Samsung Electronics Co., Ltd. patent applications on November 14th, 2024
Patent Applications by Samsung Electronics Co., Ltd. on November 14th, 2024
Samsung Electronics Co., Ltd.: 160 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (11), H04W36/00 (8), H01L23/498 (7), G06F3/06 (6), H01L25/065 (6) H01L25/0657 (3), G06F3/0659 (3), H04N19/174 (3), H04W72/40 (3), H04W64/00 (2)
With keywords such as: device, layer, including, based, semiconductor, information, configured, surface, memory, and substrate in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Sungpil HONG of Suwon-si (KR) for samsung electronics co., ltd., Heejin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeeyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonho KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeonkyoung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Yongwon JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A01N43/84, A01N41/10, A01N43/38, A01N43/90, A01N59/14, A01N59/26, A01P1/00
CPC Code(s): A01N43/84
Abstract: a composition may include an organic dye that reacts with a visible light and generates singlet oxygen, and an ionic liquid including an ion expressing a hydrophobic property. the ion expressing the hydrophobic property may have an opposite electric charge to an electric charge included by the organic dye in an ionized state. other than the above, various embodiments are possible.
Inventor(s): Jongin PARK of Suwon-si (KR) for samsung electronics co., ltd., Hwan SHIM of Suwon-si (KR) for samsung electronics co., ltd., Hongji LEE of Suwon-si (KR) for samsung electronics co., ltd., Taehan JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/00, G06F18/25, G06V40/10, G06V40/50
CPC Code(s): A61B5/744
Abstract: an example electronic device may include a sensor module, a camera module, a display device, and a processor, wherein the processor can be configured to: execute an application; acquire a user's first biometric information on the basis of the sensor module while the operation relating to the application is performed; estimate a user's health information at least one the basis of the first biometric information, and link the health information with the operation relating to the application so as to display same through the display device.
Inventor(s): DONGHYUN KIM of Suwon-si (KR) for samsung electronics co., ltd., JONGSEONG KO of Suwon-si (KR) for samsung electronics co., ltd., DAEYONG KIM of Suwon-si (KR) for samsung electronics co., ltd., JISU KIM of Suwon-si (KR) for samsung electronics co., ltd., PYUNGKANG KIM of Suwon-si (KR) for samsung electronics co., ltd., KIHONG PARK of Suwon-si (KR) for samsung electronics co., ltd., JUNGJUN PARK of Suwon-si (KR) for samsung electronics co., ltd., JUNGJOON PARK of Suwon-si (KR) for samsung electronics co., ltd., JOOYOUNG PARK of Suwon-si (KR) for samsung electronics co., ltd., JUNHYEOK PARK of Suwon-si (KR) for samsung electronics co., ltd., HOSEOK SONG of Suwon-si (KR) for samsung electronics co., ltd., CHIHO AHN of Suwon-si (KR) for samsung electronics co., ltd., KONGWOO LEE of Suwon-si (KR) for samsung electronics co., ltd., HYUNYOUNG LEE of Suwon-si (KR) for samsung electronics co., ltd., CHUYOUNG CHOUNG of Suwon-si (KR) for samsung electronics co., ltd., JEONGMIN HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B23P19/06, B23Q5/10
CPC Code(s): B23P19/069
Abstract: a fastening device includes: a support portion including a first end portion, and a second end portion, and a central portion between the first and second end portions; a first pulley, a second pulley, and a third pulley rotatably disposed on the central portion, the first end portion, and the second end portion, respectively; a first connection portion and a second connection portion respectively rotatably disposed on the first and second end portions and respectively connected to the second and third pulleys; a first fastening tool and a second fastening tool respectively connected to the first and second connection portions; and a motor connected to the first pulley, wherein a force generated by the motor and provided to the first pulley is at least partially transmitted to the second and third pulleys to vary a distance between the first and second fastening tools.
Inventor(s): Jongkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Minyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Seounghyun SEOK of Suwon-si (KR) for samsung electronics co., ltd., Jinho SO of Suwon-si (KR) for samsung electronics co., ltd., Jaehwa YANG of Suwon-si (KR) for samsung electronics co., ltd., Heedoo YANG of Suwon-si (KR) for samsung electronics co., ltd., Hyungho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/00, B25J5/00, B25J9/16, B25J15/08, B25J19/00, B67B7/18
CPC Code(s): B25J9/0084
Abstract: a chemical drum replacement apparatus includes an automated robotic assembly configured to attach or detach a drum cap and a coupler module to or from a chemical drum and a transfer robotic assembly configured to transfer the chemical drum, where the automated robotic assembly includes a travelling module configured to move the automated robotic assembly, a manipulator on an upper surface of the travelling module, and a gripper at an end of the manipulator, the gripper configured to attach or detach the drum cap and the coupler module to or from the chemical drum.
Inventor(s): Jungjoon Park of Suwon-si (KR) for samsung electronics co., ltd., Jongseong Ko of Suwon-si (KR) for samsung electronics co., ltd., Daeyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Donghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jisu Kim of Suwon-si (KR) for samsung electronics co., ltd., Pyungkang Kim of Suwon-si (KR) for samsung electronics co., ltd., Kihong Park of Suwon-si (KR) for samsung electronics co., ltd., Jungjun Park of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Junhyeok Park of Suwon-si (KR) for samsung electronics co., ltd., Hoseok Song of Suwon-si (KR) for samsung electronics co., ltd., Chiho Ahn of Suwon-si (KR) for samsung electronics co., ltd., Kongwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Chuyoung Choung of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B25J15/00, B25J13/08
CPC Code(s): B25J15/0028
Abstract: an in-chamber maintenance apparatus may include a stage module including a stage body in a chamber having a hollow interior, an xy stage mounted on an upper surface of the stage body and movable in an x-axis and a y-axis direction perpendicular to each other, and a first driving portion configured to drive the xy stage, and a gripper module including a gripper body coupled to an upper surface of the xy stage, a gripping portion supported by the gripper body and configured to move up and down and rotate with respect to a z-axis perpendicular to the x-axis and the y-axis to be inserted into the hollow interior, and a second driving portion configured to drive the gripping portion.
20240375890. Q293851_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongseong KO of Suwon-si (KR) for samsung electronics co., ltd., Daeyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisu KIM of Suwon-si (KR) for samsung electronics co., ltd., Pyungkang KIM of Suwon-si (KR) for samsung electronics co., ltd., Kihong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungjun PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungjoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Junhyeok PARK of Suwon-si (KR) for samsung electronics co., ltd., Hoseok SONG of Suwon-si (KR) for samsung electronics co., ltd., Chiho AHN of Suwon-si (KR) for samsung electronics co., ltd., Kongwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Chuyoung CHOUNG of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65G49/00, B25J11/00, H01L21/67
CPC Code(s): B65G49/00
Abstract: a maintenance automation equipment includes: a first module comprising: a first support supporting a modular device, a fastening device configured to separate or fasten the modular device, a first inspector comprising a camera, and a first transporter, wherein the fastening device and the first inspector are at one end of the first transporter; a second module comprising: a second support, a cleaning device configured to spray a chemical toward the second support, a second inspector comprising an optical camera, and a second transporter, wherein the cleaning device and the second inspector are at one end of the second transporter; a transport module comprising an inter-module transporter; a first storage module; and a second storage module.
20240376604. SUBSTRATE PROCESSING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunjoong Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongchan Lee of Pyeongtaek-si (KR) for samsung electronics co., ltd., Junho Lee of Pyeongtaek-si (KR) for samsung electronics co., ltd., Jinman Park of Pyeongtaek-si (KR) for samsung electronics co., ltd., Sengyeop Kim of Pyeongtaek-si (KR) for samsung electronics co., ltd., Youngjoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Seounghwan Byun of Suwon-si (KR) for samsung electronics co., ltd., Hana Seu of Suwon-si (KR) for samsung electronics co., ltd., Sunjoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Cheoljae Lee of Suwon-si (KR) for samsung electronics co., ltd., Dongchul Choi of Pyeongtaek-si (KR) for samsung electronics co., ltd.
IPC Code(s): C23C16/46, H01J37/32
CPC Code(s): C23C16/46
Abstract: a substrate processing apparatus includes a processing chamber including a processing space where a substrate is processed and a heater provided in the process chamber to support the substrate and configured to heat the substrate, wherein the heater includes a body, a first protrusion portion protruding upward in a vertical direction from a center of the body, and a second protrusion portion protruding upward from a center of the first protrusion portion, first embossings are formed in a region which does not overlap the first protrusion portion in a vertical direction on an upper surface of the body, second embossings are formed in a region which does not overlap the second protrusion portion in a vertical direction on an upper surface of the first protrusion portion, and third embossings are formed on an upper surface of the second protrusion portion.
Inventor(s): Baekgyu KWON of Suwon-si (KR) for samsung electronics co., ltd., Kwangmin CHUN of Suwon-si (KR) for samsung electronics co., ltd., Eunyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Doyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/02, D06F39/08, D06F39/12
CPC Code(s): D06F39/022
Abstract: a washing machine includes a cabinet, a tub disposed within the cabinet, and a detergent supplier configured to supply detergent to the tub, wherein the detergent supplier includes a detergent container, and a detergent pump dockable with the detergent container, the detergent pump includes a first case including a detector having at least a portion located within the detergent container, an inlet portion formed to allow detergent to be introduced from the detergent container, and an outlet portion formed to allow the detergent introduced through the inlet portion to be discharged, a second case couplable to the first case, the second case including a terminal electrically connectable to the detector, and a pump configured to draw in detergent through the inlet portion and discharge the drawn-in detergent through the outlet portion.
Inventor(s): Kwangmin CHUN of Suwon-si (KR) for samsung electronics co., ltd., Baekgyu KWON of Suwon-si (KR) for samsung electronics co., ltd., Geonhui JO of Suwon-si (KR) for samsung electronics co., ltd., Byeongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Doyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/02, D06F23/02, F04B13/00, F04B49/16, F16K15/14
CPC Code(s): D06F39/022
Abstract: a washing machine including a cabinet, a drum forming a laundry room, and a detergent supply apparatus, to supply detergent to the laundry room, and including a detergent container forming a detergent receiving space and a detergent pump coupleable to and decouplable from the detergent container and configured to pump detergent accommodated in the detergent receiving space. the detergent pump comprises a pumping portion including a compression space having a volume controllable to be varied such that the detergent accommodated in the detergent receiving space is drawn into an inner side of the detergent pump or is discharged to an outer side of the detergent pump as the volume of the compression space is varied. the detergent pump comprises a detergent discharge flow path connectable to the compression space to allow the detergent discharged from the compression space to move to the outer side of the detergent pump.
20240377068. COOKING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjin JANG of Suwon-si (KR) for samsung electronics co., ltd., Soonmin LIM of Suwon-si (KR) for samsung electronics co., ltd., Eunji JO of Suwon-si (KR) for samsung electronics co., ltd., Byounghoon MOON of Suwon-si (KR) for samsung electronics co., ltd., Sangwon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24C3/08, F23D14/04
CPC Code(s): F24C3/087
Abstract: a cooking apparatus can include a main body including at least one opening, the main body forming a cooking chamber, a burner in the main body to heat the cooking chamber, and a silencer mounted to the main body and covering the at least one opening so that: air from an outside of the main body is passable through the silencer and the at least one opening to be supplied to the burner, and noise generated by the burner, and discharged through the silencer and the at least one opening to the outside of the main body, is reduced by the silencer.
20240377113. DUAL CHILLER SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gibong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hackwon Hwang of Suwon-si (KR) for samsung electronics co., ltd., Kukil Lee of Suwon-si (KR) for samsung electronics co., ltd., Daesung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaewon Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jinyeob Jang of Suwon-si (KR) for samsung electronics co., ltd., Teacksoo Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25B41/20, F25B7/00
CPC Code(s): F25B41/20
Abstract: a dual chiller system includes a high-temperature tank configured to supply a first coolant of a first temperature to the outside, a low-temperature tank configured to supply a second coolant of a second temperature lower than the first temperature to the outside, a first automatic inlet valve and a second automatic inlet valve respectively connected to the high-temperature tank and the low-temperature, a first substrate processing device configured to receive the first coolant or the second coolant from the first automatic inlet valve and a second substrate processing device configured to receive the first coolant or the second coolant from the second automatic inlet valve, a cooling unit and a system controller.
Inventor(s): Jun Yeob KIM of Suwon-si (KR) for samsung electronics co., ltd., Jin Ryeong PARK of Hwaseong-si (KR) for samsung electronics co., ltd., Sol Lee HWANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01B11/27
CPC Code(s): G01B11/272
Abstract: an overlay measurement device includes: a light source configured to direct an illumination to an overlay measurement target in which a first overlay key formed in a first layer and a second overlay key formed in a second layer stacked on an upper portion of the first layer are positioned, a lens assembly having an objective lens and a lens focus actuator, a detector configured to obtain a focus image, and a controller configured to control the lens assembly to acquire depth-specific focus images of the overlay measurement target, extract a plurality of candidate focuses from the acquired depth-specific focus images, and select an optimal focus by applying predetermined parameter to the plurality of candidate focuses.
Inventor(s): Jinwoo YOO of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk KOH of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Donghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung SON of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd., Yonggu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01C21/36, G06Q30/0251, G06T7/73, G06T19/00, G06V20/20
CPC Code(s): G01C21/3679
Abstract: a method of displaying a nearby point of interest (poi) using augmented reality and an electronic device thereof. an operation method of an electronic device includes acquiring a preview video, acquiring location information of the electronic device; acquiring information on at least one poi located in a vicinity, selecting a focus poi among at least one poi; determining first information to be provided to a user for general pois, determining second information including more information than the first information to be provided to the user for the focus poi; determining a location on a screen on which the preview video in which the information on the at least one poi is to be displayed, and displaying the first information or the second information on the location on the screen on which the determined preview video of all or some of the at least one poi is provided.
Inventor(s): Yunsong Jeong of Suwon-si (KR) for samsung electronics co., ltd., Jawon Ko of Suwon-si (KR) for samsung electronics co., ltd., Jongwha Lee of Suwon-si (KR) for samsung electronics co., ltd., Taijo Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01J3/28, G01J3/51
CPC Code(s): G01J3/2823
Abstract: a sensor device includes a lower substrate, an upper substrate disposed on the lower substrate, formed of a material different from a material of the lower substrate, and including a plurality of light-receiving regions disposed in different positions, a plurality of optical members disposed between the lower substrate and the upper substrate, and configured to be generated in a plasma formed in a space above the upper substrate and to provide a traveling path of light entering the plurality of light-receiving regions, a spectrum sensor configured to detect intensity of light received through each of the plurality of optical members in a predetermined wavelength band, a controller configured to generate raw data including intensity of light according to the wavelength band by matching the raw data with each of the plurality of light-receiving regions.
Inventor(s): Haeri Park HANANIA of Sierra Madre CA (US) for samsung electronics co., ltd., Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Mahsa TORFEH of Los Angeles CA (US) for samsung electronics co., ltd., Yibing Michelle WANG of Temple City CA (US) for samsung electronics co., ltd.
IPC Code(s): G02B5/18, B82Y20/00, G02B1/00, G02B1/118
CPC Code(s): G02B5/1866
Abstract: a diffractive optical element (doe) includes a substrate layer; and a nanostructure layer comprising nanostructures having a predetermined periodicity ranging from 0.75� to 3� of a target wavelength �. the nanostructures are pillar-shaped nanostructures formed on a surface of the substrate layer, holes formed in the substrate layer, or a combination thereof. at least one nanostructure has a plan-view cross-sectional shape of a circle, an oval, a square, or a rectangle. the plan-view cross-sectional shape of at least one nanostructure includes a rounded corner having a corner radius selected based on a desired light dot nonuniformity of a diffraction pattern generated by the doe. when the nanostructures are pillar-shaped, a refractive index of the nanostructures is greater than a refractive index of the substrate layer. when the nanostructures are holes, a refractive index of the nanostructures is less than a refractive index of the substrate layer.
Inventor(s): Seaum KIM of Seoul (KR) for samsung electronics co., ltd., Hyunsung Park of Suwon-si (KR) for samsung electronics co., ltd., Seunghoon Han of Seoul (KR) for samsung electronics co., ltd., Hyeonsoo Park of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G02B13/00, G02B1/00, G02B27/00
CPC Code(s): G02B13/003
Abstract: an optical hybrid lens includes a refractive lens having a curved lens surface, a metalens including at least one metasurface formed on the curved lens surface to follow the curved lens surface of the refractive lens and including a plurality of nanostructures having a shape dimension of a sub-wavelength of incident light, and an adhesive layer between the curved lens surface of the refractive lens and the metalens. the metalens includes at least one metasurface including a plurality of nanostructures having a shape dimension of a sub-wavelength of incident light.
Inventor(s): Haeri Park HANANIA of Sierra Madre CA (US) for samsung electronics co., ltd., Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Yibing Michelle WANG of Temple City CA (US) for samsung electronics co., ltd.
IPC Code(s): G02F1/29
CPC Code(s): G02F1/292
Abstract: a diffractive optical pattern generator includes a diffractive optical element layer, and a nanostructure layer configured for beam steering an input light applied to the diffractive optical pattern generator to at least one of a polar beam-steering angle that is measured in a plane that is substantially normal to a direction of the input light and an azimuth beam-steering angle measured with respect to the direction of the input light. a dynamic transmission layer may be included in which at least one region of the dynamic transmission layer may be selectively controllable to transmit light through or to block light from passing through the dynamic transmission layer. the nanostructure layer may include nanostructures having a periodicity ranging from 0.75 � to 3 � of a target wavelength �. the nanostructure layer may be configured to beam steer light input to the doe layer or beam steer light output from the doe layer.
