SEARCH RESULTS for assignor:"XIE, JING"

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(X0) 15472614: POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC)

(A1) 20180286800: POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC)

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(X0) 15360939: TEMPLATE-BASED STRUCTURED DOCUMENT CLASSIFICATION AND EXTRACTION

(A1) 20180144042: TEMPLATE-BASED STRUCTURED DOCUMENT CLASSIFICATION AND EXTRACTION

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(X0) 15852336: SOLID ELECTROLYTE AND PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY CONTAINING SAME

(A1) 20180123167: SOLID ELECTROLYTE AND PREPARATION METHOD THEREFOR, AND LITHIUM-ION BATTERY CONTAINING SAME

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(X0) 15284202: WEB APPLICATION SYSTEM AND METHOD TO DYNAMICALLY SELECT BETWEEN LOCAL INSTALLED AND CLOUD-BASED RESOURCES

(A1) 20180095741: WEB APPLICATION SYSTEM AND METHOD TO DYNAMICALLY SELECT BETWEEN LOCAL INSTALLED AND CLOUD-BASED RESOURCES

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(X0) 15437871: CONNECTION PROPAGATION FOR INTER-LOGICAL BLOCK CONNECTIONS IN INTEGRATED CIRCUITS

(B1) 9: CONNECTION PROPAGATION FOR INTER-LOGICAL BLOCK CONNECTIONS IN INTEGRATED CIRCUITS

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(X0) 14498965: MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION

(A1) 20160093591: MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION

(B2) 9: MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION

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(X0) 15653239: SYSTEM AND METHOD TO USE LOCATION-AWARE DNS RESPONSES AS INPUT TO MEDIA RELAY SELECTION FOR WEBRTC

(A1) 20180019909: SYSTEM AND METHOD TO USE LOCATION-AWARE DNS RESPONSES AS INPUT TO MEDIA RELAY SELECTION FOR WEBRTC

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(X0) 15544859: THERMALLY-ACTIVATED SENSITIZED PHOSPHORESCENT ORGANIC ELECTROLUMINESCENT DEVICE

(A1) 20180013073: THERMALLY-ACTIVATED SENSITIZED PHOSPHORESCENT ORGANIC ELECTROLUMINESCENT DEVICE