Taiwan Semiconductor Manufacturning Company, Ltd. Patent Application Trends in 2025
Taiwan Semiconductor Manufacturning Company, Ltd. Patent Filing Activity
Taiwan Semiconductor Manufacturning Company, Ltd. patent applications in 2025
Top 10 Technology Areas
- H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group)
- H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L21/6835 ({using temporarily an auxiliary support})
- H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors ()
- H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({)
- H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
- H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/02371 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2221/68359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2221/68345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
- Hao-Jan Pei (1 patent)
- Hsiu-Jen Lin (1 patent)
- Wei-Yu Chen (1 patent)
- Philip Yu-Shuan Chung (1 patent)
- Chia-Shen Cheng (1 patent)
- Kuei-Wei Huang (1 patent)
- Ching-Hua Hsieh (1 patent)
- Chung-Shi Liu (1 patent)
- Chen-Hua Yu (1 patent)
Patent Categories
Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
Taiwan Semiconductor Manufacturning Company, Ltd. Inventor States 2025 - Up to 2025
Categories:
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- Taiwan Semiconductor Manufacturning Company, Ltd.
- Companies
- CPC H01L25/50
- CPC H01L21/4853
- CPC H01L21/4857
- CPC H01L21/486
- CPC H01L21/568
- CPC H01L21/6835
- CPC H01L23/3128
- CPC H01L23/5384
- CPC H01L23/5389
- CPC H01L24/19
- CPC H01L24/20
- CPC H01L24/96
- CPC H01L25/105
- CPC H01L2221/68345
- CPC H01L2221/68359
- CPC H01L2221/68381
- CPC H01L2224/0231
- CPC H01L2224/02371
- CPC H01L2224/02379
- CPC H01L2224/211
- CPC H01L2225/1035
- CPC H01L2225/1058
- Patent Trends by Company in 2024