View source for 17840097. METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE simplified abstract (NANYA TECHNOLOGY CORPORATION)

=METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE=


==Organization Name==

[[:Category:NANYA TECHNOLOGY CORPORATION|NANYA TECHNOLOGY CORPORATION]]


[[Category:NANYA TECHNOLOGY CORPORATION]]

==Inventor(s)==

[[:Category:HSIH-YANG Chiu of TAOYUAN CITY (TW)|HSIH-YANG Chiu of TAOYUAN CITY (TW)]][[Category:HSIH-YANG Chiu of TAOYUAN CITY (TW)]]

==METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17840097 titled 'METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE

==Simplified Explanation==

The abstract describes a method for fabricating a semiconductor device. Here is a simplified explanation of the abstract:

* The method involves three main steps: providing a substrate, forming a fuse element within the substrate, and forming a fuse medium in contact with the fuse element.
* The fuse element is located within the substrate and extends from its upper surface.
* The fuse medium is placed in contact with the fuse element but is spaced apart from the upper surface of the substrate.

== Potential Applications ==
This technology can be applied in various semiconductor devices, including but not limited to:

* Integrated circuits (ICs)
* Microprocessors
* Memory devices
* Power devices

== Problems Solved ==
The method for fabricating a semiconductor device described in the patent application solves several problems, such as:

* Efficiently integrating fuse elements within a substrate.
* Ensuring proper contact between the fuse element and the fuse medium.
* Providing a reliable and accurate fuse mechanism for circuit protection or programming purposes.

== Benefits ==
The use of this method for fabricating a semiconductor device offers several benefits, including:

* Improved reliability and accuracy of fuse mechanisms.
* Enhanced circuit protection and programming capabilities.
* Efficient integration of fuse elements within the substrate.
* Potential cost savings in the manufacturing process.


==Original Abstract Submitted==

A method for fabricating a semiconductor device is provided. The method includes providing a substrate; forming a fuse element within the substrate and extending from an upper surface of the substrate; and forming a fuse medium in contact with the fuse element, wherein the fuse medium is spaced apart from the upper surface of the substrate.



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