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Category:CPC H10B80/00
Pages in category "CPC H10B80/00"
The following 200 pages are in this category, out of 203 total.
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- 18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation)
- 18087384. HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract (International Business Machines Corporation)
- 18089488. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089495. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089506. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18090216. PROGRAMMABLE HYBRID MEMORY AND CAPACITIVE DEVICE IN A DRAM PROCESS simplified abstract (XILINX, INC.)
- 18091264. STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE simplified abstract (Intel Corporation)
- 18184222. HETEROGENEOUS INTEGRATION FOR MEMRISTOR-BASED HARDWARE ACCELERATORS simplified abstract (HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP)
- 18184527. Upside-Down DRAM Package Structure simplified abstract (Apple Inc.)
- 18233296. MEMORY PACKAGE EXPANSION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18233974. METHODS OF FABRICATING MEMORY DEVICES INCLUDING CAPACITORS (Yangtze Memory Technologies Co., Ltd.)
- 18234325. 3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION (Yangtze Memory Technologies Co., Ltd.)
- 18244429. NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18336775. DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-LEVEL-CACHE APPLICATIONS (QUALCOMM Incorporated)
- 18370940. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18370949. SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374718. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18375173. SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18400994. TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract (Micron Technology, Inc.)
- 18426282. STACKED SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18426703. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18430288. MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18443882. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18444874. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18463805. MEMORY DIE STACK HAVING A SWITCH FOR SELECTIVELY CONNECTING A MEMORY DIE TO A SUBSTRATE (Western Digital Technologies, Inc.)
- 18471295. MEMORY DEVICE (MACRONIX International Co., Ltd.)
- 18471402. STACKED MEMORY LAYERS WITH UNIFORM ACCESS (Intel Corporation)
- 18473421. MEMORY LAYERS BONDED TO LOGIC LAYERS WITH INCLINATION (Intel Corporation)
- 18474111. DIE PAIR DEVICE PARTITIONING simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18474179. ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES simplified abstract (ADVANCED MICRO DEVICES, INC.)
- 18483543. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18495519. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18512199. PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18529365. MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18575994. MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION)
- 18584426. MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME (SK hynix Inc.)
- 18590778. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18595303. STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18595321. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18610282. SEMICONDUCTOR MEMORY simplified abstract (Kioxia Corporation)
- 18615116. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18734650. MEMORY DEVICE (Samsung Electronics Co., Ltd.)
- 18736967. MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18829396. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
A
- Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
- Advanced micro devices Patent Application Trends in 2024
- Advanced Micro Devices, Inc Patent Application Trends in 2025
- ADVANCED MICRO DEVICES, INC. Patent Application Trends in 2025
- Advanced Semiconductor Engineering, Inc. Patent Application Trends in 2025
- ALIBABA GROUP HOLDING LIMITED Patent Application Trends in 2024
- Apple inc. (20240315054). Upside-Down DRAM Package Structure simplified abstract
- Apple Inc. patent applications on September 19th, 2024
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Avago Technologies International Sales Pte. Limited Patent Application Trends in 2025
I
- IMEC VZW Patent Application Trends in 2024
- Intel corporation (20240215269). GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract
- Intel corporation (20240224543). STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE simplified abstract
- Intel corporation (20240334715). FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS simplified abstract
- Intel corporation (20250107107). STACKED MEMORY LAYERS WITH UNIFORM ACCESS
- Intel corporation (20250107108). MEMORY LAYERS BONDED TO LOGIC LAYERS WITH INCLINATION
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on March 27th, 2025
- Intel Corporation patent applications on October 3rd, 2024
- International business machines corporation (20240215270). HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on June 27th, 2024
K
- Kioxia corporation (20240306405). SEMICONDUCTOR STORAGE DEVICE simplified abstract
- Kioxia corporation (20240315058). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240324249). STORAGE DEVICE simplified abstract
- Kioxia corporation (20240324250). SEMICONDUCTOR MEMORY simplified abstract
- Kioxia Corporation Patent Application Trends in 2024
- KIOXIA CORPORATION Patent Application Trends in 2025
- Kioxia Corporation patent applications on September 12th, 2024
- Kioxia Corporation patent applications on September 19th, 2024
- Kioxia Corporation patent applications on September 26th, 2024
M
- Macronix International Co., Ltd. Patent Application Trends in 2025
- MACRONIX INTERNATIONAL CO., LTD. Patent Application Trends in 2025
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- Meta Platforms Technologies, LLC patent applications on February 13th, 2025
- Meta Platforms, Inc. Patent Application Trends in 2024
- Micron Technolgy, Inc. Patent Application Trends in 2024
- Micron technology, inc. (20240237363). TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract
- Micron technology, inc. (20240260281). MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY
- Micron technology, inc. (20240260281). MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract
- Micron technology, inc. (20240268131). OPTICAL SIGNALING FOR STACKED MEMORY DEVICE ARCHITECTURES simplified abstract
- Micron technology, inc. (20240268132). LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION simplified abstract
- Micron technology, inc. (20240306403). STACKED SEMICONDUCTOR DEVICE simplified abstract
- Micron technology, inc. (20250008750). SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on August 8th, 2024
- Micron Technology, Inc. patent applications on January 23rd, 2025
- Micron Technology, Inc. patent applications on January 2nd, 2025
- Micron Technology, Inc. patent applications on July 11th, 2024
- Micron Technology, Inc. patent applications on September 12th, 2024
N
P
Q
- Qualcomm incorporated (20240276739). DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES simplified abstract
- Qualcomm incorporated (20240422995). DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-LEVEL-CACHE APPLICATIONS
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on August 15th, 2024
- QUALCOMM Incorporated patent applications on December 19th, 2024
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- Samsung Electro-Mechanics Co., Ltd. Patent Application Trends in 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240196633). MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES simplified abstract
- Samsung electronics co., ltd. (20240224544). PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240237362). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240268129). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240268130). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240268133). MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240284683). NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240284686). INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240292634). MEMORY DEVICE WITH INTERPLANE PAD PART simplified abstract
- Samsung electronics co., ltd. (20240306402). SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240306404). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Samsung electronics co., ltd. (20240315055). MEMORY PACKAGE EXPANSION simplified abstract
- Samsung electronics co., ltd. (20240334716). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240431121). MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME
- Samsung electronics co., ltd. (20240431122). SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250008749). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250024690). MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- SAMSUNG ELECTRONICS CO., LTD. (20250024690). MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Samsung electronics co., ltd. (20250081472). NON-VOLATILE MEMORY DEVICE
- Samsung electronics co., ltd. (20250098180). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250120099). MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE
- Samsung electronics co., ltd. (20250126810). MEMORY DEVICE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on April 10th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 10th, 2025
- Samsung Electronics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO.,LTD Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. Patent Application Trends in 2025
- Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- Sk hynix inc. (20250072011). MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- SK hynix Inc. Patent Application Trends in 2025
- SK hynix Inc. patent applications on February 27th, 2025
- SK hynix Inc. patent applications on February 6th, 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240206193). STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
