View source for 17806280. VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

=VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK=


==Organization Name==

[[:Category:INTERNATIONAL BUSINESS MACHINES CORPORATION|INTERNATIONAL BUSINESS MACHINES CORPORATION]]


[[Category:INTERNATIONAL BUSINESS MACHINES CORPORATION]]

==Inventor(s)==

[[:Category:Ruilong Xie of Niskayuna NY (US)|Ruilong Xie of Niskayuna NY (US)]][[Category:Ruilong Xie of Niskayuna NY (US)]]

[[:Category:Kisik Choi of Watervliet NY (US)|Kisik Choi of Watervliet NY (US)]][[Category:Kisik Choi of Watervliet NY (US)]]

[[:Category:SOMNATH Ghosh of CLIFTON PARK NY (US)|SOMNATH Ghosh of CLIFTON PARK NY (US)]][[Category:SOMNATH Ghosh of CLIFTON PARK NY (US)]]

[[:Category:Julien Frougier of Albany NY (US)|Julien Frougier of Albany NY (US)]][[Category:Julien Frougier of Albany NY (US)]]

[[:Category:Stuart Sieg of Albany NY (US)|Stuart Sieg of Albany NY (US)]][[Category:Stuart Sieg of Albany NY (US)]]

[[:Category:Kevin Shawn Petrarca of Newburgh NY (US)|Kevin Shawn Petrarca of Newburgh NY (US)]][[Category:Kevin Shawn Petrarca of Newburgh NY (US)]]

==VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17806280 titled 'VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK

==Simplified Explanation==

The abstract of the patent application describes a semiconductor structure that includes a middle-of-line contact, a backside power rail, and a contact via connecting them. The contact via has two portions - a first portion with a negative tapered profile and a second portion with a positive tapered profile.

* The semiconductor structure includes a middle-of-line contact, a backside power rail, and a contact via.
* The contact via connects the middle-of-line contact and the backside power rail.
* The contact via has a first portion with a negative tapered profile.
* The contact via also has a second portion with a positive tapered profile.

Potential applications of this technology:

* Semiconductor manufacturing industry
* Electronics industry
* Integrated circuit design and fabrication

Problems solved by this technology:

* Efficient and reliable connection between middle-of-line contacts and backside power rails in a semiconductor structure
* Improved electrical performance and signal transmission

Benefits of this technology:

* Enhanced performance and reliability of semiconductor devices
* Improved power distribution and signal integrity
* Increased efficiency in semiconductor manufacturing processes


==Original Abstract Submitted==

A semiconductor structure including a middle-of-line contact, a backside power rail, and a contact via extending between the middle-of-line contact and the backside power rail, wherein the contact via comprises a first portion having a negative tapered profile and a second portion having a positive tapered profile.



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