US Patent Application 17724326. CPU FOR HEATSINK BASED POWER DELIVERY simplified abstract
Contents
CPU FOR HEATSINK BASED POWER DELIVERY
Organization Name
Inventor(s)
Sandor Farkas of Round Rock TX (US)
Mark Smith of Georgetown TX (US)
Bhyrav Mutnury of Austin TX (US)
CPU FOR HEATSINK BASED POWER DELIVERY - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 17724326 Titled 'CPU FOR HEATSINK BASED POWER DELIVERY'
Simplified Explanation
This abstract describes a central processing unit (CPU) that consists of a processor die and a substrate. The processor die has various types of contacts, including signal contacts, power contacts, and ground contacts. The processor die is attached and connected to the substrate on one side. The substrate is responsible for connecting the signal contacts on the processor die to corresponding second signal contacts on the other side of the substrate. Additionally, the substrate routes a portion of the power contacts to a power pad on the same side as the processor die, and a portion of the ground contacts to a ground pad on the same side as the processor die.
Original Abstract Submitted
A CPU includes a processor die and a substrate. The processor die includes first signal contacts, power contacts, and ground contacts. The processor die is affixed and electrically coupled to the substrate on a first surface of the substrate. The substrate routes the first signal contacts to associated second signal contacts on a second surface of the substrate. The substrate further routes a subset of the power contacts to a power pad on the first surface of the substrate, and routes a subset of the ground contacts to a ground pad on the first surface of the substrate.
