Taiwan Semiconductor Manufacturning Company, Ltd. Patent Application Trends in 2025
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Contents
- 1 Taiwan Semiconductor Manufacturning Company, Ltd. Patent Filing Activity
- 2 Taiwan Semiconductor Manufacturning Company, Ltd. patent applications in 2025
- 3 Top 10 Technology Areas
- 4 Emerging Technology Areas
- 5 Top Inventors
- 6 Patent Categories
- 7 Geographical Distribution of Inventors
- 8 Geographical Distribution of US Inventors
Taiwan Semiconductor Manufacturning Company, Ltd. Patent Filing Activity
Taiwan Semiconductor Manufacturning Company, Ltd. patent applications in 2025
Top 10 Technology Areas
- H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group)
- H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L21/6835 ({using temporarily an auxiliary support})
- H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors ()
- H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({)
- H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
- H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/02371 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2221/68359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2221/68345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
- Hao-Jan Pei (1 patent)
- Hsiu-Jen Lin (1 patent)
- Wei-Yu Chen (1 patent)
- Philip Yu-Shuan Chung (1 patent)
- Chia-Shen Cheng (1 patent)
- Kuei-Wei Huang (1 patent)
- Ching-Hua Hsieh (1 patent)
- Chung-Shi Liu (1 patent)
- Chen-Hua Yu (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Taiwan Semiconductor Manufacturning Company, Ltd. Inventor States 2025 - Up to 2025
Categories:
- Pages with broken file links
- Taiwan Semiconductor Manufacturning Company, Ltd.
- Companies
- CPC H01L25/50
- CPC H01L21/4853
- CPC H01L21/4857
- CPC H01L21/486
- CPC H01L21/568
- CPC H01L21/6835
- CPC H01L23/3128
- CPC H01L23/5384
- CPC H01L23/5389
- CPC H01L24/19
- CPC H01L24/20
- CPC H01L24/96
- CPC H01L25/105
- CPC H01L2221/68345
- CPC H01L2221/68359
- CPC H01L2221/68381
- CPC H01L2224/0231
- CPC H01L2224/02371
- CPC H01L2224/02379
- CPC H01L2224/211
- CPC H01L2225/1035
- CPC H01L2225/1058
- Patent Trends by Company in 2024