SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on April 11th, 2024
SAMSUNG ELECTRONICS CO., LTD.: 164 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H10B43/27 (12), H01L29/775 (12), H01L29/423 (8), H04W24/10 (8), H01L23/00 (8)
With keywords such as: device, configured, based, information, semiconductor, including, surface, substrate, layer, and structure in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Dae Geun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/00
Abstract: an apparatus for estimating physiological variables includes: a sensor configured to measure a bio-signal from an object; and a processor. the processor is configured to: configure input data for use in a neural network-based physiological variable estimation model based on bio-signal data measured at different times by the sensor, and input the configured input data to the physiological variable estimation model to obtain a variation in physiological variables over a time period from a calibration time to a current time.
Inventor(s): Jongwook JOO of Suwon-si (KR) for samsung electronics co., ltd., Youngchul KO of Suwon-si (KR) for samsung electronics co., ltd., Donghyo KIM of Suwon-si (KR) for samsung electronics co., ltd., Myungju SHIN of Suwon-si (KR) for samsung electronics co., ltd., Hyunmin KIM of Yongin-si (KR) for samsung electronics co., ltd., Jegu MUN of Seongnam-si (KR) for samsung electronics co., ltd., Jingam PARK of Seongnam-si (KR) for samsung electronics co., ltd., Sunyoung CHOI of Gwangju-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61L9/20
Abstract: a sterilizing apparatus and a home appliance comprising the same are provided. the sterilizing apparatus may include: a lamp body containing a gas configured to emit ultraviolet rays through electric discharge and having a cylindrical shape, a plurality of external electrodes disposed on an outer circumferential surface of the lamp body and extending in a longitudinal direction of the lamp body, and a cover including an inner wall and an outer wall, and provided in a radial direction of the lamp body to allow the inner wall to face the outer circumferential surface of the lamp body and outer surfaces of the plurality of external electrodes, wherein the lamp body includes a light-emitting region provided on the outer circumferential surface of the lamp body, the light-emitting region disposed between the plurality of external electrodes and configured to allow light emitted from the lamp body to be transmitted, wherein the cover is configured to cover at least a portion of the light-emitting region to scatter the light emitted from the lamp body.
20240115888.MASK_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Younglae JO of Suwon-si (KR) for samsung electronics co., ltd., Joonhyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngchal PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjoon SEO of Suwon-si (KR) for samsung electronics co., ltd., Youngtae SONG of Suwon-si (KR) for samsung electronics co., ltd., Sungjune CHO of Suwon-si (KR) for samsung electronics co., ltd., Sungjin CHO of Suwon-si (KR) for samsung electronics co., ltd., Wangbyung CHAE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A62B18/00, A62B23/02
Abstract: a mask including a mask body and a blower. the mask body includes a first coupling part, and a second coupling part spaced apart from the first coupling part. the blower includes a third coupling part configured to be detachably couplable to the first coupling part and prevented from being coupled to the second coupling part, and a fourth coupling part configured to be detachably couplable to the second coupling part and prevented from being coupled to the first coupling part. with the third coupling part detachably coupled to the first coupling part and the fourth coupling part detachably coupled to the second coupling part, the blower is disposed to a rear of the mask body and is operable to force air to flow into and out of the mask.
Inventor(s): Donghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Keehong SEO of Suwon-si (KR) for samsung electronics co., ltd., Donghan KOO of Suwon-si (KR) for samsung electronics co., ltd., Seungyong HYUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A63B21/005, A63B21/00, A63B24/00
Abstract: to control tension of a string of a tension control apparatus, a target operation mode of the tension control apparatus may be received, a first tension value may be generated by measuring tension of a string connected to a sensor using the sensor, a first control signal for controlling a motor connected to the string may be generated based on the first tension value and the target operation mode, and tension of the string may be controlled by controlling the motor based on the first control signal.
20240116184.AUTOMATED GAS SUPPLY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Min Sung HA of Seoul (KR) for samsung electronics co., ltd., Kwang-Jun KIM of Ansan-si (KR) for samsung electronics co., ltd., Jong Kyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun-Joong KIM of Seongnam-si (KR) for samsung electronics co., ltd., Jin Ho SO of Seoul (KR) for samsung electronics co., ltd., Chi-Gun AN of Suwon-si (KR) for samsung electronics co., ltd., Ki Moon LEE of Seoul (KR) for samsung electronics co., ltd., Hui Gwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Beom Soo HWANG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): B25J9/16, B25J5/02, B25J9/00, B25J13/08
Abstract: an automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a residual gas detector configured to detect a residual amount of the gas stored in the gas cylinder fastened to the gas pipe, and when the residual amount of the gas detected by the residual gas detector is less than or equal to a set residual amount of gas, the mobile robot recovers the gas cylinder from inside the gas cabinet and transfers a gas cylinder stored in the storage queue to the gas cabinet.
Inventor(s): Won-Gi HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B60W60/00, G07C5/08
Abstract: a data storage system for automated driving, includes: a non-volatile memory device; a dedicated memory configured to be managed by an external host as a system memory; an auxiliary power supply configured to provide an auxiliary power; and a storage controller configured to, under control of the external host, store user data in the nonvolatile memory device and store sensor data in the dedicated memory in a ring buffer manner, wherein the storage controller is further configured to, based on a trigger condition being satisfied, flush at least a portion of the sensor data stored in the dedicated memory to the non-volatile memory device by using the auxiliary power.
20240116704.FOOD WASTE DISPOSER INCLUDING DOOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hojin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Namsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngkyun JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65F1/16
Abstract: according to an embodiment, a food waste disposer includes a housing having an opening formed on one end thereof, and a door coupled by hinge to open or close the opening of the housing. the door includes a door lever configured to be insertable into a fixing groove provided adjacent to the opening of the housing, a holder lever coupled to the door lever and configured to rotate about a rotation shaft, a pulling member configured to transmit a physical external force applied from the outside to the holder lever such that the holder lever rotates about the rotation shaft, one end of the pulling member being connected to the holder lever, and an actuator configured to generate a force to rotate the holder lever about the rotation shaft, based on an electrical signal.
Inventor(s): Eunkyung LEE of Suwon-si, Gyeonggi-do (US) for samsung electronics co., ltd., Juhyun KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sangmo KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Youngmok Son of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sooghang Ihn of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jun CHWAE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): C07F5/02, C09K11/06, H10K50/12, H10K85/60
Abstract: provided are a heterocyclic compound represented by formula 1, an organic light-emitting device including the same, and a diagnostic composition including the heterocyclic compound as described in the detailed description.
Inventor(s): Eunkyung LEE of Suwon-si, Gyeonggi-do (US) for samsung electronics co., ltd., Juhyun KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sangmo KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Yongsik JUNG of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jiwhan KIM of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Youngmok Son of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Sooghang Ihn of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd., Jun CHWAE of Suwon-si, Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): C07F5/02, C09K11/06, H10K50/12, H10K85/60
Abstract:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Hweayoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Hwayoung Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/12, H10K85/30
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Hweayoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Hwayoung Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/12, H10K85/30
Abstract:
m(l)(l) formula 1
Inventor(s): Bumwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Ohyun Kwon of Suwon-si (KR) for samsung electronics co., ltd., Virendra Kumar RAI of Suwon-si (KR) for samsung electronics co., ltd., Hweayoon Kim of Suwon-si (KR) for samsung electronics co., ltd., Hwayoung Cho of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/06, H10K50/12, H10K85/30
Abstract:
Inventor(s): Mikyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/28, D06F29/00, D06F34/05
Abstract: an apparatus comprising: a washing machine, a drying machine disposed on the washing machine, and a control panel. the control panel including a first user interface configured to control the washing machine, a second user interface configured to control the drying machine, a first start/pause button configured to receive an input for starting or pausing an operating of the washing machine, a second user interface configured to receive an input for controlling the drying machine, and a display configured to display operation information of the washing machine and operation information of the drying machine. the apparatus configured to control an operation of the drying machine in response to an input received through the second start/pause button while operation information of the washing machine is displayed on the display.
