Taiwan semiconductor manufacturing co., ltd. (20240162171). METHOD FOR FABRICATING DEVICE DIE simplified abstract
Contents
- 1 METHOD FOR FABRICATING DEVICE DIE
METHOD FOR FABRICATING DEVICE DIE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Tzuan-Horng Liu of Taoyuan City (TW)
Chia-Hung Liu of Hsinchu City (TW)
Hao-Yi Tsai of Hsinchu City (TW)
METHOD FOR FABRICATING DEVICE DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162171 titled 'METHOD FOR FABRICATING DEVICE DIE
Simplified Explanation
The abstract describes a patent application for a device die that includes two semiconductor dies, an anti-arcing layer, and an insulating encapsulant. The second semiconductor die is stacked over and connected to the first semiconductor die, with the anti-arcing layer in contact with the second semiconductor die and the insulating encapsulant encapsulating both dies.
- The device die includes a first semiconductor die and a second semiconductor die stacked and electrically connected.
- An anti-arcing layer is in contact with the second semiconductor die to prevent arcing.
- A first insulating encapsulant is placed over the first semiconductor die and encapsulates the second semiconductor die laterally.
Potential Applications
The technology described in this patent application could be applied in various electronic devices and systems where multiple semiconductor dies need to be stacked and insulated.
Problems Solved
This technology solves the problem of arcing between stacked semiconductor dies, which can damage the components and affect the performance of the device.
Benefits
The benefits of this technology include improved reliability and durability of electronic devices, as well as enhanced electrical insulation between stacked semiconductor dies.
Potential Commercial Applications
The technology could be used in the manufacturing of integrated circuits, microprocessors, memory modules, and other electronic components that require stacking of semiconductor dies with proper insulation.
Possible Prior Art
One possible prior art could be the use of insulating materials or coatings to protect semiconductor components from arcing or electrical interference. However, the specific combination of a stacked configuration with an anti-arcing layer and insulating encapsulant may be unique to this patent application.
Unanswered Questions
How does the anti-arcing layer prevent arcing between the semiconductor dies?
The abstract mentions the presence of an anti-arcing layer, but it does not provide details on the composition or mechanism of action of this layer.
What methods are used to fabricate the device dies with the described configuration?
While the abstract mentions methods for fabricating device dies, it does not specify the techniques or processes involved in creating the stacked configuration with the anti-arcing layer and insulating encapsulant.
Original Abstract Submitted
a device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. the second semiconductor die is stacked over and electrically connected to the first semiconductor die. the anti-arcing layer is in contact with the second semiconductor die. the first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. furthermore, methods for fabricating device dies are provided.
