View source for 17870977. ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Geuna Lee of Gyeonggi-do (KR)|Geuna Lee of Gyeonggi-do (KR)]][[Category:Geuna Lee of Gyeonggi-do (KR)]]

[[:Category:Jinho Lim of Gyeonggi-do (KR)|Jinho Lim of Gyeonggi-do (KR)]][[Category:Jinho Lim of Gyeonggi-do (KR)]]

[[:Category:Minsu Jung of Gyeonggi-do (KR)|Minsu Jung of Gyeonggi-do (KR)]][[Category:Minsu Jung of Gyeonggi-do (KR)]]

[[:Category:Kwonho Son of Gyeonggi-do (KR)|Kwonho Son of Gyeonggi-do (KR)]][[Category:Kwonho Son of Gyeonggi-do (KR)]]

==ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17870977 titled 'ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE

==Simplified Explanation==

The abstract describes an electronic device that includes a conductive and non-conductive housing, substrates, electronic components, contact members, and a support member. 

* The electronic device has a housing with both conductive and non-conductive portions.
* It includes a first substrate on which electronic components are placed.
* A second substrate is electrically connected to the first substrate and has two surfaces facing opposite directions.
* Contact members are positioned between the first surface of the second substrate and the conductive portion of the housing.
* A support member is placed between the first surface of the second substrate and the non-conductive portion of the housing.

Potential applications of this technology:

* Consumer electronics such as smartphones, tablets, or laptops.
* Industrial equipment and machinery.
* Medical devices and equipment.
* Automotive electronics.

Problems solved by this technology:

* Provides a structure that allows for efficient electrical coupling between substrates and the housing.
* Helps in dissipating heat generated by electronic components.
* Reduces the risk of electrical interference or short circuits.

Benefits of this technology:

* Improved electrical performance and reliability of the electronic device.
* Enhanced thermal management capabilities.
* Reduced risk of damage to electronic components.
* Simplified manufacturing and assembly processes.


==Original Abstract Submitted==

According to an embodiment, an electronic device is provided. the electronic device may comprise: a housing including a conductive portion and a non-conductive portion; a first substrate; at least one electronic component disposed on the first substrate; a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.



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