Inventor(s): Mikyoung KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/28, D06F29/00, D06F34/05
Abstract: an apparatus comprising: a washing machine, a drying machine disposed on the washing machine, and a control panel. the control panel including a first user interface configured to control the washing machine, a second user interface configured to control the drying machine, a first start/pause button configured to receive an input for starting or pausing an operating of the washing machine, a second user interface configured to receive an input for controlling the drying machine, and a display configured to display operation information of the washing machine and operation information of the drying machine. the apparatus configured to control an operation of the drying machine in response to an input received through the second start/pause button while operation information of the washing machine is displayed on the display.
20240117975.OUTDOOR UNIT OF AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyejeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Keunjeong JANG of Suwon-si (KR) for samsung electronics co., ltd., Eunsung JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F24F1/38, F24F1/56
Abstract: an outdoor unit of an air conditioner, including a housing including an inlet and an outlet, wherein a flow path is formed between the inlet and the outlet inside the housing; a heat exchanger positioned on the flow path inside the housing; and a blower fan inside the housing between the inlet and the heat exchanger, and configured to flow air along the flow path, from the inlet, through the heat exchanger, and toward the outlet, wherein the blower fan includes a hub configured to be rotatable, and a plurality of blades extending from the hub and arranged along a circumference of the hub, each blade among the plurality of blades includes a leading edge at a side of a rotation direction of the hub, a trailing edge opposite to the leading edge, and a blade surface between the leading edge and the trailing edge and inclined toward the inlet from the trailing edge to the leading edge.
Inventor(s): Junghoon SEO of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae KO of Suwon-si (KR) for samsung electronics co., ltd., Ganghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeuk RYOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D29/00
Abstract: a refrigerator is disclosed. the refrigerator includes a temperature sensor, a cooling device, and a processor which controls the cooling device such that, when a user command to change the temperature of a storage compartment set to a first temperature to a second temperatures, is input, the temperature of the storage compartment is changed to the second temperature, based on the temperature of the storage compartment sensed by the temperature sensor, and controls the cooling device such that, when a certain period of time elapses after a point in time when the user command is input, the temperature of the storage compartment returns to the first temperature, based on the temperature of the storage compartment sensed by the temperature sensor.
Inventor(s): Dongpil SEO of Suwon-si (KR) for samsung electronics co., ltd., Daegeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F26B21/08, F26B9/06, F26B21/00
Abstract: a shoe care apparatus includes: a chamber configured to accommodate a shoe; a fan configured to supply air to the chamber; a heat pump device comprising a condenser configured to heat the air and a compressor configured to discharge a refrigerant to the condenser; at least one holder in the chamber and comprising a nozzle configured to spray the air; at least one damper on a side of the chamber, the at least one damper corresponding to the at least one holder so as to adjust supply of the sprayed air; at least one detection sensor in the chamber, the at least one detection sensor being configured to detect the shoe accommodated in the chamber; and a controller configured to control the at least one damper based on a detection signal received from the at least one detection sensor.
20240118045.HEAT EXCHANGER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunchul CHO of Suwon-si (KR) for samsung electronics co., ltd., Kangtae SEO of Suwon-si (KR) for samsung electronics co., ltd., Jeungku CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yonghwa CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F28F9/02, F28F9/18
Abstract: a heat exchanger including a heat exchange fin; a refrigerant pipe passing through the heat exchange fin, the refrigerant pipe having a first thickness; a connecting member coupled to the refrigerant pipe; and a distribution pipe coupled to the connecting member at an outside of the heat exchange fin, the distribution pipe having a second thickness greater than the first thickness, wherein the connecting member is positioned between the refrigerant pipe and the distribution pipe so that a refrigerant is flowable through the connecting member between the refrigerant pipe and the distribution pipe, and has a thickness in a range of 95% or more and 105% or less of the second thickness.
Inventor(s): Sungho Jang of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo Bae of Suwon-si (KR) for samsung electronics co., ltd., Minhwan Seo of Suwon-si (KR) for samsung electronics co., ltd., Jangwoon Sung of Suwon-si (KR) for samsung electronics co., ltd., Akinori Okubo of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Jungchul Lee of Suwon-si (KR) for samsung electronics co., ltd., Jaehwang Jung of Suwon-si (KR) for samsung electronics co., ltd., Sangjoon Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01B11/06, G01B9/02
Abstract: provided are a level sensor configured to detect a height level of a substrate, and a substrate processing apparatus including the level sensor. the level sensor includes a measurement light source configured to radiate measurement light toward the substrate, a prism configured to split reflected light of the measurement light into first polarized light and second polarized light and generate a first optical path length difference between the first polarized light and the second polarized light, an optical path length modulator configured to keep constant an optical path length of the first polarized light and periodically change an optical path length of the second polarized light, and a detector configured to detect the first optical path length difference based on an interference signal between the first polarized light and the second polarized light.
Inventor(s): Daeul PARK of Suwon-si (KR) for samsung electronics co., ltd., Seho SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01C21/36, G01C21/34
Abstract: a device for determining a parking path based on a user input including a processor, and a memory storing a plurality of instructions and the processor is configured to execute the plurality of instructions to configure the processor to be configured to recognize a space around a vehicle to determine one or more candidate parking spaces and determine a final parking path from a current location to a target parking space by using a user selected input initial parking path, of the one or more candidate parking paths, as an initial value for a search algorithm for the final parking path.
Inventor(s): Jaewook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dongchan Kim of Suwon-si (KR) for samsung electronics co., ltd., Dongnam Byun of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung Hwang of Suwon-si (KR) for samsung electronics co., ltd., Sejin Kwak of Suwon-si (KR) for samsung electronics co., ltd., Geunho Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01C21/00, G01C21/20, G01C21/32
Abstract: provided is a method, performed by a server, of providing a personalized spatial map, the method comprising: obtaining a first spatial map including first map features representing spatial information about a space; obtaining a second spatial map based on sensor data obtained by measuring the space, the second spatial map including second map features; identifying third map features for map alignment from among the first map features and the second map features; aligning the first spatial map and the second spatial map, based on the identified third map features; identifying local areas in the space where at least one difference exists between the first spatial map and the second spatial map; and generating the personalized spatial map by identifying pieces of spatial information about the local areas based on the second map features.
Inventor(s): Gae Hwang LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjun YUN of Suwon-si (KR) for samsung electronics co., ltd., Jong Won CHUNG of Hwaseong-si (KR) for samsung electronics co., ltd., Yeongjun LEE of Seongnam-si (KR) for samsung electronics co., ltd., Won-Jae JOO of Seongnam-si (KR) for samsung electronics co., ltd., Yasutaka KUZUMOTO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01L1/24, G01B11/16, G01L11/02
Abstract: a stretchable strain sensor includes a light-emitting element, an optical structure, and a photo-detective element. the stretchable strain sensor is located in a path of light emitted from the light-emitting element. the optical structure is configured to have optical properties that change in response to stretching of at least a portion of the stretchable strain sensor. the photo-detective element is configured to detect light transmitted through the optical structure or reflected through the optical structure.
Inventor(s): Ilhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Gibong SUNG of Seoul (KR) for samsung electronics co., ltd., Sejin YOOK of Seou (KR) for samsung electronics co., ltd., Seokwhan CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Kwangwook CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N15/02, G01N15/06
Abstract: a fine dust measurement module includes a fluid inlet through which a fluid including fine dust is introduced, a first channel through which first fine dust having at least a first diameter, among the fine dust introduced into the fluid inlet, passes, a second channel through which second fine dust having a second diameter that is less than the first diameter, among the fine dust introduced into the fluid inlet, passes, a fine dust detection sensor for sensing fine dust flowing into the second channel, a heater above the fine dust detection sensor, and an orifice upstream of a flow of the second fine dust from the fine dust detection sensor and the heater.
