View source for 17525536. SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)

=SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS=


==Organization Name==

[[:Category:MICROSOFT TECHNOLOGY LICENSING, LLC|MICROSOFT TECHNOLOGY LICENSING, LLC]]


[[Category:MICROSOFT TECHNOLOGY LICENSING, LLC]]

==Inventor(s)==

[[:Category:Bharath Ramakrishnan of Bellevue WA (US)|Bharath Ramakrishnan of Bellevue WA (US)]][[Category:Bharath Ramakrishnan of Bellevue WA (US)]]

[[:Category:Husam Atallah Alissa of Redmond WA (US)|Husam Atallah Alissa of Redmond WA (US)]][[Category:Husam Atallah Alissa of Redmond WA (US)]]

[[:Category:Eric C. Peterson of Woodinville WA (US)|Eric C. Peterson of Woodinville WA (US)]][[Category:Eric C. Peterson of Woodinville WA (US)]]

[[:Category:Nicholas Andrew Keehn of Kirkland WA (US)|Nicholas Andrew Keehn of Kirkland WA (US)]][[Category:Nicholas Andrew Keehn of Kirkland WA (US)]]

[[:Category:Christian L. Belady of Mercer Island WA (US)|Christian L. Belady of Mercer Island WA (US)]][[Category:Christian L. Belady of Mercer Island WA (US)]]

[[:Category:Ioannis Manousakis of Redmond WA (US)|Ioannis Manousakis of Redmond WA (US)]][[Category:Ioannis Manousakis of Redmond WA (US)]]

[[:Category:Dennis Trieu of Calgary (CA)|Dennis Trieu of Calgary (CA)]][[Category:Dennis Trieu of Calgary (CA)]]

==SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17525536 titled 'SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS

==Simplified Explanation==

The abstract describes a method for managing the heat generated by a computing device using two different working fluids. The first electronic component is immersed in a first working fluid in a first volume, while the second electronic component is immersed in a second working fluid in a second volume. By changing the pressure in the first volume, the boiling temperature of the first working fluid can be altered.

* The method involves immersing electronic components in working fluids to manage heat.
* Two different working fluids are used for different components.
* The pressure in the first volume is changed to adjust the boiling temperature of the first working fluid.

==Potential Applications==
* Thermal management of computing devices such as laptops, desktops, or servers.
* Cooling of high-performance electronic components in industries like aerospace or automotive.
* Heat dissipation in data centers or server farms.

==Problems Solved==
* Overheating of electronic components, which can lead to performance degradation or even failure.
* Inadequate cooling solutions for high-performance computing devices.
* Difficulty in managing heat in compact or densely packed electronic systems.

==Benefits==
* Improved thermal management, leading to better performance and reliability of computing devices.
* Enhanced cooling capabilities for high-performance electronic components.
* Efficient heat dissipation in compact or densely packed electronic systems.


==Original Abstract Submitted==

A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.



[[Category:H05K7/20]]