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Category:Kelvin Aik Boo Tan of Singapore (SG)
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Pages in category "Kelvin Aik Boo Tan of Singapore (SG)"
The following 6 pages are in this category, out of 6 total.
1
- 17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)
- 18497637. PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract (Micron Technology, Inc.)
- 18503560. LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE simplified abstract (Micron Technology, Inc.)
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- Micron technology, inc. (20240128182). DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN simplified abstract
- Micron technology, inc. (20240162206). LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE simplified abstract
- Micron technology, inc. (20240162207). PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE simplified abstract