingtung County (TW)]]

[[:Category:Yun-Wei Cheng of Taipei City (TW)|Yun-Wei Cheng of Taipei City (TW)]][[Category:Yun-Wei Cheng of Taipei City (TW)]]

[[:Category:Ping Kuan Chang of Hsinchu (TW)|Ping Kuan Chang of Hsinchu (TW)]][[Category:Ping Kuan Chang of Hsinchu (TW)]]

[[:Category:Kuo-Cheng Lee of Tainan City (TW)|Kuo-Cheng Lee of Tainan City (TW)]][[Category:Kuo-Cheng Lee of Tainan City (TW)]]

[[:Category:Cheng-Ming Wu of Tainan City (TW)|Cheng-Ming Wu of Tainan City (TW)]][[Category:Cheng-Ming Wu of Tainan City (TW)]]

==INTEGRATION OF SOLAR CELL AND IMAGE SENSOR - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17892846 titled 'INTEGRATION OF SOLAR CELL AND IMAGE SENSOR

==Simplified Explanation==

The abstract describes an integrated circuit structure that combines a solar cell and an image sensor array. The structure includes multiple photodiodes on a substrate, an interconnect structure, bonding layers, a second substrate, and a transparent conductive oxide layer.

* The integrated circuit structure combines a solar cell and an image sensor array.
* The structure includes a substrate with multiple photodiodes.
* An interconnect structure is placed on the substrate.
* Bonding layers are added on top of the interconnect structure.
* A second substrate is placed on the bonding layers.
* A transparent conductive oxide layer is applied on the second substrate.

Potential applications of this technology:

* Solar-powered image sensors for various devices and systems.
* Integration of solar energy harvesting and image sensing capabilities in a single chip.
* Efficient power generation and image capturing in portable devices like smartphones and cameras.

Problems solved by this technology:

* Separate solar cells and image sensor arrays require more space and complex integration.
* Combining both functionalities in a single chip reduces the overall size and complexity of the system.
* Enables more compact and efficient devices with integrated solar power and image sensing capabilities.

Benefits of this technology:

* Space-saving integration of solar cells and image sensors.
* Simplified manufacturing process with fewer components.
* Enhanced energy efficiency and performance in portable devices.
* Enables the development of smaller and more versatile devices with integrated solar power and image sensing capabilities.


==Original Abstract Submitted==

The present disclosure provides an integrated circuit (IC) structure with a solar cell and an image sensor array. An integrated structure according to the present disclosure includes a first substrate including a plurality of photodiodes, an interconnect structure disposed on the first substrate, a first bonding layer disposed on the interconnect structure, a second bonding layer disposed on the first bonding layer, a second substrate disposed on the second bonding layer, and a transparent conductive oxide layer disposed on the second substrate.



[[Category:H01L27/146]]
[[Category:H01L31/0216]]
[[Category:H01L31/054]]
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