Taiwan semiconductor manufacturing co., ltd. (20240162166). THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract
Contents
- 1 THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Sung-Hui Huang of Dongshan Township (TW)
Hsiang-Fan Lee of Hsinchu (TW)
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162166 titled 'THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
Simplified Explanation
The patent application describes a package with a device die, a metal cap, and a thermal interface material between them.
- The package includes a package component, a device die, a metal cap, and a thermal interface material.
- The thermal interface material has two portions - one directly over the device die and another extending over a corner region of the device die.
- The second portion of the thermal interface material is thicker than the first portion.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, such as microprocessors, where efficient heat dissipation is crucial.
Problems Solved
This technology helps in improving thermal management in electronic devices by enhancing heat transfer from the device die to the metal cap.
Benefits
- Enhanced thermal performance - Increased reliability of electronic devices - Improved overall efficiency of electronic systems
Potential Commercial Applications
Optimizing Thermal Management in Electronic Devices
Possible Prior Art
There may be prior art related to thermal interface materials used in electronic packaging, but specific examples are not provided in the abstract.
Unanswered Questions
How does the thickness of the second portion of the thermal interface material impact heat dissipation efficiency?
The abstract mentions that the second portion has a greater thickness than the first portion, but it does not elaborate on the specific effects of this difference on heat transfer.
Are there any specific materials mentioned for the thermal interface material in the patent application?
The abstract does not provide details on the specific materials used for the thermal interface material, which could be crucial for understanding the practical implementation of this technology.
Original Abstract Submitted
a package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. the thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. the first portion has a first thickness. the second portion has a second thickness greater than the first thickness.