Inventor(s): Jooyoung Song of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Hye-Reun Kim of Suwon-si (KR) for samsung electronics co., ltd., Mingi Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/039, G03F7/004, G03F7/09, G03F7/16
CPC Code(s): G03F7/0392
Abstract: provided are positive type photoresist compositions including a polymer resin, a crosslinking agent, and a photoacid generator, wherein the polymer resin includes a main chain including a linking group decomposable under acidic conditions and a thermally crosslinkable functional group linked to the main chain and the crosslinking agent includes a functional group capable of reacting with the thermally crosslinkable functional group. the photoresist compositions of the present disclosure can be coated multiple times to realize a high-thickness photoresist film.
Inventor(s): Jun Yeob KIM of Suwon-si (KR) for samsung electronics co., ltd., Woo Yong LIM of Suwon-si (KR) for samsung electronics co., ltd., Ji Yun JUNG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70633
Abstract: an overlay measurement device includes a light source configured to direct an illumination to an overlay measurement target in which a first overlay key in a first layer and a second overlay key in a second layer are positioned, the second layer being stacked on an upper portion or a lower portion of the first layer, a lens assembly including an objective lens configured to condense the illumination on a measurement position of at least one point in the overlay measurement target and a lens focus actuator configured to control a distance between the objective lens and the overlay measurement target, and a detector configured to acquire a focus image at the measurement position based on a beam reflected on the measurement position.
Inventor(s): Hyunwoong HWANG of Suwon-si (KR) for samsung electronics co., ltd., Yongsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yonghoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Won KANG of Suwon-si (KR) for samsung electronics co., ltd., Dong-Wook KIM of Suwon-si (KR) for samsung electronics co., ltd., Seok HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/706845
Abstract: a photolithography apparatus according to an embodiment includes an exposure portion performing an exposure process, a plurality of track portions each performing a coating process and a developing process, and an interface portion connecting the exposure portion and the plurality of track portions to transfer a substrate on which a photolithography process is performed between the exposure portion and the plurality of track portions.
Inventor(s): Yilin Shen of San Jose CA (US) for samsung electronics co., ltd., Kaiwen Zhou of Santa Cruz CA (US) for samsung electronics co., ltd., Hongxia Jin of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G05D1/02, G06F40/40, G06T7/70, G06V20/50
CPC Code(s): G05D1/0274
Abstract: a method includes determining a specified object to locate within a surrounding environment. the method also includes causing a robot to capture an image and a depth map of the surrounding environment. the method further includes using a scene understanding model, predicting one or more rooms and one or more objects captured in the image. the method also includes updating a second map of the surrounding environment based on the predicted rooms, the predicted objects, the depth map, and a location of the robot. the method further includes determining a likelihood of the specified object being in a candidate room and a likelihood of the specified object being near a candidate object using a pre-trained large language model. the method also includes causing the robot to move to a next location for the robot to search for the specified object, based on the likelihoods and the second map.
20240377840. AUTOMATIC GUIDED VEHICLE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daehyun Yoon of Suwon-si (KR) for samsung electronics co., ltd., Jungjun Park of Suwon-si (KR) for samsung electronics co., ltd., Jongbeom Park of Suwon-si (KR) for samsung electronics co., ltd., Kongwoo Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/656, G05D105/20, G05D107/70
CPC Code(s): G05D1/656
Abstract: an automatic guided vehicle assembly includes a non-powered cart having a shelf unit configured to receive parts or tools, and an automated guided vehicle configured to attach and detach from the non-powered cart and configured to perform autonomous driving, wherein the automated guided vehicle includes a fastening pin configured to move upwardly and downwardly to attach to or detach the automated guided vehicle from the non-powered cart, wherein the non-powered cart includes a fastening unit configured to attach to and detach from the automated guided vehicle, and wherein the fastening unit includes a fastening member having a fastening guide configured to guide coupling of the fastening pinto the fastening unit.
Inventor(s): IKSU LEE of SUWON-SI (KR) for samsung electronics co., ltd., JUNGYU GO of SUWON-SI (KR) for samsung electronics co., ltd., SEKI KIM of SUWON-SI (KR) for samsung electronics co., ltd., YOOSEOK SHON of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3296, G06F1/20, G06F15/78
CPC Code(s): G06F1/3296
Abstract: a system-on-chip (soc) includes a processor connected to a plurality of switches that are configured to adjust a supply voltage to the processor, a regulator configured to apply a control signal for controlling at least one of the plurality of switches, and a voltage droop detector connected to the regulator and the processor and configured to transmit a voltage droop detection signal to the regulator when a voltage droop is detected from the processor. the regulator may turn on a predetermined number of switches, among the plurality of switches, based on the control signal when receiving the voltage droop detection signal.
Inventor(s): Haemi YOON of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Minji CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G02B27/01, G06F3/04845, G06T19/20
CPC Code(s): G06F3/017
Abstract: according to an embodiment, at least one processor, comprising processing circuitry, of a wearable device, individually and/or collectively, is configured to: control a display to display, based on identifying the body part in a specified posture for moving the virtual object, the virtual object moved along a path of the body part moved in a fov of a camera; control the display to display, based on identifying the body part moved outside of the fov through a first position of an edge of the fov, a virtual object in a second position within the virtual space corresponding to the first position; and based on displaying the virtual object in the second position, control the display to display, based on identifying the body part in the preset posture moved inside of the fov, the virtual object moved from the second position and moved along a path of the body part within the fov.
Inventor(s): Yeonwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Sehyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Donguk Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/02, G06F3/041, G06F3/04817, G06F3/04842, G06F3/04847
CPC Code(s): G06F3/0205
Abstract: an electronic apparatus may include: a communication interface configured to communicate with an external apparatus; a display; at least one memory storing instructions; and at least one processor operatively connected to the at least one memory. the at least one processor may be configured to execute the instructions to: based on content being output on the display, transmit first user interface (ui) information corresponding to a ui related to control of the content to the external apparatus through the communication interface, control the display to output a first control ui together with the content based on the first ui information, and based on a user input being received through a second control ui output on the external apparatus based on the first ui information, control the display to output a guide ui in an input location corresponding to the user input together with the content and the first control ui.
Inventor(s): Jaeho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seonghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangtaek WOO of Suwon-si (KR) for samsung electronics co., ltd., Changho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/0354
CPC Code(s): G06F3/04162
Abstract: a notification and connection method for an electronic pen is provided. aspects include receiving a touch input of a first electronic pen to a display, identifying whether the first electronic pen is connected to an electronic device through a communication module in response to receiving the touch input, and identifying whether a second electronic pen is connected to the electronic device in response to identifying that the first electronic pen is not connected to the electronic device. aspects also include transmitting a notification signal to the second electronic pen in response to identifying that the second electronic pen connected to the electronic device is present and establishing communication connection with the first electronic pen in response to identifying that the second electronic pen is not connected to the electronic device.
Inventor(s): Na Yeong BYEON of Suwon-si (KR) for samsung electronics co., ltd., Jun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Eu Moon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482, F24F11/52, G06F3/0484, G06F9/451
CPC Code(s): G06F3/0482
Abstract: a display device according to one embodiment of the present invention comprises an input unit, a storage unit, a display unit for displaying a menu for providing at least one function, and a control unit, which generates a user pattern, including function information corresponding to an execution command and information about the time at which the execution command was received, when receiving the execution command from a user, controls the storage unit so as to store the generated user pattern, reconfigures the menu on the basis of the user pattern, and controls the display unit so as to display the reconfigured menu.
Inventor(s): Tong Zhang of Mountain View CA (US) for samsung electronics co., ltd., Zongwang Li of Dublin CA (US) for samsung electronics co., ltd., Da Zhang of Fremont CA (US) for samsung electronics co., ltd., Rekha Pitchumani of Oak Hill VA (US) for samsung electronics co., ltd., Yang Seok Ki of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0607
Abstract: systems and methods for cache management of a storage device are disclosed. the storage device is configured to receive a first code provided by a computing device; execute the first code; perform a first update of the first storage medium based on the first code; receive a second code provided by the computing device; execute the second code; and perform a second update of the first storage medium based on the second code.
Inventor(s): Yiwen ZHANG of XiAn (CN) for samsung electronics co., ltd., Yanlong YANG of XiAn (CN) for samsung electronics co., ltd., Yuqi ZHANG of XiAn (CN) for samsung electronics co., ltd., Xing HE of XiAn (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0608
Abstract: provided are a compaction method and device for sorted string table (sst) files stored in zones of a zoned namespace solid state drive. the method includes: determining compaction priorities of a first plurality of sst files in a first level of a lsm-tree based on attribute information of a first plurality of zones corresponding to the first plurality of sst files and a second plurality of sst files in a second level of the lsm-tree, wherein the second level is adjacent and higher to the first level, a key range of the first plurality of sst files overlaps key ranges of sst files in the second level, and a key range of the second plurality of sst files overlaps key ranges of the first plurality of sst files. the method includes performing a compaction operation on an sst file having a highest compaction priority among the first plurality of sst files.
Inventor(s): Tong Zhang of Mountain View CA (US) for samsung electronics co., ltd., Zongwang Li of Dublin CA (US) for samsung electronics co., ltd., Da Zhang of Fremont CA (US) for samsung electronics co., ltd., Byung Choi of Fremont CA (US) for samsung electronics co., ltd., Rekha Pitchumani of Oak Hill VA (US) for samsung electronics co., ltd., Yang Seok Ki of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: systems and methods for prefetching data are disclosed. a processor in communication with a storage device identifies a first address. the processor identifies a first setting associated with the first address. the processor issues a first command to a first storage medium of the storage device based on the first setting. the first command is for performing a first type of memory read. the storage device is configured to retrieve first data associated with the first address in the first storage medium, to a second storage medium of the storage device, based on the first command.
Inventor(s): Anantha SHARMA of Bengaluru (IN) for samsung electronics co., ltd., Pandi KANNIAH of Bengaluru (IN) for samsung electronics co., ltd., Sharath Kumar KODASE of Bengaluru (IN) for samsung electronics co., ltd., Suman Prakash BALAKRISHNAN of Bengaluru (IN) for samsung electronics co., ltd., Sandeep Kumar ANANTHAPALLI of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: example embodiments of the present disclosure disclose method and system for performing read/write operations in nand memory. a memory controller of the nand memory receives write request from host controller to write data present in set of support cell blocks of nand memory into a ‘n’-level cell block of nand memory. the write request includes information about mapping between set of support cell blocks and ‘n’-level cell block. the mapping between set of support cell blocks and ‘n’-level cell block is used to update l2p table (). further, memory controller performs copyback operation on set of support cell blocks for writing data to ‘n’-level cell block based on l2p table using nand latches. on receiving read request, host controller retrieves data from at least one support cell block associated with ‘n’-level cell block based on mapping on determining ‘n’-level cell block is listed in active block list.
Inventor(s): SOOYONG LEE of Suwon-si (KR) for samsung electronics co., ltd., JAE HYUN CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a memory device may include a memory cell array including first to fourth memory cells respectively connected to first to fourth word lines, a sense amplifier including a first sensing circuit that is configured to generate a first weighted sum based on a first weight stored in the first memory cell and a second weight stored in the third memory cell, in response to an activation of the first and third word lines at a first time point, an input and output circuit that is configured to output the first weighted sum to an external device in response to a first read command, and a restore circuit that is configured to perform a restore operation for storing a first data item stored in the second memory cell to the first memory cell and for storing a second data item stored in the fourth memory cell to the third memory cell after the first time point.
Inventor(s): Yangxu Zhou of XiAn (CN) for samsung electronics co., ltd., Fei Dong of XiAn (CN) for samsung electronics co., ltd., Kun Xue of XiAn (CN) for samsung electronics co., ltd.
IPC Code(s): G06F9/50
CPC Code(s): G06F9/5016
Abstract: a host, a storage device, and a data processing method of the host and the storage device are disclosed. the data processing method of a storage device includes receiving a query request involving a scan-filter task from a host, determining whether a computing resource within the storage device is saturated, with respect to the scan-filter task, determining whether the storage device is needed to perform a scan-filter operation, based on determining that the computing resource within the storage device is not saturated, performing the scan-filter operation on raw data within the storage device to obtain processed data, based on determining that the storage device is needed to perform the scan-filter operation and transmitting the processed data to the host.
Inventor(s): Hanju Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/50
CPC Code(s): G06F9/5016
Abstract: a method of scheduling an input/output request for a main memory includes acquiring information of a plurality of memory devices included in the main memory, measuring a plurality of latencies of the plurality of memory devices, respectively, per unit data size of a type of each memory device, grouping the plurality of memory devices into a plurality of memory groups, determining a size of a time window to be periodically repeated, setting a target processing size of each memory group, based on the size of the time window and a latency of each memory group, allocating a credit value of each memory group for each time window, based on the target processing size of each memory group, and processing a plurality of input/output requests queued in an input/output queue associated with a corresponding memory group of the plurality of memory groups using the allocated credits of each memory group.
Inventor(s): Byung Hee Choi of Fremont CA (US) for samsung electronics co., ltd., Changho Choi of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0815, G06F1/12
CPC Code(s): G06F12/0815
Abstract: a system includes: a group of memory resources including a first memory node and a second memory node, the first memory node being connected to the second memory node over a switching fabric; and a synchronous clock source connected to the first memory node and the second memory node, the synchronous clock source to provide a synchronized clock signal to the first memory node and the second memory node to synchronize the first memory node with the second memory node. the first memory node and the second memory node are to encode memory data and decode encoded memory data using the synchronized clock signal.
Inventor(s): Tong Zhang of Mountain View CA (US) for samsung electronics co., ltd., Zongwang Li of Dublin CA (US) for samsung electronics co., ltd., Da Zhang of Fremont CA (US) for samsung electronics co., ltd., Rekha Pitchumani of Oak Hill VA (US) for samsung electronics co., ltd., Yang Seok Ki of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0862
CPC Code(s): G06F12/0862
Abstract: systems and methods for prefetching data are disclosed. a processor executes a first command for moving first data stored in a storage device. based on the first command, the processor stores, into a first queue of the storage device, a first address associated with the first data. the storage device further retrieves the first address from the first queue, retrieves the first data from the first storage medium based on the first address, and stores the first data to the second storage medium. in some embodiments, a process for prefetch optimization is also disclosed. a processor identifies a value for prefetching data. the processor runs an application, measures performance of the application, modifies the value based on the performance, and determines that the performance satisfies a criterion.
Inventor(s): Baibhav Singh of Cupertino CA (US) for samsung electronics co., ltd., Hayawardh Vijayakumar of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F21/62, G06F21/60
CPC Code(s): G06F21/62
Abstract: in one embodiment, a method includes applying, by a security program executing on a computing device, a set of rules for one or more system resources of the computing device. each rule defines access to at least one of the system resources. the method includes receiving, by the computing device, a request from a process on the computing device to access at least one of the system resources identified in the set of rules; transmitting, by the computing device, an access request to a second security program executing on a second computing device; receiving, from the second security program, a response to the access request; and providing, by the security program and to the process on the computing device, access to the at least one system resource according to the received response.
Inventor(s): Junsu Hwang of Suwon-si (KR) for samsung electronics co., ltd., Kyehyun Kyung of Suwon-si (KR) for samsung electronics co., ltd., Jiwon Park of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan Yang of Suwon-si (KR) for samsung electronics co., ltd., Dongvin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/34, G06F30/333
CPC Code(s): G06F30/34
Abstract: a server includes an interface, a database and a proposal list generating circuit. the interface is connected to a customer device and user devices through a network and receives a production request of a product from the customer device and receives component parameter from the user devices, the component parameter each including a supportable specification of a component related to semiconductor production. the database stores the component parameter. the proposal list generating circuit classifies components for the production of the product indicated in the production request based on the supportable specification of the component parameter, determines one or more bottleneck components based on component parameter among the component parameter that match the classified components, and generates one or more proposal lists based on the one or more bottleneck components. the one or more proposal list is transmitted to the customer device through the interface.
Inventor(s): Ki-Ok Kim of Suwon-si (KR) for samsung electronics co., ltd., Yongjin Hong of Suwon-si (KR) for samsung electronics co., ltd., Mijeong Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/3947
CPC Code(s): G06F30/3947
Abstract: an example embodiment provides a design method of an integrated circuit, including: placing a through-via; determining a keep-out zone around the through-via based on a saturated current variation rate according to a distance from the through-via; placing standard cells; determining a cell placed within the keep out zone among the cells; and setting a timing margin based on the distance from the through-via to the cell.
Inventor(s): Seokpyo HONG of Suwon-si (KR) for samsung electronics co., ltd., Bochang MOON of Gwangju (KR) for samsung electronics co., ltd., Nahyup KANG of Suwon-si (KR) for samsung electronics co., ltd., Hajin CHOI of Gwangju (KR) for samsung electronics co., ltd., Inwoo HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T5/70, G06T15/00, G06T15/20
CPC Code(s): G06T5/60
Abstract: an electronic device and operating method for removing a noise of an image are disclosed. a method of operating an electronic device includes generating a common input including an initial image and geometry buffer (g-buffer) images rendered according to a view point of a current frame, generating a third input and a fourth input based on a first input and a second input, determining a bandwidth for filtering noise of the initial image based on the common input and one of the third input and the fourth input, and outputting a target image obtained by removing noise from the initial image of the current frame based on the common input, the third input, the fourth input, and the bandwidth.
