Taiwan semiconductor manufacturing co., ltd. (20240185895). SYSTEM FOR DIFFERENTIATED THERMAL THROTTLING OF MEMORY AND METHOD OF OPERATING SAME simplified abstract

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SYSTEM FOR DIFFERENTIATED THERMAL THROTTLING OF MEMORY AND METHOD OF OPERATING SAME

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Philex Ming-Yan Fan of Hsinchu (TW)

Chia-En Huang of Hsinchu (TW)

Yih Wang of Hsinchu (TW)

Jonathan Tsung-Yung Chang of Hsinchu (TW)

SYSTEM FOR DIFFERENTIATED THERMAL THROTTLING OF MEMORY AND METHOD OF OPERATING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240185895 titled 'SYSTEM FOR DIFFERENTIATED THERMAL THROTTLING OF MEMORY AND METHOD OF OPERATING SAME

Simplified Explanation

The patent application describes a system with a high bandwidth memory (HBM) divided into portions containing memory cells, with a differentiated dynamic voltage and frequency scaling (DDVFS) device. This device controls the temperature of specific sets of memory cells based on environmental signals corresponding to transistors within those cells.

  • The system includes a high bandwidth memory (HBM) divided into portions with memory cells.
  • A differentiated dynamic voltage and frequency scaling (DDVFS) device is used to control the temperature of specific sets of memory cells.
  • The temperature control is based on environmental signals corresponding to transistors within the memory cells.

Potential Applications

The technology could be applied in high-performance computing systems, data centers, and other applications where efficient memory management is crucial.

Problems Solved

This technology helps in optimizing the performance and reliability of memory cells by controlling their temperature based on environmental signals.

Benefits

The system ensures better performance and longevity of memory cells by dynamically adjusting their temperature as needed.

Potential Commercial Applications

Potential commercial applications include servers, supercomputers, and any other systems requiring high-speed and reliable memory management.

Possible Prior Art

Prior art may include similar systems using temperature control mechanisms for memory cells in high-performance computing environments.

== What are the potential environmental signals used for temperature control in memory cells? The potential environmental signals could include temperature sensors, voltage levels, and current measurements to monitor the operating conditions of the memory cells.

== How does the DDVFS device adjust the temperature of memory cells based on environmental signals? The DDVFS device likely modulates the voltage and frequency supplied to the memory cells to regulate their temperature according to the environmental signals received.


Original Abstract Submitted

a system includes a high bandwidth memory (hbm) arranged into portions including memory cells, the hbm further including a differentiated dynamic voltage and frequency scaling (ddvfs) device to perform the following: for a first set of one or more of the memory cells in a first one of the portions, the first set including a first one of the memory cells, controlling a temperature of the first set based on one or more first environmental signals corresponding to at least a first transistor in the first memory cell; and for a second set of one or more of the memory cells in a second one of the portions, the second set including a second one of memory cells, controlling a temperature of the second set based on one or more second environmental signals corresponding to at least a second transistor in the second memory cell.