View source for 17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Inoue Naoki of Seongnam-si (KR)|Inoue Naoki of Seongnam-si (KR)]][[Category:Inoue Naoki of Seongnam-si (KR)]]

[[:Category:Hyunwoo Kim of Seongnam-si (KR)|Hyunwoo Kim of Seongnam-si (KR)]][[Category:Hyunwoo Kim of Seongnam-si (KR)]]

[[:Category:Tsunehiro Nishi of Suwon-si (KR)|Tsunehiro Nishi of Suwon-si (KR)]][[Category:Tsunehiro Nishi of Suwon-si (KR)]]

==COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17742667 titled 'COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION

==Simplified Explanation==

The abstract describes a patent application for a hardmask-forming compound, a hardmask composition, and a method of manufacturing an integrated circuit (IC). The compound includes a specific moiety represented by Formula 1.

* The patent application is for a new compound that can be used to create a hardmask, which is a protective layer used in the manufacturing of integrated circuits.
* The compound includes a specific moiety represented by Formula 1, which is a specific chemical structure.
* The invention also includes a composition that contains the compound and can be used as a hardmask.
* The method of manufacturing an integrated circuit using this compound and composition is also described in the patent application.

== Potential Applications ==
* This technology can be used in the manufacturing of integrated circuits.
* It can be applied in the semiconductor industry for the production of electronic devices.

== Problems Solved ==
* The invention solves the problem of creating a hardmask for integrated circuit manufacturing.
* It provides a new compound and composition that can be used as a hardmask, improving the manufacturing process.

== Benefits ==
* The compound and composition described in the patent application offer a more efficient and effective way to create a hardmask.
* The method of manufacturing an integrated circuit using this technology can lead to improved performance and reliability of electronic devices.


==Original Abstract Submitted==

A hardmask-forming compound, a hardmask composition, and a method of manufacturing an integrated circuit (IC), the hardmask-forming compound including a moiety represented by Formula 1:



[[Category:C08G79/08]]
[[Category:H01L21/311]]
[[Category:H01L21/033]]
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[[Category:H01L27/108]]
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