Inventor(s): Nahm il KOO of Suwon-si (KR) for samsung electronics co., ltd., Minkyu JE of Daejeon (KR) for samsung electronics co., ltd., Ji-Hoon SUH of Daejeon (KR) for samsung electronics co., ltd., Haidam CHOI of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G01R19/10, G01R25/00
Abstract: an electronic device includes a baseline current generator configured to generate a baseline current based on a reference current generated by a reference current generator, variable impedance circuitry configured to receive the baseline current, and subtraction circuitry configured to receive a measured voltage based on a result of the reference current being applied to a target impedance, and an estimated voltage generated based on a result of the baseline current being applied to the variable impedance circuitry and subtract the estimated voltage from the measured voltage.
Inventor(s): Yongsik CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B13/00, G02B9/64, H04N23/55, H04N23/57, H04N23/68
Abstract: an imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens, sequentially arranged from an object side of the imaging lens system to an image side of the imaging lens system, wherein a lens length (ttl) of the imaging lens system is a distance from an incident surface of the first lens to an imaging plane on the image side of the imaging lens system, wherein an image height (ih) is a diagonal diameter of an image sensor at the imaging plane on the image side of the imaging lens system, and wherein the lens length (ttl) divided by twice the image height (ih) is less than 0.56.
20240118621.SUBSTRATE TREATING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seulgi HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/16
Abstract: a substrate treating apparatus includes a chamber having a gate through which a substrate is loaded into the chamber and unloaded from the chamber, a gas supply unit in an upper portion in the chamber and configured to supply gas into the chamber, a spin coater in a lower portion in the chamber and including a spin chuck configured to support and rotate the substrate on an upper surface thereof and a cup portion extending around the substrate and configured to collect and discharge a chemical liquid from the substrate, a chemical liquid supply unit configured to supply a chemical liquid onto the substrate, and a heater between the substrate and the gas supply unit and configured to heat the substrate.
Inventor(s): Jeongjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Inbeom Yim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F7/20, H01L21/027, H01L21/033, H01L21/66
Abstract: a method of correcting overlay includes forming first patterns in a plurality of first shot areas by radiating extreme ultraviolet light reflected from a first mask to a first layer; forming second patterns in each of a plurality of second shot areas by radiating extreme ultraviolet light reflected from a second mask to a second layer; matching a pair of second shot areas to each of the first shot areas; and generating first and second correction parameters for correcting an overlay error of the second patterns, wherein the first correction parameter is configured to correct an overlay error of each of the second shot areas based on the first shot area matched to each of the second shot areas, and the second correction parameter is configured to correct an overlay error between the pair of second shot areas matched to each of the first shot areas.
Inventor(s): Joosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanguk KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
Abstract: an electronic device includes a display; a conductive plate supporting the display; a bracket including a surface and a structure at least partially removed from the surface, wherein the surface faces toward the conductive plate and is spaced apart from the conductive plate; a connecting member crossing the structure along the surface and connecting the conductive plate and the bracket, the connecting member including a first conductive portion and a second conductive portion; and a conductive tape between the connecting member and the bracket, wherein the first conductive portion overlaps with the structure when viewed from a first direction toward the display and is at least partially inserted into the structure, at least part of the first conductive portion contacts the conductive plate, and the second conductive portion extends from the first conductive portion along a surface of the bracket and has an end attached to the bracket through the conductive tape.
Inventor(s): INSUNG KIM of Hwaseong-si (KR) for samsung electronics co., ltd., JOOMYOUNG KIM of Hwaseong-si (KR) for samsung electronics co., ltd., WOOSEOK KIM of Suwon-si (KR) for samsung electronics co., ltd., TAEIK KIM of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/26, G05F1/56, G06F1/04, H03K3/037
Abstract: an electronic device including: a regulator circuit configured to output a regulated voltage based on a reference voltage and a feedback voltage; and an oscillator configured to generate an output frequency signal based on a reference frequency signal and the regulated voltage output from the regulator circuit, wherein the regulator circuit includes: a feedback loop configured to output the regulated voltage based on a difference between the reference voltage and the feedback voltage; a first capacitor; a precharge circuit connected to the feedback loop, and configured to charge the first capacitor with a second voltage which is based on a first voltage; a first switch configured to connect the precharge circuit with the first capacitor; and a second switch configured to connect the first capacitor with the feedback loop.
Inventor(s): Mansung KIM of Suwon-si (KR) for samsung electronics co., ltd., Minuk KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongjun KO of Suwon-si (KR) for samsung electronics co., ltd., Jaeho LEE of Suwon-si (KR) for samsung electronics co., ltd., Yoondo JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F1/16
Abstract: an electronic device includes: a hinge structure; a first housing connected to the hinge structure and including a first surface and a second surface; a second housing connected to the hinge structure and including a third surface and a fourth surface; a flexible display; a touch sensor; memory; and a processor, wherein the memory stores instructions configured to cause, when executed by the processor, the electronic device to, identify first coordinate information of at least one object on a first area of the flexible display and second coordinate information of the at least one object on a second area of the flexible display by using the touch sensor; and on the basis of the identified first coordinate information and the identified second coordinate information, identify three-dimensional coordinate information of the at least one object in the space formed by the first surface and the third surface.
Inventor(s): Kyung-Hwan KIM of Yongin-si (KR) for samsung electronics co., ltd., Dong-Jeon KIM of Anyang-si (KR) for samsung electronics co., ltd., Jin-Hong JEONG of Yongin-si (KR) for samsung electronics co., ltd., Hye-Soon JEONG of Chilgok-gun (KR) for samsung electronics co., ltd., Se-Jun SONG of Seoul (KR) for samsung electronics co., ltd., Yo-Han LEE of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0481, G06F3/0482, G06F3/04842, H04L67/06
Abstract: a method for processing contents at an electronic device is provided. the method includes generating a first content corresponding to a user input applied to content via the electronic device, and displaying a floating user interface (ui), which displays first scrap information on the first content, on a screen of the electronic device.
Inventor(s): Jangwon SEO of Suwon-si (KR) for samsung electronics co., ltd., Seokhyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Junggeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Joosun MOON of Suwon-si (KR) for samsung electronics co., ltd., Arum CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/0482, G06F3/04845, G06F3/0485
Abstract: an electronic apparatus includes: one or more processors are configured to: display a list comprising (i) a first group that includes one or more first graphic user interface (gui) items and (ii) a second group that includes one or more second gui items, display a title of the first group on at least one of an upper end or a lower end of a display of the one or more first gui items on the display, display a title of the second group on at least one of an upper end or a lower end of a display of the second group on the display, and display a modified title of one of the first group and the second group by changing a title width of at least one of the first group or the second group on the display.
Inventor(s): JOO YOUNG HWANG of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F12/02, G06F16/174
Abstract: a data processing system includes a host including a host memory storing file systems, each file system including file pages, and storage devices. each storage device includes a memory device including memory blocks, and a memory controller dividing the memory blocks into superblocks, and controlling a memory operation of the memory device based on a result of dividing the memory blocks. the host requests a first storage device of the storage devices to write a first file page of a first file system of the file systems to a first memory block of the first storage device, and requests a second storage device of the storage devices to write a second file page of the first file system of the file systems to a first memory block of the second storage device. the first file system is configured in a raid manner using at least some of the storage devices.
