SEARCH RESULTS for assignor:"XIE, JING"

Showing 1 to 10 of 10 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
24-May-2018

(X0) 1: TEMPLATE-BASED STRUCTURED DOCUMENT CLASSIFICATION AND EXTRACTION

(A1) 2: TEMPLATE-BASED STRUCTURED DOCUMENT CLASSIFICATION AND EXTRACTION

SHENG, YING

LU, YIFENG

XIE, JING

YANG, JIE

PUEYO, LUIS GARCIA

LOU, JINAN

WENDT, JAMES

GOOGLE INC.

40729/431

03-May-2018

(X0) 1: SOLID ELECTROLYTE AND PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY CONTAINING SAME

(A1) 2: SOLID ELECTROLYTE AND PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY CONTAINING SAME

YI, GUANGUI

MA, YONGJUN

GUO, ZIZHU

WANG, XIANGHUI

XIE, JING

BYD COMPANY LIMITED

44482/553

05-Apr-2018

(X0) 1: WEB APPLICATION SYSTEM AND METHOD TO DYNAMICALLY SELECT BETWEEN LOCAL INSTALLED AND CLOUD-BASED RESOURCES

(A1) 2: WEB APPLICATION SYSTEM AND METHOD TO DYNAMICALLY SELECT BETWEEN LOCAL INSTALLED AND CLOUD-BASED RESOURCES

TANABE, JASON

ARIE, UDI

MCINTYRE, STEPHEN

XIE, JING

AVAYA INC.

39931/900

27-Mar-2018

(X0) 1: CONNECTION PROPAGATION FOR INTER-LOGICAL BLOCK CONNECTIONS IN INTEGRATED CIRCUITS

(B1) 9: CONNECTION PROPAGATION FOR INTER-LOGICAL BLOCK CONNECTIONS IN INTEGRATED CIRCUITS

KAMAL, PRATYUSH

SAMADI, KAMBIZ

XIE, JING

DU, YANG

QUALCOMM INCORPORATED

41790/209

20-Mar-2018

(X0) 1: MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION

(A1) 2: MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION

(B2) 9: MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION

LAN, JE-HSIUNG JEFFREY

ZHANG, WENYUE

DU, YANG

LEE, YONG JU

GU, SHIQUN

XIE, JING

QUALCOMM INCORPORATED

34552/961

06-Feb-2018

(X0) 2: VACUUM CLEANER

(B1) D: VACUUM CLEANER

LUO, HAIBO

SUZUKI, MASATO

MINAMIDE, KEIICHI

MIYAZAKI, HIROHISA

CUI, CHEN

QI, LIJUN

SHIGERI, MITSUHIRO

XIE, JING

JUN, CHEN

SAMSUNG ELECTRONICS CO., LTD.

42876/194

30-Jan-2018

(X0) 2: HEAD FOR VACUUM CLEANER

(B1) D: HEAD FOR VACUUM CLEANER

LUO, HAIBO

SUZUKI, MASATO

MINAMIDE, KEIICHI

MIYAZAKI, HIROHISA

CUI, CHEN

QI, LIJUN

SHIGERI, MITSUHIRO

XIE, JING

JUN, CHEN

SAMSUNG ELECTRONICS CO., LTD.

42876/276

23-Jan-2018

(X0) 2: VACUUM CLEANER

(B1) D: VACUUM CLEANER

LUO, HAIBO

SUZUKI, MASATO

MINAMIDE, KEIICHI

MIYAZAKI, HIROHISA

CUI, CHEN

QI, LIJUN

SHIGERI, MITSUHIRO

XIE, JING

JUN, CHEN

SAMSUNG ELECTRONICS CO., LTD.

42876/129

18-Jan-2018

(X0) 1: SYSTEM AND METHOD TO USE LOCATION-AWARE DNS RESPONSES AS INPUT TO MEDIA RELAY SELECTION FOR WEBRTC

(A1) 2: SYSTEM AND METHOD TO USE LOCATION-AWARE DNS RESPONSES AS INPUT TO MEDIA RELAY SELECTION FOR WEBRTC

TANABE, JASON G.

BALASAYGUN, MEHMET

LEE, ADRIAN

XIE, JING

AVAYA, INC.

43334/412

11-Jan-2018

(X0) 1: THERMALLY-ACTIVATED SENSITIZED PHOSPHORESCENT ORGANIC ELECTROLUMINESCENT DEVICE

(A1) 2: THERMALLY-ACTIVATED SENSITIZED PHOSPHORESCENT ORGANIC ELECTROLUMINESCENT DEVICE

DUAN, LIAN

XIE, JING

LIU, SONG

ZHANG, DONGDONG

ZHAO, FEI

43094/923