View source for 17876709. THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE simplified abstract (Dell Products L.P.)

=THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE=


==Organization Name==

[[:Category:Dell Products L.P.|Dell Products L.P.]]


[[Category:Dell Products L.P.]]

==Inventor(s)==

[[:Category:Travis C. North of Cedar Park TX (US)|Travis C. North of Cedar Park TX (US)]][[Category:Travis C. North of Cedar Park TX (US)]]

[[:Category:Enoch Chen of Taipei (TW)|Enoch Chen of Taipei (TW)]][[Category:Enoch Chen of Taipei (TW)]]

[[:Category:Deeder M. Aurongzeb of Austin TX (US)|Deeder M. Aurongzeb of Austin TX (US)]][[Category:Deeder M. Aurongzeb of Austin TX (US)]]

==THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17876709 titled 'THERMAL MANAGEMENT USING POROUS LAYER FOR LOW FORM FACTOR DEVICE

==Simplified Explanation==

The abstract describes a thermal management technique for reducing heat transferred to a user while maintaining the mechanical strength of an outer housing of an information handling system. The technique involves the use of a thermal management structure, specifically a porous layer, adjacent to the inner lateral surface of the outer housing. This porous layer, which can be made of a metal or metal alloy, such as a honeycomb structure or metal foam, increases thermal resistance in a direction orthogonal to the inner lateral surface.

* The thermal management technique reduces heat transferred to the user.
* The mechanical strength of the outer housing is maintained.
* A porous layer is used as a thermal management structure.
* The porous layer increases thermal resistance in a specific direction.
* The porous layer can be made of a metal or metal alloy.
* The metal or metal alloy can be in the form of a honeycomb structure or metal foam.

Potential Applications:
* Information handling systems, such as computers, laptops, or servers, can benefit from this thermal management technique.
* Electronic devices with outer housings that require heat dissipation can utilize this technique.

Problems Solved:
* Heat transferred to the user can be uncomfortable or even harmful, so reducing heat is important for user comfort and safety.
* Maintaining the mechanical strength of the outer housing is crucial to protect the internal components of the information handling system.

Benefits:
* Improved user comfort by reducing heat transferred to the user.
* Enhanced safety by preventing excessive heat exposure.
* Protection of internal components by maintaining the mechanical strength of the outer housing.
* Potential for increased lifespan and reliability of the information handling system.


==Original Abstract Submitted==

A thermal management technique reduces heat transferred to a user while maintaining mechanical strength of an outer housing of an information handling system. In at least one embodiment, an information handling system includes an outer housing and a thermal management structure adjacent to an inner lateral surface of the outer housing. The thermal management structure includes a porous layer configured to increase thermal resistance in a first direction orthogonal to the inner lateral surface of the outer housing. The porous layer may include a honeycomb structure formed from a metal or a metal alloy. The porous layer may include a metal foam.



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