Inventor(s): Jungmin LEE of Suwon-si (KR) for samsung electronics co., ltd., Taekeun KANG of Suwon-si (KR) for samsung electronics co., ltd., Gihyeon BAE of Suwon-si (KR) for samsung electronics co., ltd., Sangwook BAEK of Suwon-si (KR) for samsung electronics co., ltd., Sangwon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T5/50, G06T7/00, G06T7/70, G06T7/90, G06V40/16
CPC Code(s): G06T5/60
Abstract: an electronic device for improving the quality of an input image includes: a memory storing at least one instruction, and at least one processor, by executing the at least one instruction, configured to calculate a degree of deterioration of the input image, and determine whether the degree of deterioration is greater than a predetermined value. when the degree of deterioration of the input image is greater than the predetermined value, the at least one processor may be further configured to detect at least one facial image included in the input image, generate region information indicating a position and a type of at least one region included in the at least one facial image, generate a quality-improved facial image via an artificial neural network (ann) that uses the input image and the region information, and generate an output image by combining the quality-improved facial image with the input image.
Inventor(s): Wookhyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jayoon KOO of Suwon-si (KR) for samsung electronics co., ltd., Namuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Ilhyun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T5/20, G06V10/771
CPC Code(s): G06T7/0002
Abstract: provided are an electronic apparatus for evaluating the quality of an image and an operating method of the electronic apparatus. the electronic apparatus includes a memory in which at least one instruction is stored and at least one processor configured to execute the at least one instruction stored in the memory to obtain the image, extract a feature map including a feature of the image based on the image, calculate a quality score for each reference region of the image based on the extracted feature map, calculate an importance for each reference region of the image based on the extracted feature map, and evaluate the quality of the image according to a final quality score of the image calculated based on the quality score for each reference region and the importance for each reference region.
Inventor(s): Daesung CHO of Suwon-si (KR) for samsung electronics co., ltd., Daeeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongjoe KIM of Suwon-si (KR) for samsung electronics co., ltd., Taejun PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangjo LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyuha CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T9/00, G06N3/045, G06T3/4046, G06T7/00
CPC Code(s): G06T9/002
Abstract: an artificial intelligence (ai) encoding apparatus includes at least one processor configured to: determine a downscaling target, based on a target resolution for a first image, obtain the first image by ai-downscaling an original image using an ai-downscaling neural network corresponding to the downscaling target, generate image data by encoding the first image, select ai-upscaling neural network set identification information, based on the target resolution of the first image, characteristic information of the original image, and a target detail intensity, generate ai data including the target resolution of the first image, bit depth information of the first image, the ai-upscaling neural network set identification information, and encoding control information, and generate ai encoding data including the image data and the ai data; and a communication interface configured to transmit the ai encoding data to an ai decoding apparatus, wherein the ai data includes information about an ai-upscaling neural network corresponding to the ai-downscaling neural network.
Inventor(s): Ravi SURANA of Bangalore (IN) for samsung electronics co., ltd., Prasenjit CHAKRABORTY of Bangalore (IN) for samsung electronics co., ltd., Erik GUTTMAN of Bangalore (IN) for samsung electronics co., ltd., Hyunkoo YANG of Suwon- si (KR) for samsung electronics co., ltd., Naveen KOLATI of Bangalore (IN) for samsung electronics co., ltd., Siva Prasad GUNDUR of Bangalore (IN) for samsung electronics co., ltd., Abhishek SONI of Bangalore (IN) for samsung electronics co., ltd., Aranya SAMAIYAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G06T7/70
CPC Code(s): G06T17/00
Abstract: a method and system for harmonizing perceptual, quality of multiple applications in extended reality (xr) environment are provided. the method includes receiving, by an xr device, at least one media stream received from each application of plurality of applications in the xr device, determining a perceptual quality score for at least one media stream received from each application of the plurality of applications, determining at least one candidate application with different media quality from plurality of applications based on determined perceptual quality score for at least one media stream received from each application of the plurality of applications, determining a target perceptual quality score for at least one media stream for at least one candidate application based on the perceptual quality score and network parameters, and harmonizing, at least one media parameter of the at least one media stream received from candidate applications based on the target perceptual quality score.
Inventor(s): Yingen Xiong of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F3/01, G06T5/80, H04N13/117
CPC Code(s): G06T19/006
Abstract: a video see-through (vst) extended reality (xr) device includes a see-through camera configured to capture an image frame of a three-dimensional (3d) scene, a display panel, and at least one processing device. the at least one processing device is configured to obtain the image frame, identify a depth-based transformation in 3d space, transform the image frame into a transformed image frame based on the depth-based transformation, and initiate presentation of the transformed image frame on the display panel. the depth-based transformation provides (i) viewpoint matching between a head pose of the vst xr device when the image frame is captured and a head pose of the vst xr device when the transformed image frame is presented, (ii) parallax correction between the head poses, and (iii) compensation for a change between the head poses.
Inventor(s): Imran Khan RAHAT of Dhaka (BD) for samsung electronics co., ltd., Anirudha PAUL of Dhaka (BD) for samsung electronics co., ltd.
IPC Code(s): G06V20/20
CPC Code(s): G06V20/20
Abstract: an electronic device configured to control an output device, and an operating method thereof are provided. the electronic device includes memory storing one or more computer programs, and one or more processors communicatively coupled to the at least one input device, the at least one output device, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to obtain surrounding situation information from an input device, determine an importance of the surrounding situation information by using at least one of usage history or a conversation record of a user, and output the surrounding situation information through an output device based on the determined importance of the surrounding situation information.
Inventor(s): Jeongwan PARK of Suwon-si (KR) for samsung electronics co., ltd., Donghyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Taewon KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jihoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Gwanyong PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V30/32, G06F40/166, G06F40/263, G06V30/19, G06V30/22
CPC Code(s): G06V30/36
Abstract: an electronic device and a method of operating the same are provided. the electronic device includes memory storing one or more computer programs and a processor communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the processor individually or collectively, cause the electronic to receive a user input including a touch trajectory, determine whether the number of strokes of the user input exceeds a first reference value, in case that the number of strokes for the user input exceeds the first reference value, perform line separation for the user input into a first row and a second row, and in case that the number of strokes for the user input is equal to or smaller than the first reference value, perform syllable block recognition on the user input.
Inventor(s): TONGSUNG KIM of SUWON-SI (KR) for samsung electronics co., ltd., YOUNGMIN JO of HWASEONG-SI (KR) for samsung electronics co., ltd., MANJAE YANG of HWASEONG-SI (KR) for samsung electronics co., ltd., CHIWEON YOON of SEOUL (KR) for samsung electronics co., ltd., JUNHA LEE of SEOUL (KR) for samsung electronics co., ltd., BYUNGHOON JEONG of HWASEONG-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G06F1/04, G06F3/06, G11C5/14, G11C29/02
CPC Code(s): G11C7/222
Abstract: a storage device includes a plurality of memory chips and a chip. the plurality of memory chips includes a first memory chip configured to generate a first signal based on a first clock signal, and a second memory chip configured to generate a second signal based on a second clock signal. the chip is configured to receive the first and second signals and generate and output a first and second comparison signal based on a duty cycle of the first and second signals. the first memory chip is further configured to generate a first corrected signal by adjusting a duty cycle of the first clock signal based on the first comparison signal, and the second memory chip is further configured to generate a second corrected signal by adjusting a duty cycle of the second clock signal based on the second comparison signal.
Inventor(s): Pavan Kumar KASIBHATLA of Suwon-si (KR) for samsung electronics co., ltd., Seong-il O of Suwon-si (KR) for samsung electronics co., ltd., Hak-soo YU of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G06F15/78, G11C7/10, G11C11/408, G11C11/4093, G11C11/4096
CPC Code(s): G11C11/4091
Abstract: provided is a method of performing an internal processing operation of a memory device in a system including a host device and the memory device. the memory device includes a memory cell array and a processor-in-memory (pim) performing an internal processing operation. in an internal processing mode, by the pim, the memory device performs the internal processing operation based on internal processing information stored in the memory cell array. when the internal processing information is an internal processing operation command indicating a type of the internal processing operation, the memory device outputs the internal processing operation command including an internal processing read command and an internal processing write command to the host device. the host device issues to the memory device a priority command determined from among a data transaction command and the internal processing operation command.
Inventor(s): Seongjin Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4091, G11C11/4076, G11C11/408, G11C11/4094, G11C11/4096
CPC Code(s): G11C11/4091
Abstract: a bit line sense amplifier includes a first inverter having an output terminal connected to a complementary sensing bit line, a second inverter having an output terminal connected to a sensing bit line, a first offset element connecting a bit line to the complementary sensing bit line and a second offset element connecting a complementary bit line to the sensing bit line, in response to an offset cancellation signal. during a first time interval, the first offset element and the second offset element are turned off and a capacitor of a first memory cell is connected to the bit line. during a second time interval after the first time interval, the first offset element and the second offset element are turned on and the capacitor of the first memory cell is disconnected from the bit line.
Inventor(s): Seokhyeon CHAE of Suwon-si (KR) for samsung electronics co., ltd., Hyunkook PARK of Suwon-si (KR) for samsung electronics co., ltd., Inmo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hanmin NAM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C5/06, G11C16/04
CPC Code(s): G11C16/08
Abstract: according to some embodiments of the inventive concept, there is provided a non-volatile memory device comprising: a memory cell array; a pass transistor circuit electrically connected to the memory cell array; a block select line group including a plurality of block select lines, wherein the plurality of block select lines comprises a first block select line and a second block select line, each of which extends in a first direction on a first layer, and the block select line group is electrically connected to the pass transistor circuit; and a first metal line extending in a second direction on a second layer, wherein the second layer is on the first layer, wherein at least one block select line includes at least one twist pattern that changes a path of the at least one block select line in a hole of the first metal line.
Inventor(s): Woosul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sungwon Yun of Suwon-si (KR) for samsung electronics co., ltd., Hyunkook Park of Suwon-si (KR) for samsung electronics co., ltd., Hyunjun Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/10, G11C16/08, G11C16/34
CPC Code(s): G11C16/102
Abstract: a method of programming data in a nonvolatile memory device includes setting a state ordering to a first state ordering, the state ordering representing a relationship between a plurality of states and data values of multi-bit data, performing, based on the first state ordering, a program operation on target memory cells of the plurality of memory cells, swapping the state ordering from the first state ordering to a second state ordering different from the first state ordering, performing, based on the second state ordering, the program operation on the target memory cells, re-swapping the state ordering from the second state ordering to the first state ordering, and performing, based on the first state ordering, the program operation on the target memory cells. each memory cell of a plurality of memory cells of the nonvolatile memory device is programmed to have one of the plurality of states.
Inventor(s): Woojin Jang of Suwon-si (KR) for samsung electronics co., ltd., Wonyoung Jee of Suwon-si (KR) for samsung electronics co., ltd., Kyungsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Mingil Kim of Suwon-si (KR) for samsung electronics co., ltd., Sanghun Bang of Suwon-si (KR) for samsung electronics co., ltd., Dongseok Han of Suwon-si (KR) for samsung electronics co., ltd., Changkyu Kwag of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Junghyun Song of Suwon-si (KR) for samsung electronics co., ltd., Kuihyun Yoon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32724
Abstract: an example coolant tube block assembly includes a first coolant tube block including at least one of a first coolant flow path tube and a second coolant flow path tube; a hub block configured to expose at least one of the first coolant flow path tube and the second coolant flow path tube on one side, and connected to a lower side of the first coolant tube block; a second coolant tube block including at least one third coolant flow path tube and at least one fourth coolant flow path tube communicating with at least one of the first coolant flow path tube and the second coolant flow path tube, and stacked with the first coolant tube block through the hub block; and a clamp disposed at a lower portion of the second coolant tube block and fastened to a fastening groove formed outside the hub block.
Inventor(s): Taijo Jeon of Suwon-si (KR) for samsung electronics co., ltd., Jawon Ko of Suwon-si (KR) for samsung electronics co., ltd., Jongwha Lee of Suwon-si (KR) for samsung electronics co., ltd., Yunsong Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32935
Abstract: the present disclosure relates to calibration apparatuses of sensor devices. an example calibration apparatus of a sensor device includes a housing providing a darkroom space by blocking light from the outside, a lighting unit installed in the darkroom space and configured to output light in a specific wavelength band, a stage on which the sensor device, configured to detect intensity of light output by the lighting unit in at least one measurement position, is mounted, the stage installed below the lighting unit in the darkroom space, and a control device configured to receive raw data including intensity of light measured by the sensor device. the control device generates calibration data for adjusting intensity of light measured at the at least one measurement position.
Inventor(s): Jeongmin Hwang of Suwon-si (KR) for samsung electronics co., ltd., Jongseong Ko of Suwon-si (KR) for samsung electronics co., ltd., Daeyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Donghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jisu Kim of Suwon-si (KR) for samsung electronics co., ltd., Pyungkang Kim of Suwon-si (KR) for samsung electronics co., ltd., Kihong Park of Suwon-si (KR) for samsung electronics co., ltd., Jungjoon Park of Suwon-si (KR) for samsung electronics co., ltd., Jungjun Park of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Junhyeok Park of Suwon-si (KR) for samsung electronics co., ltd., Hoseok Song of Suwon-si (KR) for samsung electronics co., ltd., Chiho Ahn of Suwon-si (KR) for samsung electronics co., ltd., Kongwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Chuyoung Choung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, G06T7/00
CPC Code(s): H01L21/02098
Abstract: an apparatus for cleaning a semiconductor fabrication chamber may include a cleaning module, an inspection module and a drive module. the cleaning module may clean an inner area of the semiconductor fabrication chamber in a non-contact manner. the inspection module may be configured to inspect a cleaning of the semiconductor fabrication chamber by the cleaning module. the drive module may be configured to move the cleaning module and the inspection module in the semiconductor fabrication chamber. thus, the non-contact type cleaning module may effectively remove the contaminant on an inner wall of the semiconductor fabrication chamber having a complicated shape and/or a part on the inner wall of the semiconductor fabrication chamber having a complicated shape.
Inventor(s): Jongseong Ko of Suwon-si (KR) for samsung electronics co., ltd., Daeyong Kim of Suwon-si (KR) for samsung electronics co., ltd., Donghyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Pyungkang Kim of Suwon-si (KR) for samsung electronics co., ltd., Kihong Park of Suwon-si (KR) for samsung electronics co., ltd., Jungjoon Park of Suwon-si (KR) for samsung electronics co., ltd., Jungjun Park of Suwon-si (KR) for samsung electronics co., ltd., Jooyoung Park of Suwon-si (KR) for samsung electronics co., ltd., Hoseok Song of Suwon-si (KR) for samsung electronics co., ltd., Kongwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Chuyoung Choung of Suwon-si (KR) for samsung electronics co., ltd., Jeongmin Hwang of Suwon-si (KR) for samsung electronics co., ltd., Jisu Kim of Suwon-si (KR) for samsung electronics co., ltd., Junhyeok Park of Suwon-si (KR) for samsung electronics co., ltd., Chiho Ahn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67
CPC Code(s): H01L21/67011
Abstract: the present disclosure relates to wire grippers, wire processing apparatuses, and wire processing methods. an example wire gripper comprises a gripper body, a wire supply in the gripper body and supplying a wire, a wire cutting section including a cutter that cuts the wire supplied from the wire supply, a pressure roller below the wire supply and providing a guide groove to guide the wire supplied from the wire supply, a twister on a side of the pressure roller, and a reloader that drives an end of the wire to move from the wire supply to the twister. the twister holds and twists the end of the wire guided by the pressure roller.
Inventor(s): YONGSUK CHOI of Suwon-si (KR) for samsung electronics co., ltd., Ilkyu Jeong of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoong Hwang of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Won Kang of Suwon-si (KR) for samsung electronics co., ltd., Dong-Wook Kim of Suwon-si (KR) for samsung electronics co., ltd., Seok Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/677
CPC Code(s): H01L21/67051
Abstract: a substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.
20240379406. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hee Sung LEE of Suwon-si (KR) for samsung electronics co., ltd., Tae Sung KANG of Suwon-si (KR) for samsung electronics co., ltd., Se Min YANG of Suwon-si (KR) for samsung electronics co., ltd., Kyo-Suk CHAE of Suwon-si (KR) for samsung electronics co., ltd., Seung Ho HONG of Suwon-si (KR) for samsung electronics co., ltd., Beom Yong HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/762, H01L29/423, H10B12/00
CPC Code(s): H01L21/76224
Abstract: a semiconductor device is disclosed. the semiconductor memory device comprises a substrate including an active region, an element isolation film disposed in the substrate and that defines the active region, a recess which is disposed in the active region and extends in a first direction, and a gate structure extending in a second direction, on the active region, wherein the gate structure includes a gate insulating film, a gate stack pattern, and a gate capping pattern which are sequentially stacked, wherein the gate insulating film extends along an upper face of the active region, and a part of the gate insulating film fills the recess, and wherein a height from a lower face of the substrate to a bottom face of the element isolation film is less than a height from the lower face of the substrate to a bottom face of the recess.
