View source for 17662107. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

=SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL=


==Organization Name==

[[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]


[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]

==Inventor(s)==

[[:Category:Yi-Lin Wang of Kaohsiung (TW)|Yi-Lin Wang of Kaohsiung (TW)]][[Category:Yi-Lin Wang of Kaohsiung (TW)]]

[[:Category:Chin-Szu Lee of Taoyuan City (TW)|Chin-Szu Lee of Taoyuan City (TW)]][[Category:Chin-Szu Lee of Taoyuan City (TW)]]

[[:Category:Hua-Sheng Chiu of Zhudong Town (TW)|Hua-Sheng Chiu of Zhudong Town (TW)]][[Category:Hua-Sheng Chiu of Zhudong Town (TW)]]

[[:Category:Yi-Chao Chang of Hsinchu (TW)|Yi-Chao Chang of Hsinchu (TW)]][[Category:Yi-Chao Chang of Hsinchu (TW)]]

[[:Category:Zih-Shou Mue of Hsinchu (TW)|Zih-Shou Mue of Hsinchu (TW)]][[Category:Zih-Shou Mue of Hsinchu (TW)]]

==SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17662107 titled 'SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL

==Simplified Explanation==

The abstract describes a shutter disc for use in a deposition tool's processing chamber during a conditioning process. The shutter disc is designed to reduce heat transfer and thermal stresses, and it includes a wave-shaped section for this purpose. Additionally, the shutter disc has a thin-film material deposited on its backside, which creates a spacing between the inner edge of the thin-film material and the outer edge of a substrate support component. This spacing prevents material accumulation, reduces tilting due to placement errors, and minimizes heat transfer to the shutter disc.

* Shutter disc designed for use in a deposition tool's processing chamber during a conditioning process
* Wave-shaped section of the shutter disc reduces heat transfer and thermal stresses
* Thin-film material deposited on the backside of the shutter disc
* Diameter of the shutter disc creates a spacing between the thin-film material and the substrate support component
* Spacing prevents material accumulation, reduces tilting, and minimizes heat transfer to the shutter disc

==Potential Applications==
* Deposition tools used in various industries such as semiconductor manufacturing, optical coatings, and thin-film solar cells

==Problems Solved==
* Heat transfer and thermal stresses during the conditioning process
* Material accumulation between the shutter disc and the substrate support component
* Tilting of the shutter disc due to placement errors

==Benefits==
* Reduced heat transfer and thermal stresses on the shutter disc
* Prevention of material accumulation between the shutter disc and the substrate support component
* Minimized tilting of the shutter disc
* Improved performance and longevity of the deposition tool


==Original Abstract Submitted==

Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.



[[Category:C23C14/34]]
[[Category:H01J37/32]]
[[Category:B08B7/00]]
[[Category:B08B17/04]]
[[Category:C23C14/50]]