View source for 17884475. SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)

=SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Kunal R. Parekh of Boise ID (US)|Kunal R. Parekh of Boise ID (US)]][[Category:Kunal R. Parekh of Boise ID (US)]]

[[:Category:Bret K. Street of Meridian ID (US)|Bret K. Street of Meridian ID (US)]][[Category:Bret K. Street of Meridian ID (US)]]

[[:Category:Kyle K. Kirby of Eagle ID (US)|Kyle K. Kirby of Eagle ID (US)]][[Category:Kyle K. Kirby of Eagle ID (US)]]

[[:Category:Wei Zhou of Boise ID (US)|Wei Zhou of Boise ID (US)]][[Category:Wei Zhou of Boise ID (US)]]

[[:Category:Thiagarajan Raman of Boise ID (US)|Thiagarajan Raman of Boise ID (US)]][[Category:Thiagarajan Raman of Boise ID (US)]]

==SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17884475 titled 'SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES

==Simplified Explanation==

The patent application discloses techniques for providing a semiconductor device assembly with a substrate for vertically assembled semiconductor dies.

* Semiconductor assembly includes a semiconductor die coupled to a substrate with the active surface of the die orthogonal to the top surface of the substrate.
* The substrate has a recessed slot where a side surface of the semiconductor die couples.
* The semiconductor die includes a contact pad that couples to a contact pad at the recessed slot, enabling robust and cost-efficient assembly.

== Potential Applications ==
* Semiconductor manufacturing industry
* Electronics industry
* Consumer electronics

== Problems Solved ==
* Efficient assembly of semiconductor devices
* Cost-effective manufacturing process
* Improved reliability of semiconductor assemblies

== Benefits ==
* Robust semiconductor device assembly
* Cost-efficient manufacturing process
* Improved reliability and performance of semiconductor devices


==Original Abstract Submitted==

This document discloses techniques, apparatuses, and systems for providing a semiconductor device assembly with a substrate for vertically assembled semiconductor dies. A semiconductor assembly is described that includes a semiconductor die coupled to a substrate such that an active surface of the semiconductor die is substantially orthogonal to a top surface of the substrate. The substrate includes a surface having a recessed slot at which a side surface of the semiconductor die couples. The semiconductor die includes a contact pad that couples to a contact pad at the recessed slot. In doing so, the techniques, apparatuses, and systems herein enable a robust and cost-efficient semiconductor device to be assembled.



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