Inventor(s): Jaeho Jeon of Suwon-si (KR) for samsung electronics co., ltd., Wooseok Park of Suwon-si (KR) for samsung electronics co., ltd., Donghoon Hwang of Suwon-si (KR) for samsung electronics co., ltd., Myungil Kang of Suwon-si (KR) for samsung electronics co., ltd., Kyungho Kim of Suwon-si (KR) for samsung electronics co., ltd., Byungho Moon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/762, H01L23/522, H01L23/528, H01L29/06, H01L29/66
CPC Code(s): H01L21/76229
Abstract: a semiconductor device includes a substrate including an active pattern that is defined by a trench, a device isolation layer in the trench, a first source/drain pattern and a second source/drain pattern on the active pattern, a partition wall between the first and second source/drain patterns, a dam structure and a gate cutting pattern on the device isolation layer, and a gate spacer on a side surface of the gate cutting pattern. the first source/drain pattern is in a recess between the partition wall and the dam structure, and a lower portion of the gate spacer is interposed between the dam structure and the gate cutting pattern. a first thickness of the lower portion of the gate spacer is different from a second thickness of an upper portion of the gate spacer.
Inventor(s): Il Sup KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L21/311
CPC Code(s): H01L21/76877
Abstract: a method of manufacturing a semiconductor device capable of improving element performance and reliability uses an etch stop film formed as a homogenous film. the method for fabricating a semiconductor device comprises sequentially forming an etch stop film, an interlayer insulating film, and a hard mask pattern on a substrate. a trench is formed in the interlayer insulating film using the hard mask pattern that exposes a surface of a portion of the etch stop film at a bottom of the trench. at the bottom of the trench, the hard mask pattern and a first portion of the etch stop film are removed by using a first wet etching process. a remaining portion of the etch stop film at the bottom of the trench is removed to expose the lower wiring pattern by using a second wet etching process.
20240379427. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Il Sup KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L21/311
CPC Code(s): H01L21/76877
Abstract: a semiconductor device capable of improving element performance and reliability uses an etch stop film formed as a homogenous film. an etch stop film, an interlayer insulating film, and a hard mask pattern are sequentially formed on a substrate. a trench is formed in the interlayer insulating film using the hard mask pattern that exposes a surface of a portion of the etch stop film at a bottom of the trench. at the bottom of the trench, the hard mask pattern and a first portion of the etch stop film are removed by using a first wet etching process. a remaining portion of the etch stop film at the bottom of the trench is removed to expose the lower wiring pattern by using a second wet etching process.
Inventor(s): Yeongkwon KO of Hwaseong-si (KR) for samsung electronics co., ltd., Seunghun SHIN of Cheonan-si (KR) for samsung electronics co., ltd., Junyeong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L21/48, H01L21/56, H01L21/78, H01L23/00, H01L23/498, H01L25/065
CPC Code(s): H01L23/3128
Abstract: disclosed are semiconductor packages and/or methods of fabricating the same. the semiconductor package comprises a substrate, a semiconductor chip on the substrate, and a molding layer. the semiconductor chip includes a circuit region and an edge region around the circuit region. the molding layer covers a sidewall of the semiconductor chip. the semiconductor chip includes a reforming layer on the edge region. a top surface of the reforming layer is coplanar with a top surface of the molding layer.
Inventor(s): Eunsu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/498, H01L25/065
CPC Code(s): H01L23/3135
Abstract: a semiconductor package includes: a package substrate having an upper surface and a receiving groove that has a predetermined depth from the upper surface; a first semiconductor chip disposed in the receiving groove; a second semiconductor chip attached to the first semiconductor chip, wherein the second semiconductor chip does not overlap a portion of the first semiconductor chip; an underfill member filling the receiving groove of the package substrate, wherein the underfill member includes a first cover portion and a second cover portion, wherein the first cover portion fills a gap between the first semiconductor chip and a bottom surface of the receiving groove, and the second cover portion covers the portion of the first semiconductor chip that is not overlapped by the second semiconductor chip; and a molding member covering the first semiconductor chip, the second semiconductor chip and the underfill member and disposed on the package substrate.
Inventor(s): Kyoungok Jung of Suwon-si (KR) for samsung electronics co., ltd., Jakyoung Gu of Suwon-si (KR) for samsung electronics co., ltd., Seonghyun Yoo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a semiconductor package, that includes: a first semiconductor chip including first pads; a second semiconductor chip including second pads on a first surface facing the first semiconductor chip and in contact with the first pads, and including through-electrodes electrically connected to the second pads and extending to a second surface, opposite to the first surface; a first dielectric layer that covers the rear surface of the second semiconductor chip and a portion of each of side surfaces of the through-electrodes thereof; a second dielectric layer that surrounds a side surface of the second semiconductor chip; and bump structures on a planar surface defined by the first dielectric layer and the second dielectric layer, and electrically connected to the through-electrodes, the first dielectric layer may include an inorganic compound, and the second dielectric layer may include an organic-inorganic composite material having a lower coefficient of thermal expansion than the inorganic compound.
Inventor(s): Daehun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/10, H01L25/16
CPC Code(s): H01L23/49838
Abstract: an example semiconductor package includes: a substrate that includes a first surface and a second surface disposed in an opposite direction of the first surface; a semiconductor chip that is disposed at the first surface of the substrate; and an electronic element that is disposed at at least one surface of the substrate. the substrate includes a first element pad disposed at one surface of the at least one surface, a second element pad disposed at a same surface as the first element pad, a first connection pillar extending from the first element pad, a second connection pillar extending from the second element pad, and the electronic element is connected to the first connection pillar and the second connection pillar.
20240379545. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeong Wan HAN of Suwon-si (KR) for samsung electronics co., ltd., Bona BAEK of Suwon-si (KR) for samsung electronics co., ltd., Byungkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Young-Hoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeonghun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/532
CPC Code(s): H01L23/5283
Abstract: a semiconductor device comprising: a substrate; and a conductive structure on the substrate, wherein the conductive structure comprises: a lower conductive structure comprising a lower conductive pattern; and an upper conductive structure comprising an upper conductive pattern, wherein the upper conductive structure is on the lower conductive structure, wherein at least one of a first side surface of the lower conductive pattern or a second side surface of the upper conductive pattern comprises a rough surface, and wherein a first width of a lower surface of the upper conductive pattern in a first direction parallel to a lower surface of the substrate is substantially equal to or less than a second width of an upper surface of the lower conductive pattern in the first direction.
20240379550. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Heeseop Kim of Suwon-si (KR) for samsung electronics co., ltd., Gunho Jo of Suwon-si (KR) for samsung electronics co., ltd., Bomi Kim of Suwon-si (KR) for samsung electronics co., ltd., Eunho Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L21/8234, H01L23/485, H01L27/088, H01L29/06, H01L29/08, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/78, H01L29/786
CPC Code(s): H01L23/5286
Abstract: a semiconductor device includes a substrate having an active region extending in a first direction, a gate structure on the active region, intersecting the active region and extending in a second direction, a source/drain region adjacent the gate structure and on the active region, a contact plug on the source/drain region and electrically connected to the source/drain regions, a first power structure on one side of the source/drain region in the second direction and electrically connected to the contact plug, and a second power structure penetrating the substrate and on a lower end of the first power structure. the first power structure and the second power structure are integrated as a unitary structure, and the first power structure has a first width at an upper thereof and a second width at the lower end thereof, the second width being equal to or greater than the first width.
20240379575. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongyoun Kim of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L21/56, H01L21/683, H01L23/00, H01L23/31
CPC Code(s): H01L23/5386
Abstract: a semiconductor package includes a redistribution layer, a semiconductor chip on the redistribution layer, and a molding layer covering a sidewall of the semiconductor chip and a top surface and a sidewall of the redistribution layer. the sidewall of the redistribution layer is inclined with respect to a bottom surface of the redistribution layer, and a sidewall of the molding layer is spaced apart from the sidewall of the redistribution layer.
Inventor(s): Jihyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Junho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/522
CPC Code(s): H01L24/13
Abstract: a semiconductor structure may include an insulation layer surrounding side surfaces of vias, connection pads on the vias, respectively, a first insulation member on the insulation layer and including through openings in which the connection pads respectively are disposed, and a second insulation member on the insulation layer and surrounding the first insulation member. each corresponding connection pad among the plurality of connection pads may be on a corresponding via among the plurality of vias and in a corresponding through opening among the plurality of through openings. a height of the second insulation member may be lower than the heights of the connection pads. outermost through openings among the through openings may include a first inner side surface defined by a side surface of the first insulation member and a second inner side surface defined by a side surface of the second insulation member.
Inventor(s): Dahee PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L25/18
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a package substrate. a first semiconductor chip is arranged on the package substrate. a second semiconductor chip is disposed on the first semiconductor chip by an adhesive film. the second semiconductor chip is offset-aligned with the first semiconductor chip in a horizontal direction. a stress relieving adhesive layer is disposed on the first semiconductor chip and covers an upper surface of the first semiconductor chip. the stress relieving adhesive layer extends vertically downward from the upper surface to cover a side surface of the first semiconductor chip under an overhang region of the second semiconductor chip. a molding member covers the first semiconductor chip and the second the semiconductor chip on the package substrate.
20240379622. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sung Yun WOO of Suwon-si (KR) for samsung electronics co., ltd., Ji Min Choi of Suwon-si (KR) for samsung electronics co., ltd., Joong Won Shin of Suwon-si (KR) for samsung electronics co., ltd., Yeon Jin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jong Min Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/48
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a base chip including a top surface extending in a first horizontal direction and a second horizontal direction intersecting the first horizontal direction, a semiconductor chip stack including a first semiconductor chip and a second semiconductor chip which are sequentially stacked on the base chip in a vertical direction and are aligned on respective sides in the vertical direction, first through vias penetrating the base chip and spaced apart from each other in the first horizontal direction, second through vias penetrating the first semiconductor chip and spaced apart from each other in the first horizontal direction, third through vias penetrating the second semiconductor chip and spaced apart from each other in the first horizontal direction, first connection pads contacting the first through vias, second connection pads contacting the second through vias, and third connection pads contacting the third through vias.
20240379626. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung Hun SHIN of Cheonan-si (KR) for samsung electronics co., ltd., Un Byoung KANG of Hwaseong-si (KR) for samsung electronics co., ltd., Yeong Kwon KO of Hwaseong-si (KR) for samsung electronics co., ltd., Jong Ho LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Teak Hoon LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Jun Yeong HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/31, H01L23/48, H01L23/498
CPC Code(s): H01L25/0657
Abstract: there is provided a semiconductor device comprising a first semiconductor chip which includes a first chip substrate, and a first through via penetrating the first chip substrate, a second semiconductor chip disposed on the first semiconductor chip, and includes a second chip substrate, and a second through via penetrating the second chip substrate, and a connecting terminal disposed between the first semiconductor chip and the second semiconductor chip to electrically connect the first through via and the second through via. the semiconductor device further comprising an inter-chip molding material which includes a filling portion that fills between the first semiconductor chip and the second semiconductor chip and encloses the connecting terminal, an extension portion that extends along at least a part of a side surface of the second semiconductor chip, and a protruding portion protruding from the extension portion.
Inventor(s): Choongbin YIM of Suwon-si (KR) for samsung electronics co., ltd., Jongkook KIM of Suwon-si (KR) for samsung electronics co., ltd., Chengtar WU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L21/56, H01L23/00, H01L23/28, H01L23/498, H01L25/00
CPC Code(s): H01L25/105
Abstract: provided a three-dimensional (3d) integrated circuit structure including a redistribution structure, a first semiconductor die on the redistribution structure, a substrate on the redistribution structure and adjacent to the first semiconductor die, a molding material on the redistribution structure and between the first semiconductor die and the substrate, an interconnection structure on the substrate and the first semiconductor die, the interconnection structure including a plurality of first bonding pads and a plurality of second bonding pads, and each second bonding pad of the second bonding pads being directly bonded to each first bonding pad of the first bonding pads, and a second semiconductor die on the interconnection structure.
20240379639. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myung Joo Park of Suwon-si (KR) for samsung electronics co., ltd., Hyung Jun Jeon of Suwon-si (KR) for samsung electronics co., ltd., Pil-Kyu Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/498, H10B80/00
CPC Code(s): H01L25/16
Abstract: an example semiconductor package includes a structure, a first semiconductor chip disposed on an upper surface of the structure and electrically connected to the structure, a dummy semiconductor chip disposed on and contacting the upper surface of the structure, a molding layer surrounding a sidewall of the first semiconductor chip and a sidewall of the dummy semiconductor chip on the upper surface of the structure, a redistribution layer disposed on an upper surface of the first semiconductor chip, an upper surface of the dummy semiconductor chip, and an upper surface of the molding layer, a first through-via extending through the molding layer in a vertical direction and electrically connecting the structure and the redistribution layer, a second through-via extending through the dummy semiconductor chip in the vertical direction and electrically connecting the structure and the redistribution layer, and a capacitor disposed inside the dummy semiconductor chip.
20240379647. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Uidam Jung of Suwon-si (KR) for samsung electronics co., ltd., Youngbum Woo of Hwaseong-si (KR) for samsung electronics co., ltd., Byungkyu Kim of Seoul (KR) for samsung electronics co., ltd., Eunji Kim of Seoul (KR) for samsung electronics co., ltd., Seungwoo Paek of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H10B43/10, H10B43/27
CPC Code(s): H01L25/18
Abstract: a semiconductor device includes an insulating structure; a plurality of horizontal layers vertically stacked and spaced apart from each other in the insulating structure; a conductive material pattern contacting the insulating structure; and a vertical structure penetrating through the plurality of horizontal layers and extending into the conductive material pattern in the insulating structure. each of the plurality of horizontal layers comprises a conductive material, the vertical structure comprises a vertical portion and a protruding portion, the vertical portion of the vertical structure penetrates through the plurality of horizontal layers, the protruding portion of the vertical structure extends from the vertical portion into the conductive material pattern, a width of the vertical portion is greater than a width of the protruding portion, and a side surface of the protruding portion is in contact with the conductive material pattern.
Inventor(s): Vassilios Gerousis of Liberty Hill TX (US) for samsung electronics co., ltd., Rwik Sengupta of Leander TX (US) for samsung electronics co., ltd., Joon Goo Hong of Austin TX (US) for samsung electronics co., ltd., Kevin Traynor of Livingston TX (US) for samsung electronics co., ltd., Tanya Abaya of Austin TX (US) for samsung electronics co., ltd., Dharmendar Palle of Austin TX (US) for samsung electronics co., ltd., Mark S. Rodder of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, G06F30/392, H01L23/528
CPC Code(s): H01L27/0207
Abstract: a semiconductor cell block includes a series of layers arranged in a stack. the layers include one or more first layers each having a first height and one or more second layers each having a second height. the second height is larger than the first height, and the second height is a non-integer multiple of the first height. the semiconductor cell block also includes a first semiconductor logic cell having a first cell height in one of the series of layers, and a second semiconductor logic cell having a second cell height in one of the series of layers. the second cell height is larger than the first cell height, and the second cell height is a non-integer value multiple of the first cell height.
Inventor(s): Sanghyuck Moon of Suwon-si (KR) for samsung electronics co., ltd., Kyungho Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungjoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Minji Jung of Suwon-si (KR) for samsung electronics co., ltd., Masato Fujita of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1461
Abstract: an image sensor includes a substrate having a sensing area, a floating diffusion region arranged in the sensing area, a plurality of photodiodes arranged around the floating diffusion region in the sensing area, and an inter-pixel overflow (ipo) barrier in contact with each of the plurality of photodiodes, the ipo barrier overlapping the floating diffusion region in a vertical direction at a position vertically spaced apart from the floating diffusion region within the sensing area.
Inventor(s): Kook Tae KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14636
Abstract: an image sensor includes a first chip; a second chip stacked on the first chip; and a bonding portion provided between the first chip and the second chip, wherein the first chip includes: a first semiconductor substrate including a first surface and a second surface opposing the first surface; a photoelectric conversion region in the first semiconductor substrate; and a first circuit interconnection layer provided on the first surface and adjacent to the photoelectric conversion region, wherein the second chip includes: a second semiconductor substrate including a third surface and a fourth surface facing the first surface and opposing the third surface; and a second circuit interconnection layer provided on the fourth surface, and wherein the bonding portion includes: a bonding layer provided between the first circuit interconnection layer and the second circuit interconnection layer and configured to connect the first chip and the second chip; and a diffusion barrier layer provided between the second circuit interconnection layer and the bonding layer and configured to inhibit diffusion of at least one of hydrogen or deuterium.
Inventor(s): Eun Sub Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14636
Abstract: the present disclosure relates to an image sensor, and the image sensor of the present disclosure may include a plurality of pixels, each of which includes a photovoltaic device configured to convert incident light into charge, and a capacitor configured to store the charge, the capacitor of each of the plurality of pixels may include a first electrode and a second electrode that overlap each other, and a dielectric layer that is between the first electrode and the second electrode, the plurality of pixels may include a first pixel and a second pixel adjacent to each other, and the second electrode of the first pixel and the second electrode of the second pixel may be integral with each other.
Inventor(s): Changyong UM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14643
Abstract: a semiconductor device, including a gate electrode, a first region under the gate electrode and extending from a first direction to a second direction crossing the first direction, the first region having a bent shape, a first source-drain region extending from one end of the first region, a second source-drain region extending from an opposite end of the first region, and a third source-drain region at a point where a first virtual straight line extending from the first source-drain region in the first direction and a second virtual straight line extending from the second source-drain region in a direction opposite to the second direction cross each other in the first region, wherein the third source-drain region forms a first channel region together with the first source-drain region and forms a second channel region together with the second source-drain region.
20240379760. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Soon Yeol PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L29/0847
Abstract: a semiconductor device includes: an active pattern which includes a first lower pattern and first sheet patterns, wherein the first lower pattern extends in a first direction, and the plurality of first sheet patterns are spaced apart from the first lower pattern in a second direction crossing the first direction; a gate structure, which includes a gate electrode and a gate spacer extending in a third direction intersecting the first and second directions, disposed on the active pattern; a first source/drain pattern adjacent to a side of the gate structure; and a second source/drain pattern which is spaced apart from the first source/drain pattern with the gate structure interposed therebetween, wherein the first source/drain pattern includes: a lower layer including a first conductivity type and disposed on the first lower pattern, and an upper layer including a second conductivity type, wherein the second source/drain pattern has the second conductivity type.