Inventor(s): Oscar P. PINTO of San Jose CA (US) for samsung electronics co., ltd., William MARTIN of Roseville CA (US) for samsung electronics co., ltd., Chansoo KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungmin SEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Jangwook PARK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
Abstract: provided are systems, methods, and apparatuses for transferring programs from a host to a computational storage device is described. the method can include: determining a program to transfer from a host to a computational storage device, determining that a size of the program exceeds a predetermined threshold, and transferring, based on the size, at least a portion of the program to the computational storage device.
Inventor(s): Yongjin KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyoyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Wooyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Sukjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Byungseok JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seonghoon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jongwu BAEK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F1/16, G06F3/041, G06F3/0485, G06F3/0488, G06F3/04883, G06F3/04886, G06F9/451, G06T3/40, H04M1/02
Abstract: a mobile communication device is provided. the mobile communication includes a first touch display forming a portion of a first surface of the mobile communication device, a second touch display forming a portion of a second surface of the mobile communication device, and a processor configured to display in the first touch display a first screen corresponding to an application executed in a first folding state while a state of the device is the first folding state, identify the state of the mobile communication device changing to a second folding state, and display in the second touch display, based on the identification, a second screen corresponding to the application and an image partially overlapping the second screen, a touch input on the second touch display while the second screen and the image are displayed in the second touch display as overlapping is configured to not be processed as an input.
Inventor(s): Ilku CHANG of Suwon-si (KR) for samsung electronics co., ltd., Hayeon YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14
Abstract: an electronic device is provided. the electronic device includes a communication module, a display, and at least one processor operatively connected to the communication module and the display, wherein the at least one processor is configured to, in a state that full screen information on, for mirroring, a full screen displayed on the display is transmitted to an external device via the communication module, identify whether at least one configured condition is satisfied, based on an event occurring, and based on the at least one configured condition being satisfied, transmit, to the external device, information on an execution screen of at least one application among execution screens of applications being displayed on the display, in replacement of the full screen information so as to mirror only the execution screen of the application.
Inventor(s): Mingu KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F3/0482, G06F3/0488
Abstract: an electronic device is provided. the electronic device includes a display, a communication module, a memory, and at least one processor operatively connected to the display, the communication module, and the memory, wherein the at least one processor is configured to acquire device information of an external device by using the communication module, based on the device information, determine at least one item to be transmitted to the external device from among items displayed in an application being executed on the electronic device, generate view data of the external device, the view data including information on the determined item, and establish a communication connection with the external device so as to transmit view data for transmission.
Inventor(s): Junghwi EUN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F8/65, A47L9/00, A47L9/28, G06F9/451
Abstract: provided is a method of updating a firmware of a vacuum cleaner including a station and a cleaner body. the method includes receiving, by the cleaner body, a firmware update condition check request from the station when a new version of the firmware exists, checking, by the cleaner body, whether firmware update conditions have been satisfied, transmitting, by the cleaner body, a result of the checking to the station, and when the firmware update conditions are satisfied and a user agrees to update the firmware, receiving, by the cleaner body, the new version of the firmware, and installing, by the cleaner body, the received new version of the firmware. the firmware update conditions include at least one of a communication condition, a location condition, or a battery condition of the cleaner body.
Inventor(s): Myeongjin OH of Suwon-si (KR) for samsung electronics co., ltd., Moonkyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Cheoljun PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongwook SEO of Suwon-si (KR) for samsung electronics co., ltd., Seyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongi CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F8/65
Abstract: an electronic device is provided. the electronic device includes a communication module, a memory, and a processor operatively connected with the communication module and the memory, wherein the memory stores instructions which, when executed, cause the processor to, based on application information of a specific application installed in the electronic device, receive app store source change information for updating the specific application, identify whether a higher version of the specific application exists in an app store which is to update the specific application, the app store being identified based on the app store source change information relating to the specific application, and update the specific application by receiving an application package of the higher version from the identified app store.
Inventor(s): Yang Seok KI of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F1/3228, G06F1/329, G06F9/30, G06F9/38, G06F9/48
Abstract: a system may include a receiver to receive a task. the task may include a portion of an algorithm, and may include a task power level and a task precision. the system may also include a circuit including a circuit power level and a circuit precision. the system may include first software to identify the circuit, and second software to assign the task to the circuit to reduce total power. the circuit precision may be greater than the task precision.
Inventor(s): Kyungbo YANG of Suwon-si (KR) for samsung electronics co., ltd., Hyeonwu KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongik JEON of Suwon-si (KR) for samsung electronics co., ltd., Soonsuk HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/10
Abstract: a memory controller receives a write request and write data from a host, stores first entry information including a write buffer pointer indicating a location where the write data is temporarily stored in a write buffer and a first logical address corresponding to the write request in an entry buffer, stores an entry index generated based on the first entry information in a first storage space corresponding to the first logical address in a logical-to-physical (l2p) mapping information storage circuit, and updates the entry index stored in the first storage space to a physical address newly mapped to the first logical address as the write data is programmed in a memory device.
Inventor(s): Ramdas P. KACHARE of Pleasanton CA (US) for samsung electronics co., ltd., Fred WORLEY of San Jose CA (US) for samsung electronics co., ltd., Harry ROGERS of San Jose CA (US) for samsung electronics co., ltd., Wentao WU of Milpitas CA (US) for samsung electronics co., ltd., Nagarajan SUBRAMANIYAN of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F13/40, G06F13/42
Abstract: a system is disclosed. an upstream interface enables communication with a processor; a downstream interface enables communication with a storage device. the system may also include an acceleration module implemented using hardware to execute an acceleration instruction. the storage device may include an endpoint of the storage device for communicating with the acceleration module, a controller to manage operations of the storage device, storage for data, and a storage device acceleration module to assist the acceleration module in executing the acceleration instruction.
Inventor(s): Shangqian GAO of Pittsburgh PA (US) for samsung electronics co., ltd., Burak UZKENT of Sunnyvale CA (US) for samsung electronics co., ltd., Yilin SHEN of San Jose CA (US) for samsung electronics co., ltd., Hongxia JIN of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/33, G06F16/583, G06N3/0985
Abstract: a method of performing a multimodal tasks by using a multimodal model that includes a text encoder and a vision encoder, may include obtaining a text feature from the query via the text encoder; obtaining an image feature from the one or more input images via the vision encoder; and outputting a response to the query based on similarity between the text feature and the image feature, wherein weights vectors of the text encoder and the vision encoder are pruned and shared according to a sharing vector and a pruning vector that are generated by a hypernetwork, and wherein the hypernetwork and the multimodal model are jointly trained to minimize at least one of a difference between the weight vectors in the text encoder and the vision encoder, a difference between the weight vectors in different layers of the text encoder, and a number of parameters in the multimodal model.
20240119096.META-SEARCHING METHOD AND APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chengjun WANG of Nanjing (CN) for samsung electronics co., ltd., Bo PENG of Nanjing (CN) for samsung electronics co., ltd., Jie CHEN of Nanjing (CN) for samsung electronics co., ltd.
IPC Code(s): G06F16/953, G06F16/951, G06F21/31
Abstract: a meta-searching method, including determining a target metaverse for a current search using intent classification based on an inquiry text included in a searching request of a user; extracting a searching clue and a clue type; selecting a current search engine for performing the current search using the target metaverse and the clue type by prioritizing a search engine associated with the target metaverse; performing identity authentication using the user account information of the user in the target metaverse prior to the search based on determining that user account information is required to search for the searching clue for performing a search using the current search engine, and performing the search using the current search engine based on the searching clue; and providing the search results to the user.
