View source for 17887150. Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

=Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die=


==Organization Name==

[[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]


[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]

==Inventor(s)==

[[:Category:Yu-Sheng Lin of Zhubei (TW)|Yu-Sheng Lin of Zhubei (TW)]][[Category:Yu-Sheng Lin of Zhubei (TW)]]

[[:Category:Chin-Fu Kao of Taipei City (TW)|Chin-Fu Kao of Taipei City (TW)]][[Category:Chin-Fu Kao of Taipei City (TW)]]

[[:Category:Tsung-Yang Hsieh of Taipei City (TW)|Tsung-Yang Hsieh of Taipei City (TW)]][[Category:Tsung-Yang Hsieh of Taipei City (TW)]]

[[:Category:Jyun-Lin Wu of Hsinchu City (TW)|Jyun-Lin Wu of Hsinchu City (TW)]][[Category:Jyun-Lin Wu of Hsinchu City (TW)]]

[[:Category:Yao-Chun Chuang of Hsinchu City (TW)|Yao-Chun Chuang of Hsinchu City (TW)]][[Category:Yao-Chun Chuang of Hsinchu City (TW)]]

==Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17887150 titled 'Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die

==Simplified Explanation==

The patent application describes an integrated circuit (IC) system where two IC dies are connected by a third die, each with different surface orientations on their substrates.

* First IC die with a first substrate
* Second IC die with a second substrate
* First surface orientation on either first or second substrate
* Third die electrically interconnects the first and second IC dies
* Third die has a third substrate with a different second surface orientation

Potential Applications:
* Advanced electronic devices
* Communication systems
* Computing systems

Problems Solved:
* Efficiently connecting IC dies with different surface orientations
* Improving overall system performance and reliability

Benefits:
* Enhanced functionality and connectivity in electronic systems
* Increased flexibility in design and integration of IC components
* Improved performance and reliability of integrated circuits


==Original Abstract Submitted==

A first integrated circuit (IC) die includes a first substrate. A second IC die includes a second substrate. At least one of the first substrate or the second substrate has a first surface orientation. The first IC die is spaced apart from the second IC die. A third die electrically interconnects the first IC die to the second IC die. The third die includes a third substrate having a second surface orientation. The second surface orientation is different from the first surface orientation.



[[Category:H01L23/538]]
[[Category:H01L23/15]]
[[Category:H01L25/065]]