Inventor(s): Keumseok PARK of Slingerlands NY (US) for samsung electronics co., ltd., Kang-ill SEO of Springfield VA (US) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/8234, H01L27/06, H01L27/088, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: provided is a semiconductor device whch includes: a 1source/drain region connected to a 1channel structure; a 2source/drain region, above the 1source/drain region, connected to a 2channel structure above the 1channel structure; a channel isolation layer between the 1channel structure and the 2channel structure; a source/drain isolation layer between the 1source/drain region and the 2source/drain region; and a blocking structure between the channel isolation layer and the source/drain isolation layer, wherein an entire width of the blocking structure in a channel-length direction is verically below a lateral edge portion of the 2source/drain region.
20240379795. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wooseok PARK of Suwon-si (KR) for samsung electronics co., ltd., Taehyun RYU of Suwon-si (KR) for samsung electronics co., ltd., Namhyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/06, H01L29/775, H01L29/786
CPC Code(s): H01L29/42392
Abstract: a semiconductor device comprising: a substrate; a first lower pattern on the substrate; a second lower pattern on the first lower pattern; channel patterns on the second lower pattern; a first field insulating layer on a first side surface of the first lower pattern; a second field insulating layer on a second side surface of the first lower pattern; a buried insulating structure on the first field insulating layer and on side surfaces of the channel patterns; a protective layer on the second field insulating layer; source/drain patterns on sides of each of the channel patterns; and a gate electrode extending around the channel patterns and the buried insulating structure, wherein the protective layer comprises: a protective insulating layer between the first lower pattern and the second lower pattern, and between the gate electrode and the second field insulating layer; and a protective liner extending around the protective insulating layer.
Inventor(s): Taeyoung Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L21/02, H01L21/28, H10B51/40
CPC Code(s): H01L29/6684
Abstract: in a method of manufacturing a semiconductor device, a ferroelectric layer may be formed on a first region of a substrate, the substrate including the first region and a second region. a gate insulation layer may be formed on and contacting an upper surface of the ferroelectric layer and on an upper surface of the second region of the substrate. a first conductive layer and a second conductive layer may be sequentially stacked on the gate insulation layer. the second conductive layer and the first conductive layer may be patterned to form first and second gate electrode structures on the first and second regions, respectively, of the substrate.
20240379902. LIGHT-EMITTING DIODE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinwoong Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghyun Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jongpil Jeon of Suwon-si (KR) for samsung electronics co., ltd., Yong Namkung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/14, H01L33/38
CPC Code(s): H01L33/14
Abstract: a light-emitting diode may include: a first semiconductor layer including a light-emitting surface; a second semiconductor layer; an active layer between the first semiconductor layer and the second semiconductor layer; a first contact electrode electrically connected to the first semiconductor layer; a second contact electrode electrically connected to the second semiconductor layer; a first connection pad electrically connected to the first contact electrode; and a second connection pad electrically connected to the second contact electrode, wherein a current concentration region of the light-emitting diode is between the first connection pad and the second connection pad.
Inventor(s): Jonghoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungyong MIN of Suwon-si (KR) for samsung electronics co., ltd., Changjoon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H01L25/075, H01L33/46
CPC Code(s): H01L33/62
Abstract: a display module includes: a substrate including a mounting surface and a pad electrode on the mounting surface; an inorganic light emitting element including a contact electrode corresponding to the pad electrode; a bump disposed between the pad electrode and the contact electrode to bond the pad electrode and the contact electrode, the bump being electrically connecting the pad electrode to the contact electrode; a reflective member configured to underfill the inorganic light emitting element to cover side surfaces of the inorganic light emitting element and a bottom surface of the inorganic light emitting element, and configured to reflect light; and a cover member configured to cover side surfaces of the reflective member and the mounting surface of the substrate, the cover member having a black color.
Inventor(s): Shinho YOON of Suwon-si (KR) for samsung electronics co., ltd., Dongjun OH of Suwon-si (KR) for samsung electronics co., ltd., Jonghyuck LEE of Suwon-si (KR) for samsung electronics co., ltd., Soonho HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, G06F1/16, H01Q1/42, H01Q1/48, H01Q13/16, H04M1/02
CPC Code(s): H01Q1/243
Abstract: an electronic device is provided. the electronic device includes a first housing structure including a first side surface member, a second housing structure including a second side surface member, a hinge structure configured to rotatably connect the first housing structure and the second housing structure and configured to provide a folding axis on which the first housing structure and the second housing structure rotate, and at least one printed circuit board, wherein the first side surface member or the second side surface member includes a first side surface portion a second side surface portion, a third side surface portion, a fourth side surface portion, a fifth side surface portion, a first slit a second slit a third slit, and a fourth slit, and a fifth slit, and wherein at least part of at least one of the second side surface portion, the third side surface portion, and the fourth side surface portion is formed of a radiation conductor and is electrically connected to the at least one printed circuit board.
Inventor(s): Hojung NAM of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmok KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeho LIM of Suwon-si (KR) for samsung electronics co., ltd., Myeongjun KONG of Suwon-si (KR) for samsung electronics co., ltd., Soonho HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/38, H01Q1/24, H01Q13/10, H01R13/24
CPC Code(s): H01Q1/38
Abstract: an electronic device according to an embodiment comprises: a printed circuit board; a first electronic component electrically connected to the printed circuit board; a second electronic component electrically connected to the printed circuit board and facing one side surface of the first electronic component; a first conductive plate including a feeding point supporting the first electronic component and electrically connected to the printed circuit board; a second conductive plate spaced apart from the first conductive plate and supporting the second electronic component; and a plurality of bridges connecting the first conductive plate with the second conductive plate to form a slot, wherein a wireless communication circuit may be configured to communicate with an external electronic device through at least one frequency band using the first conductive plate and the second conductive plate.
Inventor(s): Sungyong JOO of Suwon-si (KR) for samsung electronics co., ltd., Shinho KANG of Suwon-si (KR) for samsung electronics co., ltd., Jeongwoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/02, G09G3/32
CPC Code(s): H02J7/02
Abstract: provided are a charging/discharging apparatus, an operation method of the charging/discharging apparatus, and a display apparatus including the charging/discharging apparatus. the charging/discharging apparatus includes a charging unit comprising circuitry configured to charge a battery pack, and a direct current (dc)-dc converter configured to convert a battery voltage of the battery pack into a voltage for operating the display apparatus, wherein, in a first mode based on an alternating current (ac) power source being applied to the display apparatus, the charging/discharging apparatus charges the battery pack with a battery voltage less than a secondary voltage generated by the display apparatus from the ac power source through the charging unit, and in a second mode based on the ac power source not being applied to the display apparatus, the charging/discharging apparatus delivers the battery voltage of the battery pack to the display apparatus.
Inventor(s): Hyungju PARK of Suwon-si (KR) for samsung electronics co., ltd., Minwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Minyong JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/158
CPC Code(s): H02M3/158
Abstract: disclosed is a dc-dc converter which includes a voltage converter configured to receive an input voltage through an input node, to convert the input voltage into an output voltage, and to output the output voltage to an output node, and a controller configured to select at least one conversion manner among a plurality of conversion manners based on a first ratio of a charging period of one cycle, to charge internal elements in the at least one conversion manner during the charging period of the one cycle, and to control the voltage converter to discharge the internal elements in the at least one conversion manner during a discharging period of the one cycle.
Inventor(s): SEUNGNAM CHOI of HWASEONG-SI (KR) for samsung electronics co., ltd., YUNJAE SUH of SUWON-SI (KR) for samsung electronics co., ltd., MASAMICHI ITO of HWASEONG-SI (KR) for samsung electronics co., ltd., JUNSEOK KIM of HWASEONG-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/26, H03F3/16, H04N25/50, H04N25/60, H04N25/77
CPC Code(s): H03F1/26
Abstract: an amplifier includes a first capacitor connected between an input node and a floating node, a second capacitor connected between the floating node and an output node, an amplifying element connected between a power supply voltage and the output node and operating in response to a voltage level of the floating node, a current bias source connected between the output node and a ground voltage, a first reset switch connected between the floating node and an intermediate node and operating in response to a reset bias, a second reset switch connected between the intermediate node and the output node and operating in response to the reset bias, and a reset bias generator circuit that outputs the reset bias in response to a reset signal. the reset bias is one of a reset voltage of the intermediate node, the power supply voltage, and the ground voltage.
Inventor(s): Amit BERMAN of Tel-Aviv (IL) for samsung electronics co., ltd., Dikla SHAPIRO of Tel-Aviv (IL) for samsung electronics co., ltd., Yaron SHANY of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): H03M13/15, H03M13/00
CPC Code(s): H03M13/1515
Abstract: systems, devices, and methods for decoding information bits obtained from storage, including obtaining a codeword from among a plurality of codewords stored in a storage device, wherein the codeword includes a plurality of frames; obtaining an initial error locator polynomial (elp) corresponding to the codeword; decoding a frame of the plurality of frames; based on determining that the frame is successfully decoded, determine an updated elp based on the initial elp and information about the frame; and obtaining information bits corresponding to the codeword based on the updated elp, wherein the updated elp includes a plurality of updated coefficients, and wherein the updated elp is determined by simultaneously calculating at least two updated coefficients from among the plurality of updated coefficients.
Inventor(s): Amit BERMAN of Tel-Aviv (IL) for samsung electronics co., ltd., Dikla SHAPIRO of Tel-Aviv (IL) for samsung electronics co., ltd., Idan DEKEL of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): H03M13/15, H03M13/00
CPC Code(s): H03M13/152
Abstract: systems, devices, and methods for decoding information bits obtained from storage, including obtaining a frame corresponding to a codeword from the storage device, performing a first decoding operation on the frame, based on the first decoding operation indicating that a number of errors is greater than a predetermined number, selecting at least one potential error bit, and perform a second decoding operation based on the at least one potential error bit, based on the second decoding operation indicating that the number of errors is not equal to the predetermined number plus one, determining that the frame is not correctable by the first decoding operation and the second decoding operation, and based on the second decoding operation indicating that the number of errors is equal to the predetermined number plus one, correcting the frame based on a result of the second decoding operation to obtain a corrected frame, and obtaining information bits corresponding to the codeword based on the corrected frame.
Inventor(s): Ziming HE of Bamet (GB) for samsung electronics co., ltd., Fei TONG of Bassingboum (GB) for samsung electronics co., ltd., Paul Nicholas FLETCHER of Cambridge (GB) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/0663
Abstract: a computer-implemented method performed by a first electronic device for reducing a feedback overhead of beamforming in a wireless communication system, includes: transmitting a first data to a second electronic device; transmitting a data packet to the second electronic device; receiving a second data from the second electronic device; extracting a compressed steering matrix from the second data; obtain uncompressed steering matrix by using a decoder part of an autoencoder, based on the extracted compressed steering matrix; and transmitting, to the second electronic device, a third data via a radio signal beamformed based on the obtained uncompressed steering matrix.
Inventor(s): Seyed Mohsen HOSSEINIAN of San Diego CA (US) for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL (US) for samsung electronics co., ltd., Yuhan ZHOU of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W4/90, H04W12/80, H04W56/00, H04W64/00, H04W84/06
CPC Code(s): H04L5/0051
Abstract: a method of reporting a user equipment (ue) time difference in a non-terrestrial network (ntn) is provided, the method includes receiving, from a base station, a positioning reference signal (prs) in downlink (dl); determining a timestamp or subframe indices of the prs in dl and a timestamp or subframe indices of the ue uplink (ul) prs's closest subframe; determining, based on the timestamps or subframe indices, the ue time difference from the reception of the prs to a transmission of a sounding reference signal (srs); and reporting, to a location management function (lmf), the srs based on the ue time difference.
Inventor(s): Juneho LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyojae LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngsang SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/32
CPC Code(s): H04L9/3247
Abstract: a method for operating an electronic device is disclosed. a method for operating an electronic device according to an embodiment of the disclosure may comprise: storing a first authentication value of a first application in a storage area accessible by an application having a specified digital signature, by the first application having a first digital signature capable of accessing the storage area, transmitting a function execution request and a second authentication value to a second application, by the first application, identifying a second digital signature of the second application based on identifying a request for access to the storage area of the second application, based on the second digital signature corresponding to the specified digital signature, allowing access to the storage area of the second application, performing authentication on the first application based on the first authentication value identified in the storage area and the second authentication value received from the first application, by the second application, and based on performing the authentication, performing a function corresponding to the function execution request, by the second application.
Inventor(s): Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Beomsik BAE of Suwon-si (KR) for samsung electronics co., ltd., Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L43/087, H04L43/06, H04W28/02
CPC Code(s): H04L43/087
Abstract: the disclosure relates to a fifth-generation (5g) or a sixth-generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, a first message including a configuration associated with a jitter report of an uplink traffic, transmitting, to the base station, a second message including the jitter report, wherein the configuration includes at least one of information on a protocol data unit (pdu) session or information on a timer.
Inventor(s): Sangil PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongmyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Ayoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L51/04, A63B24/00
CPC Code(s): H04L51/04
Abstract: disclosed are an electronic device for providing chat messages and exercise state information together and a control method. the electronic device includes a touch screen display and at least one processor. the at least one processor may display a first execution screen of a first application on the touchscreen display based on a chat session between at least one external device and the electronic device, wherein the first execution screen includes a first visual element indicating a first user of the at least one external device and an exercise progress of a second user of the electronic device, and a second visual element for outputting a guidance message for guiding the exercise progress; receive a user input for the second visual element; and display a second execution screen of the first application on the touchscreen display based on the user input.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L61/5007, H04L101/618, H04W8/26, H04W36/00, H04W36/36
CPC Code(s): H04L61/5007
Abstract: the present disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services.
Inventor(s): Kiwon YOO of Suwon-si (KR) for samsung electronics co., ltd., Wooseok KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L65/80, H04L65/70, H04W76/10, H04W88/16
CPC Code(s): H04L65/80
Abstract: a gateway apparatus includes a communication circuitry configured to connect with a source device and wirelessly connect with a sink device that outputs media; and a controller configured to control the communication circuitry, where the controller is configured to: obtain performance information of the sink device via the communication circuitry, transmit the performance information of the sink device to the source device via the communication circuitry, obtain media data corresponding to the performance information of the sink device from the source device via the communication circuitry, convert the media data corresponding to the performance information of the sink device based on the communication circuitry being wirelessly connected with the sink device, and transmit the converted media data to the sink device via the communication circuitry.
Inventor(s): Vijay SANGAMESHWARA of Bangalore (IN) for samsung electronics co., ltd., Arunprasath RAMAMOORTHY of Bangalore (IN) for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L67/55, H04L67/02
CPC Code(s): H04L67/55
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed are methods and systems for handling push notification messages in a service enabler architecture layer notification management (snm) service. the method can be used to for a high-level procedure using a hypertext transport protocol (http) to enable an snm server (snm-s) to push the notification messages to an snm client (snm-c)
Inventor(s): Jisu RYU of Suwon-si (KR) for samsung electronics co., ltd., Jinki KIM of Suwon-si (KR) for samsung electronics co., ltd., Myounggyo SEO of Suwon-si (KR) for samsung electronics co., ltd., Changrim YU of Suwon-si (KR) for samsung electronics co., ltd., Jina JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N13/366, G06V40/16, H04N13/243, H04N13/296, H04N23/16, H04N23/72, H04N23/73, H04N23/74, H04N23/90
CPC Code(s): H04N13/366
Abstract: a wearable electronic device is provided. the wearable electronic device includes a processor and memory communicatively coupled to the processor. the wearable electronic device includes a first tracking device including first lights corresponding to a first area of a user wearing the wearable electronic device and first cameras corresponding to the first area, and a second tracking device including second lights corresponding to a second area of the user and second cameras corresponding to the second area. the memory store one or more computer programs including computer-executable instructions that, when executed by the processor, cause the wearable electronic device to generate a first signal related to the exposure of a first primary camera among the first cameras before an exposure time of the first primary camera and input the generated first signal as a signal notifying the second cameras of the start of a frame.
Inventor(s): Narae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/132, H04N19/105, H04N19/117, H04N19/159, H04N19/176, H04N19/82
CPC Code(s): H04N19/132
Abstract: the present disclosure relates to apparatus and methods of image decoding and image encoding. in one or more embodiments, an image decoding method may comprise determining a first sample value of an upper left reference sample of the current block. the image decoding method may further comprise sequentially searching for a searched reference sample of at least one reference line from a plurality of reference lines, except for the upper left reference sample. the image decoding method may further comprise determining a second sample value of remaining reference samples of the current block, except for the upper left reference sample. the image decoding method may further comprise performing intra prediction on the current block to obtain a prediction block of the current block. the image decoding method may further comprise obtaining a residual block of the current block and a reconstruction block of the current block.
