Taiwan semiconductor manufacturing company, ltd. (20240178116). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Shih-Ting Hung of New Taipei City (TW)
Meng-Liang Lin of Hsinchu (TW)
Yi-Wen Wu of New Taipei City (TW)
Po-Yao Chuang of Hsin-Chu (TW)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178116 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a redistribution structure with a first conductive pad, first and second conductive vias, and a first dielectric layer. The encapsulated die is electrically connected to the redistribution structure, with the first conductive pad having opposing sides and the vias being tapered in opposite directions on each side. The first dielectric layer covers the pad and vias, and the encapsulated die is positioned below one of the vias.
- The semiconductor package includes a redistribution structure with a first conductive pad, first and second conductive vias, and a first dielectric layer.
- The first conductive pad has opposing sides, with the vias being tapered in opposite directions on each side.
- The first dielectric layer covers the pad and vias, and the encapsulated die is positioned below one of the vias.
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Semiconductor packaging
- Integrated circuits
- Electronic devices
Problems Solved
The technology addresses the following issues:
- Efficient electrical connections in semiconductor packages
- Improved signal transmission
- Enhanced reliability of electronic components
Benefits
The technology offers the following benefits:
- Enhanced performance of electronic devices
- Increased durability of semiconductor packages
- Simplified manufacturing processes
Potential Commercial Applications
The technology could be utilized in various commercial applications, including:
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
Possible Prior Art
One possible prior art related to this technology is the use of redistribution structures in semiconductor packaging to improve electrical connections and signal transmission.
Unanswered Questions
How does the technology compare to existing semiconductor packaging methods?
The article does not provide a direct comparison between this technology and traditional semiconductor packaging methods. Further research or testing may be needed to determine the advantages and disadvantages of this innovation.
What are the potential limitations of this technology in real-world applications?
The article does not discuss any potential limitations or challenges that may arise when implementing this technology in practical electronic devices. Additional studies or experiments could help identify and address any limitations.
Original Abstract Submitted
a semiconductor package includes a redistribution structure and an encapsulated die electrically connected to the redistribution structure. the redistribution structure includes a first conductive pad, first and second conductive vias, and a first dielectric layer. the first conductive pad includes opposing first and second sides, the first conductive via lands on the first side of the first conductive pad and is tapered in a direction from the first side toward the second side. the second conductive via lands on the second side of the first conductive pad and is tapered in a direction from the second side toward the first side. the first dielectric layer laterally covers the first conductive pad and the first conductive via, and the first dielectric layer includes opposing first and second surfaces. the encapsulated die is disposed below the first side of the first conductive via.
