SEARCH RESULTS for assignor:"CHEN, HSIN-PING"

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Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
17-May-2018

(X0) 1: INTERCONNECT STRUCTURE INCLUDING AIR GAP

(A1) 2: INTERCONNECT STRUCTURE INCLUDING AIR GAP

YANG, TAI-I

CHU, WEI-CHEN

CHEN, HSIN-PING

LU, CHIH-WEI

LEE, CHUNG-JU

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

40413/709