US Patent Application 17724353. HEATSINK BASED POWER DELIVERY FOR CPUS simplified abstract
Contents
HEATSINK BASED POWER DELIVERY FOR CPUS
Organization Name
Inventor(s)
Sandor Farkas of Round Rock TX (US)
Mark Smith of Georgetown TX (US)
Bhyrav Mutnury of Austin TX (US)
HEATSINK BASED POWER DELIVERY FOR CPUS - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17724353 Titled 'HEATSINK BASED POWER DELIVERY FOR CPUS'
Simplified Explanation
This abstract describes an information handling system that consists of several components: a printed circuit board (PCB), a central processing unit (CPU), a power distribution hat, and a heat sink. The PCB has a first power contact on one side and a first ground contact on the other side. The CPU is attached to the PCB and is connected to the first power contact through its substrate. The substrate of the CPU also has a second power contact and a second ground contact on its other side. The power distribution hat connects the first power contact of the PCB to the second power contact of the CPU, while the heat sink connects the first ground contact of the PCB to the second ground contact of the CPU.
Original Abstract Submitted
An information handling system includes a PCB, a CPU, a power distribution hat, and a heat sink. The PCB includes a first power contact on a first surface of the PCB and a first ground contact on a second surface of the PCB. The CPU includes a substrate and is affixed and electrically coupled to the first surface of the PCB by a first surface of the substrate. A second surface of the substrate includes a second power contact and a second ground contact. The power distribution hat couples the first power contact with the second power contact. The heat sink couples the first ground contact with the second ground contact.