Inventor(s): Eun-Ho Lee of Suwon-si (KR) for samsung electronics co., ltd., Jae Choon Kim of Suwon-si (KR) for samsung electronics co., ltd., Tae-Hyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeong-Hyeon Park of Suwon-si (KR) for samsung electronics co., ltd., Hwanjoo Park of Suwon-si (KR) for samsung electronics co., ltd., Sunggu Kang of Suwon-si (KR) for samsung electronics co., ltd., Sung-Ho Mun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/392, G06N20/00
Abstract: a semiconductor design optimization system that includes: a data base configured to store design data, a training data preprocessing unit configured to preprocess the design data and generate training data, a data learning unit configured to generate a physical property prediction model by training using the training data, a physical property prediction unit configured to generate predicted physical property data including information associated with predicted physical property values for each region of a semiconductor device to be fabricated, wherein the physical property prediction unit is configured to input, into the physical property prediction model, input data including information associated with design drawings of the semiconductor device to be fabricated, and a layout generator configured generate a design layout optimized to distribute the predicted physical property values for each region of the semiconductor device to be fabricated by modifying the design drawings based on the predicted physical property data.
Inventor(s): Ranjan Kumar SAMAL of Odisha (IN) for samsung electronics co., ltd., Vivek Paul JOSEPH of Kozhikode (IN) for samsung electronics co., ltd., Raghavendra Hanumatasetty RAMASETTY of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06F40/35, G06F40/166
Abstract: a system and a method for determining semantic points in a human-to-human conversation is provided. the method includes identifying the human-to-human conversation including a plurality of dialogue turns and determining natural language (nl) attributes form each dialogue turn. further, the method includes deriving a transient state, based on the one or more nl attributes. further, the method includes deriving one or more conversation nuances associated with the human-to-human conversation based on the one or more nl attributes. moreover, the method includes dynamically storing information associated with the human-to-human conversation based on the one or more nl attributes, the transient state, and the one or more conversation nuances associated with each dialogue turn and determining one or more semantic relations and associated dialogue timelines within the human-to-human conversation based on the dynamically stored information. additionally, the method includes generating semantic points corresponding to the determined one or more semantic relations and the associated dialogue timelines within the human-to-human conversation.
Inventor(s): Jong Hoon SHIN of San Jose CA (US) for samsung electronics co., ltd., Ardavan PEDRAM of Santa Clara CA (US) for samsung electronics co., ltd., Joseph HASSOUN of Los Gatos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/063, G06N3/08
Abstract: a neural processing unit is reconfigurable to process a fine-grain structured sparsity weight arrangement selected from n:m=1:4, 2:4, 2:8 and 4:8 fine-grain structured weight sparsity arrangements. a weight buffer stores weight values and a weight multiplexer array outputs one or more weight values stored in the weight buffer as first operand values based on a selected fine-grain structured sparsity weight arrangement. an activation buffer stores activation values and an activation multiplexer array outputs one or more activation values stored in the activation buffer as second operand values based on the selected fine-grain structured weight sparsity in which each respective second operand value and a corresponding first operand value forms an operand value pair. a multiplier array outputs a product value for each operand value pair.
20240119297.METHOD AND DEVICE WITH CHECKPOINTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jin-soo KIM of Seoul (KR) for samsung electronics co., ltd., Seongyeop JEONG of Seoul (KR) for samsung electronics co., ltd., Uiseok SONG of Suwon-si (KR) for samsung electronics co., ltd., Byungwoo BANG of Suwon-si (KR) for samsung electronics co., ltd., Wooseok CHANG of Suwon-si (KR) for samsung electronics co., ltd., Hun Seong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/091, G06N3/084
Abstract: a processor-implemented method with checkpointing includes: performing an operation for learning of an artificial neural network (ann) model; and performing a checkpointing to store information about a state of the ann model, simultaneously with performing the operation for the learning of the ann model.
Inventor(s): Hunsop Hong of Irvine CA (US) for samsung electronics co., ltd., Seongnam Oh of Irvine CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T3/40
Abstract: one embodiment provides a computer-implemented method that includes receiving content having a first resolution. the processor splits the content into most significant bits and least significant bits. the processor further performs processing of the most significant bits of the content while preserving the least significant bits. the processor additionally performs a linear combination of outputs of the processing of the most significant bits with the preserved least significant bits for improving quality of the content.
Inventor(s): Yibo Xu of Plano TX (US) for samsung electronics co., ltd., Weidi Liu of Houston TX (US) for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX (US) for samsung electronics co., ltd., John Seokjun Lee of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T5/20, G06T5/50
Abstract: a method includes identifying, using at least one processing device of an electronic device, a spatially-variant point spread function associated with an under-display camera. the spatially-variant point spread function is based on an optical transmission model and a layout of a display associated with the under-display camera. the method also includes generating, using the at least one processing device, a ground truth image. the method further includes performing, using the at least one processing device, a convolution of the ground truth image based on the spatially-variant point spread function in order to generate a synthetic sensor image. the synthetic sensor image represents a simulated image captured by the under-display camera. in addition, the method includes providing, using the at least one processing device, the synthetic sensor image and the ground truth image as an image pair to train a machine learning model to perform under-display camera point spread function inversion.
Inventor(s): Seungwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Deoksoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Byoungju SONG of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongkwon CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T5/40
Abstract: an image processing method includes transforming input image data into a histogram, equalizing the histogram using a cumulative distribution function, setting a first weight value based on the equalized histogram and a first reference value, generating a first tone curve based on the equalized histogram and the first weight value, generating a final output tone curve by applying a second weight value to the first tone curve and an output of a second tone curve applied to the input image data, and generating output image data based on the final output tone curve and the input image data.
Inventor(s): Dongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongnam BYUN of Suwon-si (KR) for samsung electronics co., ltd., Jaewook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Sejin KWAK of Suwon-si (KR) for samsung electronics co., ltd., Geunho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/20, B25J9/16, G06T7/70, G06T17/05
Abstract: a method of controlling an electronic device by using spatial information and an electronic device using spatial information are provided. the method includes selecting, based on spatial information about a space including at least one object and a task that the electronic device is set to perform, an object that obstructs the task from among objects located in a space corresponding to the task, providing a user of the electronic device with object movement guide information corresponding to attribute information about the selected object, determining a movement path used to perform the task, based on a user's response corresponding to the object movement guide information, and driving the electronic device according to the determined movement path.
Inventor(s): Jaewook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Dongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongnam BYUN of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G06T7/50, G06T7/70, G06T19/20, G06V10/764
Abstract: a method of generating a three-dimensional (3d) model and a device for generating a 3d model are provided. the method includes generating a base 3d model of an object, determining a first target 3d model similar to the base 3d model from a 3d model database storing a plurality of 3d models, generating a first synthesized 3d model, determining a first similarity between the first synthesized 3d model and the at least one object image, determining a component having a low similarity between the first synthesized 3d model and the at least one object image, determining, as a second target 3d model, a 3d model having a high similarity to the first synthesized 3d model with respect to the component having the low similarity, from the 3d model database, and generating a second synthesized 3d model.
Inventor(s): Kihyuk LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongah KIM of Suwon-si (KR) for samsung electronics co., ltd., Heewoong YOON of Suwon-si (KR) for samsung electronics co., ltd., Donghan LEE of Suwon-si (KR) for samsung electronics co., ltd., Gwangho CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06V40/16
Abstract: an augmented reality (ar) device according to an embodiment may include: a communication module comprising communication circuitry, a camera, a display, a wear detection sensor, a memory, and a processor. the memory according to an embodiment may include instructions which, when executed by the processor cause the ar device to receive, through the communication module, marker configuration information related to a display form and a display method of a watch face ar marker and configured in an electronic device. the memory according to an embodiment may include instructions which, when executed by the processor cause the ar device to detect, through the wear detection sensor, that the ar device is worn on a user's body and activate the camera. the memory according to an embodiment may include instructions which, when executed by the processor cause the ar device to identify a watch face ar marker and a strap pointing marker included in a camera video, based on the marker configuration information configured in the electronic device. the memory according to an embodiment may include instructions which, when executed by the processor cause the ar device to determine at least one of a location, a posture, and a tilt of the electronic device, based on the identified watch face ar marker and the identified strap pointing marker. the memory according to an embodiment may include instructions which, when executed by the processor cause the ar device to output ar information corresponding to the posture or tilt, based on the location of the electronic device.