Inventor(s): Woongil Choi of Suwon-si (KR) for samsung electronics co., ltd., Minsoo Park of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Seungsoo Jeong of Suwon-si (KR) for samsung electronics co., ltd., Kiho Choi of Suwon-si (KR) for samsung electronics co., ltd., Narae Choi of Suwon-si (KR) for samsung electronics co., ltd., Anish Tamse of Suwon-si (KR) for samsung electronics co., ltd., Yinji Piao of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/174, H04N19/117, H04N19/176, H04N19/60, H04N19/82
CPC Code(s): H04N19/174
Abstract: in a video encoding and decoding process, provided are a method and apparatus for determining whether a slice including an adjacent pixel located at the upper-left or lower-right side of a current pixel from among adjacent pixels used for an adaptive loop filter of the current pixel is different from a slice including the current pixel, when the slice including the adjacent pixel at the upper-left or lower-right location is different from the slice including the current pixel, determining a value of the adjacent pixel located at the upper-left or lower-right side as a value of a closest pixel in a horizontal direction of the adjacent pixel located at the upper-left or lower-right side from among pixels included in the slice including the current pixel, determining an adaptive loop filter including a filter coefficient for the current pixel and the adjacent pixels based on values of the current pixel and the adjacent pixels, correcting the value of the current pixel by using the values of the adjacent pixels, by applying the adaptive loop filter to the current pixel, and encoding/decoding a current block including the current pixel.
Inventor(s): Woongil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Kiho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Narae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd., Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/174, H04N19/117, H04N19/176, H04N19/60, H04N19/82
CPC Code(s): H04N19/174
Abstract: in a video encoding and decoding process, provided are a method and apparatus for determining whether a slice including an adjacent pixel located at the upper-left or lower-right side of a current pixel from among adjacent pixels used for an adaptive loop filter of the current pixel is different from a slice including the current pixel, when the slice including the adjacent pixel at the upper-left or lower-right location is different from the slice including the current pixel, determining a value of the adjacent pixel located at the upper-left or lower-right side as a value of a closest pixel in a horizontal direction of the adjacent pixel located at the upper-left or lower-right side from among pixels included in the slice including the current pixel, determining an adaptive loop filter including a filter coefficient for the current pixel and the adjacent pixels based on values of the current pixel and the adjacent pixels, correcting the value of the current pixel by using the values of the adjacent pixels, by applying the adaptive loop filter to the current pixel, and encoding/decoding a current block including the current pixel.
Inventor(s): Woongil CHOI of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Kiho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Narae CHOI of Suwon-si (KR) for samsung electronics co., ltd., Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd., Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/174, H04N19/117, H04N19/176, H04N19/60, H04N19/82
CPC Code(s): H04N19/174
Abstract: in a video encoding and decoding process, provided are a method and apparatus for determining whether a slice including an adjacent pixel located at the upper-left or lower-right side of a current pixel from among adjacent pixels used for an adaptive loop filter of the current pixel is different from a slice including the current pixel, when the slice including the adjacent pixel at the upper-left or lower-right location is different from the slice including the current pixel, determining a value of the adjacent pixel located at the upper-left or lower-right side as a value of a closest pixel in a horizontal direction of the adjacent pixel located at the upper-left or lower-right side from among pixels included in the slice including the current pixel, determining an adaptive loop filter including a filter coefficient for the current pixel and the adjacent pixels based on values of the current pixel and the adjacent pixels, correcting the value of the current pixel by using the values of the adjacent pixels, by applying the adaptive loop filter to the current pixel, and encoding/decoding a current block including the current pixel.
Inventor(s): Yunjeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Kawang KANG of Suwon-si (KR) for samsung electronics co., ltd., Dongsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Inah MOON of Suwon-si (KR) for samsung electronics co., ltd., Shuichi SHIMOKAWA of Suwon-si (KR) for samsung electronics co., ltd., Yeotak YOUN of Suwon-si (KR) for samsung electronics co., ltd., Suhyog KWON of Suwon-si (KR) for samsung electronics co., ltd., Youngbae SON of Suwon-si (KR) for samsung electronics co., ltd., Jonghoon WON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/67, H04N23/667, H04N23/71, H04N23/75, H04N25/704
CPC Code(s): H04N23/672
Abstract: according to an embodiment, an electronic device may include an image sensor including a plurality of unit pixels, and at least one processor electrically connected with the image sensor. each unit pixel may include pds disposed under a micro lens and having a 2�2 arrangement, that is, a tl, a tr, a bl, and a br. the at least one processor may acquire a first image frame from the image sensor, determine an operation mode of the image sensor based on the first image frame, and may perform af of an h direction by using tl, bl, or tl+bl af data and tr, br, or tr+br af data, or may perform af of a v direction by using tl, tr, or tl+tr af data and bl, br, or bl+br af data according to an operation mode of the image sensor. various other embodiments understood through the specification are possible.
Inventor(s): Dongyoul PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Junseok SHIN of Suwon-si (KR) for samsung electronics co., ltd., Kioh JUNG of Suwon-si (KR) for samsung electronics co., ltd., Soonkyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseok HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/68, H04N23/45, H04N23/57, H04N23/65, H04N23/667
CPC Code(s): H04N23/683
Abstract: an electronic device according to an embodiment may include a first camera module including a first driving circuit, a sub processor, and a main processor functionally connected to the first camera module and the sub processor, wherein the main processor is configured to generate a first clock signal and transmit the same to the first camera module while a first camera included in the first camera module is in an activated state, transmit a first control signal to the sub processor in response to occurrence of a predetermined event in a sleep state, and the sub processor is configured to generate a second clock signal and transmit the same to the first camera module while the main processor is in a sleep state in response to receipt of the first control signal. in addition to this, various embodiments identified thorough the specification are possible.
Inventor(s): Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Youngzoon YOON of Gwacheon (KR) for samsung electronics co., ltd., Mathias KOLLE of Hull MA (US) for samsung electronics co., ltd., Benjamin MILLER of Cambridge MA (US) for samsung electronics co., ltd.
IPC Code(s): H04N25/13, G02F1/1334, H04N9/64, H04N23/84
CPC Code(s): H04N25/134
Abstract: a photonic device including a filter comprising an electrically switchable array, wherein the electrically switchable array includes alternating layers of polymer and polymer-dispersed liquid crystal, wherein the electrically switchable array is tunable under an applied electric field.
Inventor(s): Seongkwan YANG of Suwon-si (KR) for samsung electronics co., ltd., Kiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonrae CHO of Suwon-si (KR) for samsung electronics co., ltd., Myeungseon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R9/06, H04R1/02, H04R7/12, H04R7/18, H04R9/02, H04R9/04
CPC Code(s): H04R9/06
Abstract: a speaker and/or an electronic device are provided. the electronic device includes the same may include a diaphragm, a yolk disposed to face the diaphragm and including an avoidance groove formed on a surface thereof facing the diaphragm, a coil mounted to one surface of the diaphragm and disposed between the diaphragm and the yolk, and a first magnet mounted to the yolk and disposed to be surrounded by at least part of the coil or a second magnet disposed to surround at least part of the coil. the coil may be disposed to make a surface thereof facing the yolk correspond to the avoidance groove and configured to linearly reciprocate the diaphragm by receiving an electric signal.
Inventor(s): Kiran Gurudev KAPALE of Bangalore (IN) for samsung electronics co., ltd., Arun Prasath RAMAMOORTHY of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W4/08, H04W84/18
CPC Code(s): H04W4/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure related to apparatus and methods for supporting ad hoc group standalone sds in mcdata service. a method incudes receiving, by mcdata server of primary mcdata system, first data transfer request message from mcdata client of primary mcdata system for determining target mcdata users for standalone sds. further, determines whether criteria for determining a list of mcdata users or a list of mcdata users associated with primary and partner mcdata system is received. further, determining list of mcdata users based on criteria when criteria is received, and creates an ad hoc group, assigns pre-configured group and ad hoc group id. also, creating an ad hoc group based on list of mcdata users associated with primary and partner mcdata system when list of mcdata users are received in first data transfer request message, and assigning a pre-configured group and ad hoc group id to created ad hoc group.
Inventor(s): Hyesung KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jicheol LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/12, H04W84/04
CPC Code(s): H04W8/12
Abstract: according to an embodiment of the disclosure, an operation method of a home edge configuration server (hecs) includes receiving, from a user equipment (ue), a first service provisioning request including an identifier of a visited public land mobile network (vplmn) in which the ue is served, identifying at least one visited edge configuration server (vecs) available in the vplmn in case that roaming status of the ue is identified based on the identifier of the vplmn, and transmitting, to the ue, a provisioning response message including information about the identified at least one vecs, wherein a second service provisioning request message is transmitted to one of the at least one vecs, from the ue, based on the information about the at least one vecs.
Inventor(s): Eric YIP of Gyeonggi-do (KR) for samsung electronics co., ltd., Prasenjit CHAKRABORTY of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W8/22, H04W48/16
CPC Code(s): H04W24/02
Abstract: disclosed is a method and device for efficiently providing an artificial intelligence/machine learning (ai/ml) media service by a user equipment (ue), the method including receiving, from a network server, configuration information including information on a trained configuration ai model for checking a capability of the ue associated with a ai split inferencing between the ue and the network server, performing inferencing for a capability discovery of the ue based on the configuration information, and transmitting, from the network server, a capability metrics of the ue based on the inferencing result.
Inventor(s): Seungbeom JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04L41/5003
CPC Code(s): H04W24/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate.
Inventor(s): Przemyslaw WYSZKOWSKI of Warszawa (PL) for samsung electronics co., ltd., Jan KIENIG of Warszawa (PL) for samsung electronics co., ltd., Maciej LISOWSKI of Warszawa (PL) for samsung electronics co., ltd., Mateusz ZAWADZKI of Warszawa (PL) for samsung electronics co., ltd.
IPC Code(s): H04W28/086, H04W28/02, H04W72/0453
CPC Code(s): H04W28/0864
Abstract: a management node in a wireless communication system with a network slicing environment and an operating method thereof are provided. the method may include, in response to an allocation request from a higher-level management node, allocating a lower-level management node a first slicing entity that meets specified requirements for a network slice, obtaining the occurrence of a reallocation event, and in response to the occurrence of the reallocation event, reallocating the lower-level management node a second slicing entity that meets the specified requirements among slicing entities managed by the management node.
Inventor(s): Van Hau TRUONG of Bac Ninh (VN) for samsung electronics co., ltd., Minh Duc HOANG of Bac Ninh (VN) for samsung electronics co., ltd., Van Hung NGUYEN of Bac Ninh (VN) for samsung electronics co., ltd., The Thoi NGUYEN of Bac Ninh (VN) for samsung electronics co., ltd.
IPC Code(s): H04W28/24, H04L65/1016, H04W36/08, H04W60/04, H04W76/15
CPC Code(s): H04W28/24
Abstract: there is provided a method for enhancing quality of calls in a wireless communication system. the method includes: receiving a new radio (nr) measurement setup from a network while connecting an ip multimedia subsystem (ims)-based voice call with an external terminal; based on the network not supporting voice over new radio (vonr) and supporting a standalone (sa) mode and a non-standalone (nsa) mode, determining whether a frequency set by the nr measurement setup is usable and determining a network type of the set frequency; and, based on determining that the set frequency is used for the sa mode, blocking measurement on the set frequency.
Inventor(s): Soenghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., Himke VAN DER VELDE of Zwolle (NL) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W36/36
CPC Code(s): H04W36/0005
Abstract: disclosed are a communication technique for merging, with iot technology, a 5g communication system for supporting a data transmission rate higher than that of a 4g system, and a system thereof. the present disclosure can be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail, security and safety-related services, and the like), based on a 5g communication technology and an iot-related technology. one embodiment of the present invention relates to a method by which a terminal updates system information, and a terminal for performing the method, which comprises the steps of: acquiring first system information and second system information from a first cell; starting a timer corresponding to the second system information; determining whether the second cell is a cell that shares the second system information with the first cell, if the terminal has moved from the first cell to the second cell; and updating the second system information on the basis of the determination result.
Inventor(s): Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04L1/1829, H04W36/08
CPC Code(s): H04W36/0007
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method comprises receiving a radio resource control (rrc) release message including multicast and broadcast services (mbs) configuration information associated with reception of an mbs multicast in an rrc inactive state, performing cell reselection while the ue is in the rrc inactive state and resetting a medium access control (mac) entity upon the cell reselection.
Inventor(s): Seungri JIN of Suwon-si (KR) for samsung electronics co., ltd., June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00
CPC Code(s): H04W36/0069
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure provides a method and an apparatus for managing configuration information to efficiently support continuous conditional pscell change. the method of ue comprises: receiving, from a base station, an rrc message including a configuration on a subsequent conditional pscell addition or change (cpac), the configuration including information on a candidate scg configuration of a candidate pscell and an mcg configuration associated with the candidate scg configuration; and identifying the configuration included in the rrc message, wherein the configuration includes a reference configuration for the candidate scg configuration.
Inventor(s): Shiyang Leng of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Kyeongin Jeong of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04B17/318, H04W56/00, H04W72/1273, H04W72/231, H04W76/28, H04W84/06
CPC Code(s): H04W36/00725
Abstract: methods and apparatuses for a mac ce for multi-trp operation in a wireless communication system. a method of a ue comprises: receiving, from a base station, a rach-less switching command for a rach-less switching operation to a target cell; determining whether a drx is configured for the target cell; and retaining an active time during the rach-less switching operation based on a determination that the drx is configured for the target cell, monitoring a pdcch to acquire a ul grant of an initial ul transmission, wherein the initial ul transmission for the rach-less switching operation includes a transmission of a rrcreconfigurationcomplete message to a target satellite or the target cell.
Inventor(s): Junsuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Minho YANG of Suwon-si (KR) for samsung electronics co., ltd., Hyoungjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Taeyoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Junyoung WOO of Suwon-si (KR) for samsung electronics co., ltd., Euichang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Chaiman LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04B17/318, H04B17/382, H04W36/00, H04W36/08
CPC Code(s): H04W36/305
Abstract: an electronic device may include: a plurality of antenna modules; a communication circuit connected to the plurality of antenna modules; and at least one processor configured to: receive a first message from a first base station, which is a serving base station of the electronic device; identify, from among the plurality of antenna modules, a first antenna module for forming a first reception beam; identify, from among the plurality of antenna modules, a second antenna module for forming a second reception beam; and perform handover from the first base station to a second base station on the basis of transmitting a second message including first information for indicating the quality of at least one first signal through the first reception beam and second information for indicating the quality of at least one second signal through the second reception beam.
Inventor(s): Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo OCK of Suwon-si (KR) for samsung electronics co., ltd., June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/36, H04W36/00
CPC Code(s): H04W36/362
Abstract: the present disclosure relates to a 5g or pre-5g communication system for supporting a higher data transmission rate than a 4th generation (4g) communication system such as long term evolution (lte). the present disclosure relates to a method for processing a control signal in a wireless communication system, and may comprise the steps of: receiving a first control signal being transmitted from a base station; processing the received first control signal; and transmitting, to the base station, a second control signal generated on the basis of the processing.
Inventor(s): Danish Ehsan HASHMI of Bangalore (IN) for samsung electronics co., ltd., Jagadeesh GANDIKOTA of Bangalore (IN) for samsung electronics co., ltd., Koustav ROY of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Utsav SINHA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/08, H04W60/06, H04W84/04
CPC Code(s): H04W48/08
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate.
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W48/14
CPC Code(s): H04W48/14
Abstract: a user equipment (ue) includes a transceiver configured to receive a system information block 1 (sib1). the sib1 includes at least one system information (si) request configuration including si request resources for a number of message 1 (msg1) repetitions. the ue further includes a processor operatively coupled to the transceiver. the processor is configured to select an si request configuration from the sib1, and initiate a random access for a si request using the selected si request configuration.
Inventor(s): Sivasankar COMARAVELOU of Bengaluru (IN) for samsung electronics co., ltd., Prasad Basavaraj DANDRA of Bengaluru (IN) for samsung electronics co., ltd., Lalith KUMAR of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W76/10
CPC Code(s): H04W48/18
Abstract: a method for accessing one or more services by a user equipment (ue) in a multi-radio access technology (multi-rat) network, includes: receiving, from applications associated with the ue, a request to access at least one of services or slices within the multi-rat network; based on the received request and mapping information, determining at least one of rats or subscription permanent identifiers (supis). the mapping information indicates a relationship between slices and at least one of rats associated with networks within the multi-rat network and supis stored at the ue; and based on the determined at least one of rats, and the supis to access the requested at least one of the services or the slices, establishing a connection with at least one of the networks within the multi-rat network.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W92/18
CPC Code(s): H04W52/0216
Abstract: methods and apparatuses for facilitating establishment and use of a time window that is conducive to transmission of unmanaged traffic in a wireless local area network (wlan). a method performed by an access point (ap) comprises determining a schedule of one or more peer-to-peer (p2p) transmission windows that are time windows conducive to p2p transmissions by non-ap stas in a basic service set (bss) associated with the ap, transmitting, to the stas in the bss, a message including parameters for the schedule of p2p transmission windows and an indication that the stas should perform p2p transmissions during the p2p transmission windows, and avoiding infrastructure communications during the p2p transmission windows.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Ahmed Atef Ibrahim Ibrahim of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W76/15
CPC Code(s): H04W52/0258
Abstract: embodiments of the present disclosure provide methods and apparatuses for facilitating restricted target wake time (twt) operation in a wireless local area network. the apparatuses include a non-access point (ap) multi-link device (mld) comprising a plurality of stations (stas) and a processor. each sta comprises a transceiver configured for broadcast twt operation on multi-link operation (mlo) links with corresponding aps of an ap mld. the processor is operably coupled to the transceivers, and configured to negotiate a broadcast twt schedule over a first link between a first sta and a first ap of the ap mld, apply the broadcast twt schedule to the group of links, negotiate a restricted twt schedule with the ap mld over at least one link of the group of links, and establish the restricted twt schedule on one or more links of the at least one link.
