Taiwan semiconductor manufacturing co., ltd. (20240162051). COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION simplified abstract
Contents
- 1 COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Kuo-Ming Wu of Zhubei City (TW)
Hau-Yi Hsiao of Chiayi City (TW)
Kai-Yun Yang of Tainan City (TW)
Che Wei Yang of New Taipei City (TW)
Sheng-Chau Chen of Tainan City (TW)
Cheng-Yuan Tsai of Chu-Pei City (TW)
COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162051 titled 'COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION
Simplified Explanation
The patent application describes systems and techniques for fabricating a stacked die product using a supporting fill mixture with a combination of composite particulates to reduce thermally induced stresses and defects in the semiconductor substrates.
- The supporting fill mixture includes a combination of composite particulates in the lateral gap region and perimeter region of the stack of semiconductor substrates.
- One type of composite particulate has a smaller size and smooth surface, allowing it to ingress deep into the lateral gap region.
- The properties of the supporting fill mixture, including the combination of composite particulates, help control thermally induced stresses during manufacturing.
Potential Applications
The technology can be applied in the semiconductor industry for fabricating stacked die products with reduced defects and improved reliability.
Problems Solved
This technology addresses the issue of thermally induced stresses during manufacturing processes, which can lead to defects in the supporting fill mixture and semiconductor substrates.
Benefits
The use of the supporting fill mixture with composite particulates helps reduce the likelihood of defects, improving the overall quality and reliability of stacked die products.
Potential Commercial Applications
The technology can be utilized by semiconductor manufacturers to enhance the fabrication process of stacked die products, leading to higher quality and more reliable semiconductor devices.
Possible Prior Art
Prior art in the semiconductor industry may include techniques for reducing thermally induced stresses during manufacturing processes, but the specific use of a supporting fill mixture with a combination of composite particulates as described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing methods for reducing thermally induced stresses in semiconductor manufacturing processes?
This article does not provide a direct comparison to existing methods for reducing thermally induced stresses in semiconductor manufacturing processes. It would be beneficial to understand the specific advantages and limitations of this technology compared to traditional techniques.
What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?
The article does not address the potential cost implications of implementing this technology in semiconductor manufacturing processes. It would be important to evaluate the cost-effectiveness of using the supporting fill mixture with composite particulates compared to other methods.
Original Abstract Submitted
some implementations described herein include systems and techniques for fabricating a stacked die product. the systems and techniques include using a supporting fill mixture that includes a combination of types of composite particulates in a lateral gap region of a stack of semiconductor substrates and along a perimeter region of the stack of semiconductor substrates. one type of composite particulate included in the combination may be a relatively smaller size and include a smooth surface, allowing the composite particulate to ingress deep into the lateral gap region. properties of the supporting fill mixture including the combination of types of composite particulates may control thermally induced stresses during downstream manufacturing to reduce a likelihood of defects in the supporting fill mixture and/or the stack of semiconductor substrates.