Inventor(s): Kihoon CHA of Suwon-si (KR) for samsung electronics co., ltd., Sihyun JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/20, G06T7/13, G06T7/73
Abstract: a method of providing information related to placing an object in a space includes obtaining three-dimensional spatial data corresponding to the space and object-related data for first objects in the space, obtaining a spatial graph including positional relations between the first objects in the space, based on the three-dimensional spatial data and the object-related data, receiving a user input for changing an object placement in the space, based on the user input, adding, to the spatial graph, an empty node representing a second object to be placed in an empty region in the space in which the first objects are not placed, updating the spatial graph by applying, to a graph neural network (gnn), the spatial graph to which the empty node has been added, and outputting object placement change-related information for the space, based on the updated spatial graph.
Inventor(s): Kamal Jnawali of Tustin CA (US) for samsung electronics co., ltd., Tien Cheng Bau of Irvine CA (US) for samsung electronics co., ltd., Joonsoo Kim of Irvine CA (US) for samsung electronics co., ltd.
IPC Code(s): G06V10/774, G06T3/40, G06T7/13, G06T7/73, G06V10/26, G06V10/82, G06V20/40, G06V20/62
Abstract: one embodiment provides a method comprising detecting at least one object displayed within at least one input frame of an input video. the method further comprises cropping, from the at least one input frame, at least one cropped image including the at least one object. the method further comprises generating at least one training image by overlaying simulated text on the at least one cropped image. the method further comprises providing the at least one training image to a pruned convolutional neural network (cnn). the pruned cnn learns, from the at least one training image, to reconstruct objects and textual regions during image super-resolution.
Inventor(s): Dongnam BYUN of Suwon-si (KR) for samsung electronics co., ltd., Dongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaewook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung HWANG of Suwon-si (KR) for samsung electronics co., ltd., Sejin KWAK of Suwon-si (KR) for samsung electronics co., ltd., Geunho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V10/774, G06T11/20, G06V10/26, G06V10/60, G06V10/74, G06V10/82, G06V20/50, G06V20/70
Abstract: a method of training an object recognition model by using spatial information is provided. the method includes obtaining spatial information including illumination information corresponding to a plurality of spots in a space, obtaining illumination information corresponding to at least one spot of the plurality of spots from the spatial information, obtaining training data by using the obtained illumination information and an image obtained by capturing the at least one spot, and training a neural network model for object recognition by using the training data.
Inventor(s): Cristina CORNELIO of Milton Keynes (GB) for samsung electronics co., ltd., Timothy Hospedales of London (GB) for samsung electronics co., ltd., Jan Stuehmer of Heidelberg (DE) for samsung electronics co., ltd.
IPC Code(s): G06V10/776, G06V10/77
Abstract: broadly speaking, embodiments of the present techniques provide a method for reducing errors in the outputs of machine learning, ml, models on a potential output of the models to resolve any inconsistencies before outputting a final result from the models. the final result respects a set of rules or constraints, which may include logical constraints. advantageously, this reduces the risk of a model outputting a result which violates some rules associated with the overall task of the model, which could be dangerous or provide a poor user experience.
Inventor(s): Seho SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jahoo KOO of Suwon-si (KR) for samsung electronics co., ltd., Yonggonjong PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/56, G06V20/58
Abstract: a processor-implemented method with lane line determination includes: determining, from an input image, road feature information comprising a surrounding object and a road surface marking comprising a lane line; matching the road feature information to lane lines of a driving road on which a vehicle is driving; detecting whether there is a change in a road structure based on a result of the matching, wherein the change in the road structure comprises any one or any combination of any two or more of a change of the lane line, a loss of the lane line, and a change of a road sign; and based on whether the change in the road structure is detected, determining lane line information of the driving road by using information on the surrounding object.
Inventor(s): Skaut Su of Zhubei City (TW) for samsung electronics co., ltd., Alvin Lee of Zhubei City (TW) for samsung electronics co., ltd., Donken Huang of Zhubei City (TW) for samsung electronics co., ltd., Chris Huang of Zhubei City (TW) for samsung electronics co., ltd., Jason Ding of Zhubei City (TW) for samsung electronics co., ltd., Kyunlyeol Lee of Zhubei City (TW) for samsung electronics co., ltd.
IPC Code(s): G09G3/3275
Abstract: a source driver and a method for color swapping are provided. the source driver includes: a processor configured to: obtain, from an application processor, a plurality of sub-pixel data, add a tag to each of the plurality of sub-pixel data to generate a plurality of new sub-pixel data, the tag indicating color information of the sub-pixel data, and perform color swapping on the plurality of new sub-pixel data; a multiplexer circuit communicatively coupled to the processor and configured to: obtain each of the plurality of color swapped new sub-pixel data in sequence, and select a corresponding gamma voltage according to the tag of the color swapped new sub-pixel data; and an analog amplifier circuit communicatively coupled to the multiplexer circuit and configured to provide a source driving signal to a corresponding sub-pixel in a pixel array according to the color swapped new sub-pixel data and the corresponding gamma voltage.
Inventor(s): Tapas Kanungo of Redmond WA (US) for samsung electronics co., ltd., Preeti Saraswat of Santa Clara CA (US) for samsung electronics co., ltd., Stephen Michael Walsh of Sunnyvale CA (US) for samsung electronics co., ltd.
IPC Code(s): G10L15/08
Abstract: a method includes obtaining a speech signal. the method also includes predicting a first likelihood of a wake word or phrase being spoken in the speech signal using a first machine learning model trained to receive the speech signal as input. the method further includes, responsive to the first likelihood exceeding a first threshold, performing automatic speech recognition on the speech signal to determine a textual representation of the speech signal. the method also includes predicting a second likelihood of the wake word or phrase being spoken in the speech signal using a second machine learning model trained to receive at least one of the textual representation, audio features associated with the speech signal, and context features associated with the electronic device. in addition, the method includes, responsive to the second likelihood exceeding a second threshold, generating instructions to perform an action requested in the speech signal.
Inventor(s): Jeongseop KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongjae LIM of Suwon-si (KR) for samsung electronics co., ltd., Minsung JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/22, G10L15/18
Abstract: an electronic apparatus is provided. the electronic apparatus includes a memory configured to store a plurality of nodes corresponding to a plurality of user interface (ui) types, for each application, a display, and a processor connected with the memory and the display and controls the electronic apparatus, wherein the processor is configured to identify a first ui graph corresponding to the target application, acquire information on a target node that will perform the user command among a plurality of first nodes included in the first ui graph based on the user command and the at least one parameter, identify the current node corresponding to a ui displayed through the display, identify an action sequence from the current node to the target node based on the information on the current node and the target node, and perform an action corresponding to the user voice based on the action sequence.
Inventor(s): Dongyul LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L15/28, G10L15/18, G10L15/22, G10L15/30
Abstract: an electronic device includes: a communication interface; a memory including an utterance cache; and at least one processor operatively connected to the communication interface and the memory, wherein the at least one processor is configured to: identify whether an input utterance corresponds to one or more cached utterances stored in the utterance cache; based on identifying that the input utterance corresponds to the one or more cached utterances, transmit the input utterance to an external electronic device through the communication interface; identify whether an operation corresponding to the input utterance is executable by the electronic device; based on the operation being identified to be executable by the electronic device, execute the operation; and based on the operation being identified not to be executable by the electronic device, transmit the input utterance to the external electronic device through the communication interface and add the input utterance to the utterance cache.