Inventor(s): Jaemoon CHA of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Yeonjoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/36, H04B1/3827, H04W52/34
CPC Code(s): H04W52/367
Abstract: an electronic device is provided. the electronic device includes at least one housing, a plurality of antennas arranged on the at least one housing, at least one radio frequency (rf) circuit, memory, including one or more storage media, storing instructions, and at least one processor communicatively coupled to the at least one rf circuit and the memory, wherein the instructions, when executed by the at least one processor individually or collectively, may cause the electronic device to determine to transmit an rf signal through a first rf path corresponding to a first antenna among the plurality of antennas, identify the state of the at least one housing, identify a maximum transmission power limit corresponding to the first rf path, based on whether an accumulated specific absorption rate (sar) for the first rf path meets a maximum transmission power limit backoff condition associated with an antenna group, the antenna group being determined according to the state of the at least one housing, and transmit, by the at least one rf circuit, the rf signal based on transmission power set based on the maximum transmission power limit.
20240381287. TELECOMMUNICATION SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Lalith KUMAR of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): H04W60/06, H04W12/106, H04W76/20
CPC Code(s): H04W60/06
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) is provided. the method includes determining to include unavailability information in a deregistration request message, and transmitting, to a network entity, the deregistration request message, wherein the unavailability information is included in the deregistration request message as non-cleartext information, wherein the deregistration request message includes a non-access stratum (nas) message container information element (ie), wherein the unavailability information is included in the nas message container ie, and wherein at least a part of the nas message container ie is ciphered by the ue.
Inventor(s): Mingyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung HA of Suwon-si (KR) for samsung electronics co., ltd., Youngwan SO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04W4/12
CPC Code(s): H04W64/00
Abstract: a method for managing both an ultra-wideband (uwb) channel and a narrow band (nb) channel is provided. the method performed by a first uwb device includes receiving an advertisement response (adv resp) message responding to an advertisement poll (adv poll) message from a second uwb device through the nb channel, transmitting a start of ranging (sor) message corresponding to the adv resp message to the second uwb device through the nb channel, performing, based on the sor message, uwb ranging with the second uwb device, and transmitting a ranging packet report (rprt) message to the second uwb device, through one of the nb channel and the uwb channel.
Inventor(s): Dawoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwanghoon Han of Suwon-si (KR) for samsung electronics co., ltd., Hyejin Kang of Suwon-si (KR) for samsung electronics co., ltd., Heesu Kim of Suwon-si (KR) for samsung electronics co., ltd., Jihye Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W64/00, H04B1/7163, H04W74/0816
CPC Code(s): H04W64/00
Abstract: an electronic device includes: a communication circuit; memory storing at least one instruction; and at least one processor operatively connected with the communication circuit and the memory, wherein the at least one processor is configured to execute the at least one instruction to cause the electronic device to: identify whether a condition for sharing ranging information in a distance-based service is satisfied; transmit, via the communication circuit, a ranging request message requesting to share the ranging information, based on identifying that the condition for sharing the ranging information is satisfied; receive, from a first external electronic device, via the communication circuit, a ranging response message including the ranging information in response to the ranging request message.
Inventor(s): Seunghoon CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyewon YANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaewon LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W52/02, H04W76/28
CPC Code(s): H04W68/02
Abstract: the disclosure relates to an efficient paging method for receiving a paging by a user equipment (ue) in a wireless communication system, including receiving configuration information related to the paging from a base station by the ue including a wake-up receiver, receiving a wake-up signal for operating the ue in an on state from the base station through the wake-up receiver, and determining a specific paging frame (pf) for receiving the paging, based on the wake-up signal and the configuration information.
Inventor(s): Jingxing FU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Zhe CHEN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/1263
CPC Code(s): H04W72/1263
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method performed by a ue and a base station in a wireless communication network, the method performed by the ue including: receiving first information for scheduling a first frequency domain resource including a plurality of second frequency domain resources; upon the second information is received, determining, based on the first information and the second information and from the plurality of second frequency domain resources, a second frequency domain resource for downlink transmission or uplink transmission scheduled by the first information, and the second information including indication information indicating that each second frequency domain resource in the plurality of second frequency domain resources is a downlink frequency domain resource or an uplink frequency domain resource; performing downlink transmission or uplink transmission on the determined second frequency domain resource.
20240381346. FULL POWER UPLINK TRANSMISSION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04B7/06, H04L5/00, H04W72/51
CPC Code(s): H04W72/1268
Abstract: apparatuses and methods for enabling full power uplink (ul) transmission. a method performed by a user equipment (ue) includes transmitting ue capability information including (i) information for a codebook-based ul transmission using eight antenna ports and (ii) information indicating whether the ue supports a ul full power transmission mode of fullpowermode1 or fullpowermode2; receiving a physical uplink shared channel (pusch) configuration; and receiving a transmit precoding matrix indicator (tpmi). the pusch configuration includes parameters indicating a codebook for the tpmi and ul-fullpowertransmission8tx. the method further includes determining a pusch transmission based on the pusch configuration, determining a power level for the pusch transmission based on the pusch configuration, and transmitting the pusch transmission with the determined power level. the power level corresponds to full power if the tpmi is a full power tpmi. the tpmi indicates a precoding matrix and a number of layers for the pusch transmission.
20240381347. NON-COHERENT UPLINK OPERATIONS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04B7/06, H04W72/51
CPC Code(s): H04W72/1268
Abstract: apparatuses and methods for non-coherent uplink (ul) operations. a method performed by a user equipment (ue) includes receiving a configuration including a value n=8 indicating an uplink (ul) codebook for eight antenna ports; receiving a transmit precoding matrix indicator (tpmi) index indicating a precoding matrix from the ul codebook; and transmitting a physical uplink shared channel (pusch) using the precoding matrix. the precoding matrix is given by
20240381347. NON-COHERENT UPLINK OPERATIONS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04B7/06, H04W72/51
CPC Code(s): H04W72/1268
Abstract:
20240381347. NON-COHERENT UPLINK OPERATIONS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04B7/06, H04W72/51
CPC Code(s): H04W72/1268
Abstract: where v is a number of layers of the precoding matrix, xis a port index associated with layer i, eis a column vector with a value 1 at row corresponding to port xand value 0 at other rows, x∈{0, . . . ,7}, i∈{1, . . . , v}, v∈{1, . . . ,8}. the tpmi index maps to ports (x, . . . x) associated with v layers via an index i.
Inventor(s): Jeongho YEO of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok RYU of Suwon-si (KR) for samsung electronics co., ltd., Sungjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung OH of Suwon-si (KR) for samsung electronics co., ltd., Jonghyun BANG of Suwon-si (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/21, H04L1/1607, H04L1/1812
CPC Code(s): H04W72/21
Abstract: methods and apparatuses for a feedback information transmission and reception in a wireless communication system is provide. a method of a ue includes: receiving sidelink feedback control information (sfci) from other terminal, identifying a resource region for transmitting the sfci to a base station, and transmitting control information comprising the sfci and uplink control information (uci) to the base station in the resource region.
Inventor(s): Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Jeongseok YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/25, H04W72/232
CPC Code(s): H04W72/25
Abstract: a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes transmitting, to a base station, sidelink ue information associated with the ue, wherein the sidelink ue information includes information for requesting a configuration of a resource for a sidelink positioning reference signal (sl-prs), receiving, from the base station, configuration information associated with a resource pool for the sl-prs, transmitting, to the base station, information for requesting a sl-prs resource, based on the configuration information, receiving, from the base station, first downlink control information (dci) scheduling the sl-prs resource, and transmitting the sl-prs on the sl-prs resource based on the first dci.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Fasil Abdul LATHEEF of Bangalore (IN) for samsung electronics co., ltd., Himke VAN DER VELDE of Staines (GB) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/30
CPC Code(s): H04W72/30
Abstract: a communication method and a system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot) are provided. the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. embodiments allow sending interest indication, by a user equipment (ue), to a 5g network, to indicate whether the ue is interested in receiving multicast and broadcast services (mbs) and/or mbs that are being currently received by the ue. embodiments provide a mechanism to send interest indication.
Inventor(s): Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/40
CPC Code(s): H04W72/40
Abstract: apparatuses and methods for sidelink power control with carrier aggregation. a method of user equipment (ue) in a wireless communication system includes receiving a set of configurations for sidelink operation on multiple carriers from a higher layer and information for a maximum power for transmission on the multiple carriers and identifying, based on a ue capability a maximum number of physical sidelink feedback channels (psfchs) for simultaneous transmissions. the method further includes determining, based on the set of configurations, a first number of psfchs, psfch transmission occasions for the first number of psfchs in corresponding first number of carriers from the multiple carriers, and a power for transmission of a psfch from the first number of psfchs and simultaneously transmitting, in the psfch transmission occasions, the first number of psfchs with the power in the first number of carriers.
Inventor(s): Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/40, H04W72/23, H04W92/18
CPC Code(s): H04W72/40
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data rates. a method, for transmitting at least one of the uav service message and the uam service message using a pc5-based terminal-to-terminal direct communication scheme, performed by a terminal includes: determining whether a serving cell supports a2x communication, determining whether the service cell provides a sib message including sidelink configuration information on the a2x communication, determining whether the serving cell provides a sib message including a sidelink transmission resource configuration on the a2x communication, determining a sidelink transmission resource allocation mode for the a2x communication for transmitting at least one of the uav service message and the uam service message using the pc5-based terminal-to-terminal direct communication scheme, and determining sidelink radio bearer configuration for the a2x communication.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/40, H04B17/318, H04W16/28, H04W72/25
CPC Code(s): H04W72/40
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wires communication system is provide. the method comprises identifying a resource subset corresponding to a transmission beam and identifying one or more resources from the resource subset for a transmission for at least one of a physical sidelink shared channel (pssch) or physical sidelink control channel (pscch) in a direction of the transmission beam.
Inventor(s): Jeongseok YU of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Taeseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/563, H04L5/00, H04W72/25
CPC Code(s): H04W72/563
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a transmitting terminal in a wireless communication system of the disclosure is provided. the method includes receiving a sidelink system information block (sib) from a base station, requesting transmission resources to perform sidelink communication with a receiving terminal from the base station, receiving downlink control information (dci) through a physical downlink control channel (pdcch) from the base station, identifying sidelink scheduling information included in the dci, and performing scheduling based on the sidelink scheduling information.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/04, H04W74/08, H04W76/40
CPC Code(s): H04W74/04
Abstract: a first sta affiliated with the non-ap mld and operating on the first link intends to establish on the first link a first broadcast twt schedule that is aligned with a second broadcast twt schedule on the second link on which a second sta affiliated with the non-ap mld is operating. the first sta may decode a beacon frame or a probe response frame transmitted from a first ap affiliated with the ap mld and operating on the first link to identify where there is a broadcast twt schedule on the first link that is aligned with the second broadcast twt schedule on the second link. the first sta can identify the presence of the aligned schedule on the first link by checking a broadcast twt parameter set field included within a broadcast twt element included in the beacon frame or the probe response frame.
Inventor(s): Donggun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W36/00, H04W36/08, H04W36/18
CPC Code(s): H04W74/0833
Abstract: the disclosure relates to a communication method and system for converging a 5-generation (5g) communication system for supporting higher data rates beyond a 4-generation (4g) system with a technology for internet of things (iot). the disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security, and safety services. the disclosure provides a method and an apparatus for operating a pdcp entity during a handover having no transmission/reception interruption.
Inventor(s): Liang HU of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd., Mohammed KARMOOSE of San Diego CA (US) for samsung electronics co., ltd., Philippe SARTORI of Naperville IL (US) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W72/044, H04W72/23
CPC Code(s): H04W74/0833
Abstract: a method for random access in a communication network may include detecting a first candidate beam at a ue, detecting a second candidate beam at the ue, transmitting, from the ue, one or more first messages of a random access procedure, and indicating, by the one or more first messages, the first candidate beam and the second candidate beam. another method for random access in a communication network may include detecting a first candidate beam at a ue, detecting a second candidate beam at the ue, receiving, at the ue, traffic information for the first candidate beam and the second candidate beam, selecting the first candidate beam based on the traffic information, and transmitting, based on the selecting, a first message of a random access procedure using the first candidate beam. the traffic information comprises load information.
Inventor(s): Hong WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W76/40, H04L47/34
CPC Code(s): H04W76/40
Abstract: a method performed by a first network node in a wireless communication system is provided. the method includes determining whether to establish an f1 tunnel with a third node, transmitting, to a second node, a first message including a first indication, wherein the first indication indicates that a user plane between the third node and the first node has not been established, and transmitting, to the third node, a second message including a second indication, wherein the second indication indicates that the user plane between the third node and the first node has not been established.
Inventor(s): Wanjae JU of Suwon-si (KR) for samsung electronics co., ltd., Kiyeong JEONG of Suwon-si (KR) for samsung electronics co., ltd., Nurimaka JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K3/42
CPC Code(s): H05K1/0201
Abstract: an electronic device is provided. the electronic device includes a printed circuit board including a through hole, an electronic component disposed on the printed circuit board, a shield can covering the electronic component, and a thermal interface material (tim) included in a space between the printed circuit board and the shield can. the thermal interface material occupies a space between a surface of the electronic component and the shield can, and contacts the first electronic component. a space between the printed circuit board and the shield can is connected to an external space of the shield can through an opening.
Inventor(s): Youngmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Moonchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Yeonggyu YOON of Suwon-si (KR) for samsung electronics co., ltd., Joongyeon CHO of Suwon-si (KR) for samsung electronics co., ltd., Junyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd., Junghyeob LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunggun CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0217
Abstract: an electronic device according to an embodiment comprises: a first housing; a second housing that is slidable with respect to the first housing; a display that moves into or out of the first housing; a plurality of supporting bars arranged on one surface of the display; a plurality of barriers arranged at one end of each of the plurality of supporting bars and facing a side surface of the display; and a plurality of guide protrusions extending in a direction opposite to an extension direction of the plurality of barriers, wherein an interval between side surfaces of the plurality of barriers facing each other is less than an interval between the plurality of guide protrusions.
Inventor(s): Wonho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Junghoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Joongkyung PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyungsok YEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0217
Abstract: according to various embodiments of the present disclosure, an electronic device comprises: a housing comprising a first housing and a second housing, the second housing accommodating at least part of the first housing and configured to move relative to the first housing; a display configured to be unfolded based on the sliding movement of the housing; a multi-bar structure comprising a plurality of rods which support at least part of the display; a motor structure comprising a motor disposed in the housing and configured to generate a driving force for the sliding movement of the housing; a gear structure comprising a pinion gear configured to rotate based on the driving force; and a wire structure comprising a wire connected to the multi-bar structure and the gear structure.
Inventor(s): Musul KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangchul JUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungnyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K7/20, G06F1/16, H05K5/00
CPC Code(s): H05K7/20972
Abstract: a wearable electronic device according to an embodiment may include: a housing disposed and configured to face a user's face, a first display including a display disposed inside the housing and configured to provide visual information to corresponding one of the user's eyes, a first heat dissipation fan disposed to at least partially face the first display and configured to discharge air inside the housing to an outside of the housing, a first heat conductive member comprising a thermally conductive material configured to absorb, dissipate, and/or move heat from the first display, a first heat dissipation fin provided at one end portion of the first heat conductive member and disposed on a movement path of the air discharged by the first heat dissipation fan, a second heat dissipation fan disposed to at least partially face the first display and configured to discharge the air inside the housing to the outside of the housing, a second heat conductive member comprising a thermally conductive material configured to absorb, dissipate, and/or move heat from the second display, and a second heat dissipation fin provided at one end portion of the second heat conductive member and disposed on a movement path of the air discharged by the second heat dissipation fan.
Inventor(s): Seongkeun CHO of Suwon-si (KR) for samsung electronics co., ltd., Suhwan HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kanguk KIM of Suwon-si (KR) for samsung electronics co., ltd., Yihwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinhyung PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyunsu SHIN of Suwon-si (KR) for samsung electronics co., ltd., Taemin EARMME of Suwon-si (KR) for samsung electronics co., ltd., Sungwook JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/03
Abstract: a method may include forming a first gate structure on a first region of a substrate, forming a bit line structure on the first gate structure, forming a preliminary contact plug layer including amorphous silicon on the substrate, forming a reflective layer structure on the preliminary contact plug layer, forming a contact plug layer from the preliminary contact plug layer, and forming a capacitor on the contact plug layer. the reflective layer structure may include first and second reflective layers. a refractive index of the second reflective layer may be being greater than that of the first reflective layer. portions of the second reflective layer may have different thicknesses on first and second regions of the substrate. the forming the contact plug layer may include performing a melting laser annealing (mla) process on the reflective layer structure to convert the amorphous silicon of the preliminary contact plug layer into polysilicon.
20240381618. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongmin Kim of Suwon-si (KR) for samsung electronics co., ltd., Myeongdong Lee of Suwon-si (KR) for samsung electronics co., ltd., Seungbo Ko of Suwon-si (KR) for samsung electronics co., ltd., Donghyuk Ahn of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device includes a first contact structure on a central portion of the active pattern, a bit line structure on the first contact structure, a spacer structure on sidewalls of the bit line structure and the first contact structure and including a first spacer, a second spacer, an etch stop pattern and a third spacer sequentially stacked in a horizontal direction substantially parallel to an upper surface of the substrate, a second contact structure on an end portion of the active pattern, and a capacitor on the second contact structure. a lowermost surface of the first spacer may be lower than a lowermost surface of the second spacer, and lower surfaces of the etch stop pattern and the third spacer may be higher than the lowermost surface of the second spacer.
