SEARCH RESULTS for assignee:"TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD."

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(X0) 15997513: Source Beam Optimization Method for Improving Lithography Printability

(A1) 20180285512: Source Beam Optimization Method for Improving Lithography Printability

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(X0) 15997914: MULTI-ZONE GAS DISTRIBUTION PLATE (GDP) AND A METHOD FOR DESIGNING THE MULTI-ZONE GDP

(A1) 20180286634: MULTI-ZONE GAS DISTRIBUTION PLATE (GDP) AND A METHOD FOR DESIGNING THE MULTI-ZONE GDP

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(X0) 16002970: CARRIER SYNCHRONIZATION DEVICE

(A1) 20180287775: CARRIER SYNCHRONIZATION DEVICE

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(X0) 15476370: STRUCTURE AND FORMATION METHOD OF IMAGE SENSOR STRUCTURE WITH GRID STRUCTURE

(A1) 20180286907: STRUCTURE AND FORMATION METHOD OF IMAGE SENSOR STRUCTURE WITH GRID STRUCTURE

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(X0) 15475280: POLISHING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

(A1) 20180286699: POLISHING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

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(X0) 15475294: SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

(A1) 20180286960: SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

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(X0) 15587540: PHOTOMASK TRANSPORTATION STAGE IN SEMICONDUCTOR FABRICATION AND METHOD FOR USING THE SAME

(A1) 20180287583: PHOTOMASK TRANSPORTATION STAGE IN SEMICONDUCTOR FABRICATION AND METHOD FOR USING THE SAME

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(X0) 15475258: RING OSCILLATOR, CONTROLLING CIRCUIT AND METHODS FOR REALIGNMENT

(A1) 20180287593: RING OSCILLATOR, CONTROLLING CIRCUIT AND METHODS FOR REALIGNMENT

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(X0) 15625824: PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

(A1) 20180286793: PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

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(X0) 15644022: FRONT SIDE ILLUMINATED IMAGE SENSOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

(A1) 20180286905: FRONT SIDE ILLUMINATED IMAGE SENSOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

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(X0) 15646414: APPARATUS AND METHOD FOR TIMED DISPENSING VARIOUS SLURRY COMPONENTS

(A1) 20180281152: APPARATUS AND METHOD FOR TIMED DISPENSING VARIOUS SLURRY COMPONENTS

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(X0) 15679027: PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

(A1) 20180286776: PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

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(X0) 15700033: LEVEL SHIFTER AND LEVEL SHIFTING METHOD

(A1) 20180287615: LEVEL SHIFTER AND LEVEL SHIFTING METHOD

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(X0) 15716722: FINFET STRUCTURE WITH COMPOSITE GATE HELMET

(A1) 20180286959: FINFET STRUCTURE WITH COMPOSITE GATE HELMET

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(X0) 15725246: PROTECTION CIRCUIT

(A1) 20180286851: PROTECTION CIRCUIT

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(X0) 15726260: PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

(A1) 20180286823: PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

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(X0) 15800035: PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

(A1) 20180286824: PACKAGE STRUCTURE AND METHOD OF FORMING PACKAGE STRUCTURE

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(X0) 15470933: BLANK MASK AND FABRICATION METHOD THEREOF, AND METHOD OF FABRICATING PHOTOMASK

(A1) 20180284601: BLANK MASK AND FABRICATION METHOD THEREOF, AND METHOD OF FABRICATING PHOTOMASK

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(X0) 15471151: PHOTOMASK AND METHOD OF FORMING THE SAME

(A1) 20180284602: PHOTOMASK AND METHOD OF FORMING THE SAME

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(X0) 15472306: METHOD FOR MEASURING CHARGE ACCUMULATION IN FABRICATION PROCESS OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

(A1) 20180286765: METHOD FOR MEASURING CHARGE ACCUMULATION IN FABRICATION PROCESS OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE