SEARCH RESULTS for assignee:"TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD." AND day:[2018-10-01T00:00:00Z TO 2018-10-31T23:59:59Z]

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(X0) 15492243: SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND METHOD OF FORMING THE SAME

(A1) 20180308801: SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND METHOD OF FORMING THE SAME

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(X0) 15495106: CAPACITOR CELL AND STRUCTURE THEREOF

(A1) 20180308846: CAPACITOR CELL AND STRUCTURE THEREOF

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(X0) 15496080: SEMICONDUCTOR DEVICE

(A1) 20180308700: SEMICONDUCTOR DEVICE

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(X0) 15492508: MEMORY SYSTEM AND MEMORY CELL HAVING DENSE LAYOUTS

(A1) 20180308847: MEMORY SYSTEM AND MEMORY CELL HAVING DENSE LAYOUTS

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(X0) 15496067: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

(A1) 20180308797: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

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(X0) 15491986: SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

(A1) 20180308787: SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

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(X0) 15615901: VERTICAL MOS TRANSISTOR AND FABRICATING METHOD THEREOF

(A1) 20180308947: VERTICAL MOS TRANSISTOR AND FABRICATING METHOD THEREOF

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(X0) 15616914: APPARATUS AND METHOD FOR PROCESSING WAFER

(A1) 20180308724: APPARATUS AND METHOD FOR PROCESSING WAFER

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(X0) 15627472: SYSTEM AND METHOD FOR PROVIDING DEIONIZED WATER WITH DYNAMIC ELECTRICAL RESISTIVITY

(A1) 20180304215: SYSTEM AND METHOD FOR PROVIDING DEIONIZED WATER WITH DYNAMIC ELECTRICAL RESISTIVITY

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(X0) 15631000: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

(A1) 20180308842: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

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(X0) 15635308: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

(A1) 20180308769: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

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(X0) 15655974: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

(A1) 20180308959: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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(X0) 15659699: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

(A1) 20180308960: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

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(X0) 15492603: STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE

(A1) 20180308793: STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE

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(X0) 15692528: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

(A1) 20180308702: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

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(X0) 15726113: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

(A1) 20180308949: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

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(X0) 15485428: FINFET SEMICONDUCTOR STRUCTURE HAVING HYBRID SUBSTRATE AND METHOD OF FABRICATING THE SAME

(A1) 20180301384: FINFET SEMICONDUCTOR STRUCTURE HAVING HYBRID SUBSTRATE AND METHOD OF FABRICATING THE SAME

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(X0) 15486305: PHOTO MASK ASSEMBLY AND OPTICAL APPARATUS INCLUDING THE SAME

(A1) 20180299768: PHOTO MASK ASSEMBLY AND OPTICAL APPARATUS INCLUDING THE SAME

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(B2) 10101651: PHOTO MASK ASSEMBLY AND OPTICAL APPARATUS INCLUDING THE SAME

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(X0) 15486306: INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING THE SAME

(A1) 20180301389: INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING THE SAME

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(X0) 15488658: METHOD FOR MANUFACTURING CMOS IMAGE SENSOR

(A1) 20180301501: METHOD FOR MANUFACTURING CMOS IMAGE SENSOR