Inventor(s): Jungha LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiho PARK of Suwon-si (KR) for samsung electronics co., ltd., Seok-Won KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyeok YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a substrate; a bit line disposed on the substrate and extending in a first direction; a first interlayer insulating layer disposed on the bit line, and including a channel trench extending in a second direction crossing the first direction; a second interlayer insulating layer disposed on the first interlayer insulating layer; a channel pattern disposed in the channel trench; a word line extending in the second direction and spaced apart from the channel pattern; a gate insulating pattern disposed between the channel pattern and the word line; an insulating pattern disposed on the word line; and a landing pad connected to the channel pattern. the landing pad includes a first protrusion disposed between the channel pattern and the second interlayer insulating layer, and a second protrusion disposed between the channel pattern and the insulating pattern.
Inventor(s): Junhyeok AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: an embodiment provides a manufacturing method of a semiconductor device, including: forming first and second word lines in a substrate, wherein respective ends of the first and second word lines are connected to each other; forming a first separation groove between the first word line and the second word line, wherein the first separation groove includes a first insulating layer; and forming first and second bit lines on the substrate.
20240381627. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Musarrat Hasan of Suwon-si (KR) for samsung electronics co., ltd., Byounghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Sukhoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Eulji Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes a substrate including an nmos region and a pmos region, a first gate electrode inside the substrate in the nmos region, and a second gate electrode inside the substrate in the pmos region. the first gate electrode includes a first electrode pattern, and the second gate electrode includes a second electrode pattern. the first gate electrode further includes a first n-type conductive pattern between the first electrode pattern and the substrate. the second gate electrode further includes a p-type conductive pattern between the second electrode pattern and the substrate, and the p-type conductive pattern includes molybdenum titanium nitride (motin) or molybdenum silicon nitride (mosin).
20240381641. VERTICAL MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungeun PARK of Suwon-si (KR) for samsung electronics co., ltd., Solmi KWAK of Suwon-si (KR) for samsung electronics co., ltd., Jinhyuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeongyong SUNG of Suwon-si (KR) for samsung electronics co., ltd., Minsoo SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seungjun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Joongshik SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sunghee CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27, H10B41/40, H10B43/40
CPC Code(s): H10B43/27
Abstract: a vertical memory device may include a common source plate on a substrate including a first region and a second region; gate pattern structures on the common source plate and extending from the first region to the second region, wherein the gate pattern structures include gate patterns and first insulation layers, and wherein the adjacent gate pattern structures are spaced apart from each other; first separation patterns filling first openings between the adjacent gate pattern structures on the first region; second separation patterns filling second openings between the adjacent gate pattern structures on the second region, wherein at least one of the second separation patterns is connected to at least one of the first separation patterns, and wherein the second separation pattern has a shape different from a shape of the first separation pattern; and channel structures passing through the gate pattern structures on the first region.
20240381643. VERTICAL MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Juyeon Jung of Suwon-si (KR) for samsung electronics co., ltd., Byoungtaek Kim of Suwon-si (KR) for samsung electronics co., ltd., Gwangwe Yoo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/00, H10B41/27
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a gate electrode structure including gate electrodes spaced apart in a first direction perpendicular to an upper surface of a substrate, each gate electrode extending in a second direction parallel to the upper surface of the substrate, a memory channel structure, and a support pattern array including support patterns spaced apart in the second direction and a third direction crossing the second direction, wherein each support pattern has a shape including three vertices and three sides, and wherein a first vertex of a first support pattern closest to a second support pattern and a first vertex of the second support pattern closest to the first support pattern are not aligned in the third direction but have different positions in the second direction.
Inventor(s): Sung Woo KIM of Suwon-si (KR) for samsung electronics co., ltd., You Jung CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Dongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Enjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Chan Su KIM of Suwon-si (KR) for samsung electronics co., ltd., Hong Kyu SEO of Suwon-si (KR) for samsung electronics co., ltd., ILYOUNG LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungwoo HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K50/115, C01G9/02, H10K50/16, H10K71/12
CPC Code(s): H10K50/115
Abstract: an electroluminescent device, a method of manufacturing the same, and a display device including the same are provided. the method of manufacturing the electroluminescent device comprises disposing a light emitting layer including a semiconductor nanoparticle on a first electrode; depositing a composition including a zinc oxide nanoparticle containing a first metal onto the light emitting layer to provide an electron transport layer; and disposing a second electrode on the electron transport layer to provide the electroluminescent device. the first metal includes an alkaline earth metal, zirconium, tungsten, titanium, yttrium, aluminum, gallium, indium, tin, cobalt, vanadium, or a combination thereof. the zinc oxide nanoparticle has a particle size of 1 nanometer or more and 50 nanometers or less. preparation of the zinc oxide nanoparticle includes contacting a first metal precursor, a zinc precursor, a base, and a metal carbonate in an organic solvent to form the zinc oxide nanoparticle.
Inventor(s): Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeong-Ju KIM of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Jeoung In YI of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Tae Jin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D471/06, C07D495/16, H10K30/30
CPC Code(s): H10K85/657
Abstract: a compound represented by chemical formula 1 is provided. the compound has a reorganization energy of less than about 0.191 ev and a maximum absorption wavelength value calculated by density functional theory (dft) of less than or equal to about 500 nm.
Inventor(s): Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeong-Ju KIM of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Jeoung In YI of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Tae Jin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D471/06, C07D495/16, H10K30/30
CPC Code(s): H10K85/657
Abstract:
Inventor(s): Younhee LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeong-Ju KIM of Suwon-si (KR) for samsung electronics co., ltd., Feifei FANG of Suwon-si (KR) for samsung electronics co., ltd., Jeoung In YI of Suwon-si (KR) for samsung electronics co., ltd., Kyung Bae PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Tae Jin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D471/06, C07D495/16, H10K30/30
CPC Code(s): H10K85/657
Abstract: in chemical formula 1, the definition of each group is as described in the specification.
Inventor(s): Namhai PHAM of Tokyo (JP) for samsung electronics co., ltd., Hoanghuy HO of Tokyo (JP) for samsung electronics co., ltd., Shigeki TAKAHASHI of Yokohama-shi (JP) for samsung electronics co., ltd., Yoshiyuki HIRAYAMA of Yokohama-shi (JP) for samsung electronics co., ltd.
IPC Code(s): H10N50/80, H10B61/00, H10N50/10, H10N50/85
CPC Code(s): H10N50/80
Abstract: a magnetoresistive device and a semiconductor device in which magnetic properties may be improved are provided. a magnetoresistive device includes an sot electrode layer, a metal oxide layer, a first nonmagnetic layer, and a magnetic tunnel junction element including a first magnetic layer, a second nonmagnetic layer, and a second magnetic layer. the sot electrode layer includes bisb, the metal oxide layer includes metal oxide, the first nonmagnetic layer at least partially includes an amorphous material, and a crystal included in the sot electrode layer and a crystal included in the first magnetic layer have different rotational symmetries to a stacking direction thereof.
Samsung Electronics Co., Ltd. patent applications on November 14th, 2024
- Samsung Electronics Co., Ltd.
- A01N43/84
- A01N41/10
- A01N43/38
- A01N43/90
- A01N59/14
- A01N59/26
- A01P1/00
- CPC A01N43/84
- Samsung electronics co., ltd.
- A61B5/00
- G06F18/25
- G06V40/10
- G06V40/50
- CPC A61B5/744
- B23P19/06
- B23Q5/10
- CPC B23P19/069
- B25J9/00
- B25J5/00
- B25J9/16
- B25J15/08
- B25J19/00
- B67B7/18
- CPC B25J9/0084
- B25J15/00
- B25J13/08
- CPC B25J15/0028
- B65G49/00
- B25J11/00
- H01L21/67
- CPC B65G49/00
- C23C16/46
- H01J37/32
- CPC C23C16/46
- D06F39/02
- D06F39/08
- D06F39/12
- CPC D06F39/022
- D06F23/02
- F04B13/00
- F04B49/16
- F16K15/14
- F24C3/08
- F23D14/04
- CPC F24C3/087
- F25B41/20
- F25B7/00
- CPC F25B41/20
- G01B11/27
- CPC G01B11/272
- G01C21/36
- G06Q30/0251
- G06T7/73
- G06T19/00
- G06V20/20
- CPC G01C21/3679
- G01J3/28
- G01J3/51
- CPC G01J3/2823
- G02B5/18
- B82Y20/00
- G02B1/00
- G02B1/118
- CPC G02B5/1866
- G02B13/00
- G02B27/00
- CPC G02B13/003
- G02F1/29
- CPC G02F1/292
- G03F7/039
- G03F7/004
- G03F7/09
- G03F7/16
- CPC G03F7/0392
- G03F7/00
- CPC G03F7/70633
- CPC G03F7/706845
- G05D1/02
- G06F40/40
- G06T7/70
- G06V20/50
- CPC G05D1/0274
- G05D1/656
- G05D105/20
- G05D107/70
- CPC G05D1/656
- G06F1/3296
- G06F1/20
- G06F15/78
- CPC G06F1/3296
- G06F3/01
- G02B27/01
- G06F3/04845
- G06T19/20
- CPC G06F3/017
- G06F3/02
- G06F3/041
- G06F3/04817
- G06F3/04842
- G06F3/04847
- CPC G06F3/0205
- G06F3/0354
- CPC G06F3/04162
- G06F3/0482
- F24F11/52
- G06F3/0484
- G06F9/451
- CPC G06F3/0482
- G06F3/06
- CPC G06F3/0607
- CPC G06F3/0608
- CPC G06F3/0659
- G06F9/50
- CPC G06F9/5016
- G06F12/0815
- G06F1/12
- CPC G06F12/0815
- G06F12/0862
- CPC G06F12/0862
- G06F21/62
- G06F21/60
- CPC G06F21/62
- G06F30/34
- G06F30/333
- CPC G06F30/34
- G06F30/3947
- CPC G06F30/3947
- G06T5/60
- G06T5/70
- G06T15/00
- G06T15/20
- CPC G06T5/60
- G06T5/50
- G06T7/00
- G06T7/90
- G06V40/16
- G06T5/20
- G06V10/771
- CPC G06T7/0002
- G06T9/00
- G06N3/045
- G06T3/4046
- CPC G06T9/002
- G06T17/00
- CPC G06T17/00
- G06T5/80
- H04N13/117
- CPC G06T19/006
- CPC G06V20/20
- G06V30/32
- G06F40/166
- G06F40/263
- G06V30/19
- G06V30/22
- CPC G06V30/36
- G11C7/22
- G06F1/04
- G11C5/14
- G11C29/02
- CPC G11C7/222
- G11C11/4091
- G11C7/10
- G11C11/408
- G11C11/4093
- G11C11/4096
- CPC G11C11/4091
- G11C11/4076
- G11C11/4094
- G11C16/08
- G11C5/06
- G11C16/04
- CPC G11C16/08
- G11C16/10
- G11C16/34
- CPC G11C16/102
- CPC H01J37/32724
- CPC H01J37/32935
- H01L21/02
- CPC H01L21/02098
- CPC H01L21/67011
- H01L21/677
- CPC H01L21/67051
- H01L21/762
- H01L29/423
- H10B12/00
- CPC H01L21/76224
- H01L23/522
- H01L23/528
- H01L29/06
- H01L29/66
- CPC H01L21/76229
- H01L21/768
- H01L21/311
- CPC H01L21/76877
- H01L23/31
- H01L21/48
- H01L21/56
- H01L21/78
- H01L23/00
- H01L23/498
- H01L25/065
- CPC H01L23/3128
- CPC H01L23/3135
- CPC H01L23/49822
- H01L25/10
- H01L25/16
- CPC H01L23/49838
- H01L23/532
- CPC H01L23/5283
- H01L21/8234
- H01L23/485
- H01L27/088
- H01L29/08
- H01L29/417
- H01L29/775
- H01L29/78
- H01L29/786
- CPC H01L23/5286
- H01L23/538
- H01L21/683
- CPC H01L23/5386
- CPC H01L24/13
- H01L25/18
- CPC H01L25/0657
- H01L23/48
- H01L23/28
- H01L25/00
- CPC H01L25/105
- H10B80/00
- CPC H01L25/16
- H10B43/10
- H10B43/27
- CPC H01L25/18
- H01L27/02
- G06F30/392
- CPC H01L27/0207
- H01L27/146
- CPC H01L27/1461
- CPC H01L27/14636
- CPC H01L27/14643
- CPC H01L29/0847
- H01L27/06
- CPC H01L29/41733
- CPC H01L29/42392
- H01L21/28
- H10B51/40
- CPC H01L29/6684
- H01L33/14
- H01L33/38
- CPC H01L33/14
- H01L33/62
- H01L25/075
- H01L33/46
- CPC H01L33/62
- H01Q1/24
- G06F1/16
- H01Q1/42
- H01Q1/48
- H01Q13/16
- H04M1/02
- CPC H01Q1/243
- H01Q1/38
- H01Q13/10
- H01R13/24
- CPC H01Q1/38
- H02J7/02
- G09G3/32
- CPC H02J7/02
- H02M3/158
- CPC H02M3/158
- H03F1/26
- H03F3/16
- H04N25/50
- H04N25/60
- H04N25/77
- CPC H03F1/26
- H03M13/15
- H03M13/00
- CPC H03M13/1515
- CPC H03M13/152
- H04B7/06
- CPC H04B7/0663
- H04L5/00
- H04W4/90
- H04W12/80
- H04W56/00
- H04W64/00
- H04W84/06
- CPC H04L5/0051
- H04L9/32
- CPC H04L9/3247
- H04L43/087
- H04L43/06
- H04W28/02
- CPC H04L43/087
- H04L51/04
- A63B24/00
- CPC H04L51/04
- H04L61/5007
- H04L101/618
- H04W8/26
- H04W36/00
- H04W36/36
- CPC H04L61/5007
- H04L65/80
- H04L65/70
- H04W76/10
- H04W88/16
- CPC H04L65/80
- H04L67/55
- H04L67/02
- CPC H04L67/55
- H04N13/366
- H04N13/243
- H04N13/296
- H04N23/16
- H04N23/72
- H04N23/73
- H04N23/74
- H04N23/90
- CPC H04N13/366
- H04N19/132
- H04N19/105
- H04N19/117
- H04N19/159
- H04N19/176
- H04N19/82
- CPC H04N19/132
- H04N19/174
- H04N19/60
- CPC H04N19/174
- H04N23/67
- H04N23/667
- H04N23/71
- H04N23/75
- H04N25/704
- CPC H04N23/672
- H04N23/68
- H04N23/45
- H04N23/57
- H04N23/65
- CPC H04N23/683
- H04N25/13
- G02F1/1334
- H04N9/64
- H04N23/84
- CPC H04N25/134
- H04R9/06
- H04R1/02
- H04R7/12
- H04R7/18
- H04R9/02
- H04R9/04
- CPC H04R9/06
- H04W4/08
- H04W84/18
- CPC H04W4/08
- H04W8/12
- H04W84/04
- CPC H04W8/12
- H04W24/02
- H04W8/22
- H04W48/16
- CPC H04W24/02
- H04W24/08
- H04L41/5003
- CPC H04W24/08
- H04W28/086
- H04W72/0453
- CPC H04W28/0864
- H04W28/24
- H04L65/1016
- H04W36/08
- H04W60/04
- H04W76/15
- CPC H04W28/24
- CPC H04W36/0005
- H04L1/1829
- CPC H04W36/0007
- CPC H04W36/0069
- H04B17/318
- H04W72/1273
- H04W72/231
- H04W76/28
- CPC H04W36/00725
- H04W36/30
- H04B17/382
- CPC H04W36/305
- CPC H04W36/362
- H04W48/08
- H04W60/06
- CPC H04W48/08
- H04W48/14
- CPC H04W48/14
- H04W48/18
- CPC H04W48/18
- H04W52/02
- H04W92/18
- CPC H04W52/0216
- CPC H04W52/0258
- H04W52/36
- H04B1/3827
- H04W52/34
- CPC H04W52/367
- H04W12/106
- H04W76/20
- CPC H04W60/06
- H04W4/12
- CPC H04W64/00
- H04B1/7163
- H04W74/0816
- H04W68/02
- CPC H04W68/02
- H04W72/1263
- CPC H04W72/1263
- H04W72/1268
- H04W72/51
- CPC H04W72/1268
- H04W72/21
- H04L1/1607
- H04L1/1812
- CPC H04W72/21
- H04W72/25
- H04W72/232
- CPC H04W72/25
- H04W72/30
- CPC H04W72/30
- H04W72/40
- CPC H04W72/40
- H04W72/23
- H04W16/28
- H04W72/563
- CPC H04W72/563
- H04W74/04
- H04W74/08
- H04W76/40
- CPC H04W74/04
- H04W74/0833
- H04W36/18
- CPC H04W74/0833
- H04W72/044
- H04L47/34
- CPC H04W76/40
- H05K1/02
- H05K3/42
- CPC H05K1/0201
- H05K5/02
- CPC H05K5/0217
- H05K7/20
- H05K5/00
- CPC H05K7/20972
- CPC H10B12/03
- CPC H10B12/315
- CPC H10B12/482
- CPC H10B12/50
- H10B41/27
- H10B41/40
- H10B43/40
- CPC H10B43/27
- H10K50/115
- C01G9/02
- H10K50/16
- H10K71/12
- CPC H10K50/115
- H10K85/60
- C07D471/06
- C07D495/16
- H10K30/30
- CPC H10K85/657
- H10N50/80
- H10B61/00
- H10N50/10
- H10N50/85
- CPC H10N50/80