Inventor(s): Wan Ju KANG of Daejeon (KR) for samsung electronics co., ltd., Sungju LEE of Daejeon (KR) for samsung electronics co., ltd., Ryuhaerang CHOI of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): G10L17/10, G10L17/18
Abstract: a speaker diarization model implementing apparatus includes a voice signal analysis module configured to generate mel-spectrogram data from voice signals of a plurality of speakers detected by a voice recognition device, a motion data analysis module configured to generate ultra-wideband (uwb) signal matrix data from motion sensing signals of the plurality of speakers detected by a motion recognition device, a multimodal learning module configured to extract characteristic values based on the mel-spectrogram data and the uwb signal matrix data, and a speaker diarization module configured to separate the plurality of speakers from each other using the characteristic values.
Inventor(s): Hyunwoong LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyungtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Gajin SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G10L25/78
Abstract: provided is an electronic device and a voice recognition method. the electronic device includes: a memory configured to store at least one instruction, and a processor electrically connected to the memory. the processor is and configured to execute the at least one instruction to: obtain a sound signal corresponding to an utterance, and recognize a voice signal included in the sound signal, based on a determination that a portion of the sound signal corresponds to at least one of a plurality of noise categories, the plurality of noise categories corresponding to a plurality of environments in which a plurality of voice models of voice signals are generated.
Inventor(s): Kyeongtae Nam of Suwon-si (KR) for samsung electronics co., ltd., Younghun Seo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/06, G11C5/14, G11C7/22
Abstract: disclosed is a memory device that includes a memory cell array having a plurality of memory blocks, a sense amplifier connected to the plurality of memory blocks and configured to perform an offset compensating operation in response to an offset compensation signal, and an offset time adjustment circuit connected to the sense amplifier and configured to adjust an execution time of the offset compensating operation based on a comparison result of a voltage at an equalization voltage node and a reference offset voltage.
20240119978.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin Woo Han of Suwon-si (KR) for samsung electronics co., ltd., Hyun Geun Choi of Suwon-si (KR) for samsung electronics co., ltd., Ki Seok Lee of Suwon-si (KR) for samsung electronics co., ltd., Seok Han Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C7/18, G11C5/06, G11C7/12
Abstract: provided a semiconductor memory device. the semiconductor memory device includes a substrate, a gate electrode on the substrate, a bit line on the substrate, a cell semiconductor pattern on a side of the gate electrode and electrically connected to the bit line, a capacitor structure including a first electrode electrically connected to the cell semiconductor pattern, a second electrode on the first electrode, and a capacitor dielectric film between the first electrode and the second electrode, a bit line strapping line spaced apart from the bit line in the second direction, and electrically connected to the bit line, a bit line selection line between the bit line and the bit line strapping line, and a selection semiconductor pattern between the bit line and the bit line strapping line and electrically connected to all of the bit line, the bit line strapping line, and the bit line selection line.
Inventor(s): Daeshik KIM of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/16
Abstract: disclosed is a memory device including a magnetic memory element. the memory device includes a memory cell array including a first region and a second region, the second region configured to store a value of a write voltage, the write voltage based on a value of a reference resistor for determining whether a programmed memory cell is in a parallel state or anti-parallel state, a voltage generator configured to generate a code value based on the value of the write voltage, and a write driver configured to drive a write current based on the code value, the write current being a current for storing data in the first region.
20240119984.SEMICONDUCTOR MEMORY DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaeho Hong of Hwaseong-si (KR) for samsung electronics co., ltd., Hyuncheol Kim of Seoul (KR) for samsung electronics co., ltd., Yongseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Ilgweon Kim of Hwaseong-si (KR) for samsung electronics co., ltd., Hyeoungwon Seo of Yongin-si (KR) for samsung electronics co., ltd., Sungwon Yoo of Hwaseong-si (KR) for samsung electronics co., ltd., Kyunghwan Lee of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/402, G11C11/39, H01L27/102, H01L29/66, H01L29/749
Abstract: a semiconductor memory device according to the present inventive concept includes: a semiconductor substrate; a common source semiconductor layer doped with impurities of a first conductivity type on the semiconductor substrate; a plurality of insulating layers and a plurality of word line structures alternately stacked on the common source semiconductor layer; and a memory cell dielectric layer penetrating the plurality of insulating layers and the plurality of word line structures and covering an internal wall of a channel hole extending in a vertical direction, and a memory cell structure filling the channel hole. the memory cell structure includes a channel layer, which has the memory cell dielectric layer thereon and fills at least a portion of the channel hole, and a drain layer covering an upper surface of the channel layer, doped with impurities of a second conductivity type, and filling some of an upper portion of the channel hole.
Inventor(s): GARAM CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yonghun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Kihan Kim of Suwon-si (KR) for samsung electronics co., ltd., Hojun Chang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/4093, G11C11/4074, G11C11/4076
Abstract: a semiconductor chip includes a write clock buffer, a voltage regulator, a process calibration circuit and a temperature calibration circuit. the voltage regulator generates plural regulated voltages. the process calibration circuit output one of the regulated voltages as a bias voltage of the write clock buffer, depending on a process variation of the semiconductor chip. the temperature calibration circuit track a temperature variation of the semiconductor chip in real time, performs analog calibration on the bias voltage from the process calibration circuit in real time depending on a result of the tracking, and outputs the analog-calibrated bias voltage to the write clock buffer.
Inventor(s): Chul Min CHOI of Suwon-si (KR) for samsung electronics co., ltd., Chang Hoon BYEON of Suwon-si (KR) for samsung electronics co., ltd., Sun Il SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/04, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B43/40, H10B80/00
Abstract: a semiconductor memory device may include a cell substrate; a mold structure including a plurality of gate electrodes stacked on the cell substrate; a channel structure penetrating the mold structure; a string select line on the mold structure; a string select channel structure penetrating the string select line and contacting the channel structure; an anti-arcing contact penetrating the mold structure; an insulating pattern between the anti-arcing contact and the plurality of gate electrodes; and an anti-arcing insulating pattern penetrating the string select line to be in contact with the anti-arcing contact.
Inventor(s): Ji Mo LEE of Suwon-si (KR) for samsung electronics co., ltd., Dong Hyeon NA of Suwon-si (KR) for samsung electronics co., ltd., Myeong Soo SHIN of Suwon-si (KR) for samsung electronics co., ltd., Woong Jin CHEON of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Sun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jae Bin KIM of Suwon-si (KR) for samsung electronics co., ltd., Tae-Hwa KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung Bo SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/3065
Abstract: a substrate processing method is provided. the substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first dc pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first dc pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first dc pulse signal has a first level during the first section, and the first dc pulse signal has a second level different from the first level during the second section.
20240120194.WAFER PROCESSING SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sang Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Sang Woo BAE of Suwon-si (KR) for samsung electronics co., ltd., Sung-Wook JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, G02B27/14, G02B27/28, H01L21/687
Abstract: a wafer processing system includes an optical apparatus including a beam splitter configured to receive a laser beam and to split the laser beam into a first beam in a first state of linear polarization and a second beam in a second state of linear polarization; and a beam delayer configured to delay the second beam so that a pulse of the second beam has a delay time with respect to a pulse of the first beam.
Inventor(s): Hyun-Suk Lee of Suwon-si (KR) for samsung electronics co., ltd., Jungoo Kang of Seoul (KR) for samsung electronics co., ltd., Gihee Cho of Yongin-si (KR) for samsung electronics co., ltd., Sanghyuck Ahn of Daegu (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/02, H01L21/12, H01L21/302, H01L21/768
Abstract: a method of manufacturing a semiconductor device includes: forming electrode holes by etching a mold structure including a mold layer and a support layer which are stacked on a substrate; forming lower electrode pillars filling the electrode holes; etching a portion of the support layer between the lower electrode pillars to form a support pattern having a through-hole exposing a portion of a top surface of the mold layer; removing the mold layer through the through-hole to expose sidewalls of the lower electrode pillars; and selectively forming lower electrode patterns on the sidewalls and top surfaces of the lower electrode pillars.
Inventor(s): So Young LEE of Suwon-si (KR) for samsung electronics co., ltd., Yun Hee KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/033, G03F7/00, H01L23/544, H10B12/00, H10B43/27
Abstract: a method for manufacturing a semiconductor device, including forming a step key on a substrate, forming a mold layer on the step key covering the step key, forming a first mask layer on the mold layer, forming a transparent layer in the first mask layer overlapping the step key, forming a second mask layer on the first mask layer and the transparent layer, etching the mold layer using the second mask layer, wherein the first mask layer includes a metal material.
Inventor(s): Woo Rim LEE of Suwon-si (KR) for samsung electronics co., ltd., Myoung Jae SEO of Suwon-si (KR) for samsung electronics co., ltd., Sung Gil KANG of Suwon-si (KR) for samsung electronics co., ltd., Hyun Ho DOH of Suwon-si (KR) for samsung electronics co., ltd., Sung Yong PARK of Suwon-si (KR) for samsung electronics co., ltd., In Hye JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01J37/32, H01L21/285, H01L21/3065
Abstract: a method of fabricating a semiconductor device is provided. the method includes: loading a substrate into a substrate processing apparatus; and processing the substrate, using the substrate processing apparatus. the processing the substrate includes: providing a process gas; generating a process etchant from the process gas, using plasma ignition, the process etchant including a first etchant and a second etchant; processing the substrate, using the process etchant; identifying a composition rate of the process etchant; and controlling the processing of the substrate based on a process result according to the composition rate of the process etchant.
Inventor(s): Jin Hyuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Beom Soo HWANG of Suwon-si (KR) for samsung electronics co., ltd., Kong Woo LEE of Suwon-si (KR) for samsung electronics co., ltd., Myung Ki SONG of Suwon-si (KR) for samsung electronics co., ltd., Ja-Yul KIM of Suwon-si (KR) for samsung electronics co., ltd., Kyu Sang LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyun Joo JEON of Suwon-si (KR) for samsung electronics co., ltd., Nam Young CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/673, H01L21/67, H01L21/677, H01L21/68
Abstract: a semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. the front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. the cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.
Inventor(s): Sangjine PARK of Suwon-si (KR) for samsung electronics co., ltd., Kuntack Lee of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Park of Hwaseong-si (KR) for samsung electronics co., ltd., Seungmin Shin of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/687, G03F7/40
Abstract: a substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.
Inventor(s): Joohoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongseop LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/687, H01L21/673
Abstract: a semiconductor manufacturing apparatus includes a first structure having a first hole, a second structure on the first structure, the second structure including a space for accommodating a substrate and a lower plate with a second hole, a first pin insertable into the first hole, the first pin having a same diameter as the first hole and a length smaller than a length of the first hole in a vertical direction, a second pin insertable into the second hole and on the first pin, the second pin having a same diameter as the second hole, a locking plate between the first pin and the second pin, the locking plate overhanging a side wall of the first pin, and a coupling member configured to couple the first pin to or separate the first pin from the second pin.
Inventor(s): JIN-WOO PARK of Suwon-si (KR) for samsung electronics co., ltd., UN-BYOUNG KANG of Suwon-si (KR) for samsung electronics co., ltd., CHUNGSUN LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L21/56, H01L23/00, H01L25/00, H01L25/065
Abstract: disclosed are semiconductor packages and their fabrication methods. the semiconductor package comprises a base semiconductor chip, a chip structure on the base semiconductor chip, a connection terminal between the base semiconductor chip and the chip structure, and a molding layer surrounding the chip structure and the connection terminal. the chip structure includes a first semiconductor chip including a first frontside pad and a first backside pad, and a second semiconductor including a second frontside pad and a second backside pad. a lateral surface of the first semiconductor chip is aligned with that of the second semiconductor chip. the first backside pad and the second frontside pad partially overlap each other when viewed in plan while being in direct contact with each other. the first backside pad and the second frontside pad include the same metal and are formed into a single unitary piece.
Inventor(s): Taehyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Hoyoung Tang of Suwon-si (KR) for samsung electronics co., ltd., Yunsick Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H10B10/00
Abstract: provided is an integrated circuit including a cell region in which a plurality of cells are arranged, and a peripheral region in which a circuit configured to control the plurality of cells is arranged, wherein the cell region further includes a plurality of first gate lines over a substrate, a plurality of first patterns in a first wiring layer above the plurality of first gate lines, a plurality of second patterns extending in a first horizontal direction in a backside wiring layer under the substrate, and a plurality of first vias, each of the plurality of first vias passing through the substrate in a vertical direction, wherein each of the plurality of first vias includes a top surface connected to a respective one of the plurality of first patterns and a bottom surface connected to a respective one of the plurality of second patterns.
Inventor(s): CHEOL KIM of SUWON-SI (KR) for samsung electronics co., ltd., HWANYOUNG CHOI of SUWON-SI (KR) for samsung electronics co., ltd., SEOKHYUN LEE of SUWON-SI (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/367, H01L23/373, H01L25/065
Abstract: a semiconductor package includes a package substrate, an interposer mounted on the package substrate via first conductive bumps; first and second semiconductor devices on the interposer and spaced apart from each other, mounted on the interposer via second conductive bumps and having concavo-convex patterns respectively formed in upper surfaces thereof; and a sealing member on the interposer covering the first and second semiconductor devices and exposing the concavo-convex patterns. the concavo-convex pattern of the first semiconductor device includes a plurality of first pillar structures provided in the upper surface of a first region of the first semiconductor device and having a first width, and a plurality of second pillar structures provided in the upper surface of a second region of the first semiconductor device and having a second width greater than the first width.
20240120274.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eui Bok LEE of Suwon-si (KR) for samsung electronics co., ltd., Rak Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jong Min BAEK of Suwon-si (KR) for samsung electronics co., ltd., Moon Kyun SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L21/8234, H01L23/528, H01L27/088
Abstract: a semiconductor device a first fin-shaped pattern provided at a first surface of a substrate and extending in a second direction, a first source/drain pattern disposed on the first fin-shaped pattern and connected thereto, a first source/drain contact disposed on the first source/drain pattern and connected thereto, a buried conductive pattern extending through the substrate and connected to the first source/drain contact, a contact connection via disposed between the first source/drain contact and the buried conductive pattern. the contact connection via is directly connected to the first source/drain contact and a back wiring line disposed on a second surface of the substrate and connected to the buried conductive pattern. a width of the contact connection via increases as the contact connection via extends away from the second surface. a width of the first source/drain contact decreases as the first source/drain contact extends away from the second surface of the substrate.
Inventor(s): Jae Seung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Byung-Su KIM of Suwon-si (KR) for samsung electronics co., ltd., Bong Il PARK of Suwon-si (KR) for samsung electronics co., ltd., Chang Seok KWAK of Suwon-si (KR) for samsung electronics co., ltd., Sun Hee PARK of Suwon-si (KR) for samsung electronics co., ltd., Sang Joon CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/498, H01L23/522, H01L27/06
Abstract: a three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. the device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.
20240120278.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bo Ram LEE of Suwon-si (KR) for samsung electronics co., ltd., Ki-II KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L29/06, H01L29/417, H01L29/423, H01L29/775
Abstract: a semiconductor device includes: a substrate including an upper surface and a lower surface opposite to the upper surface; an active pattern disposed on the upper surface of the substrate and extending in a first direction; a field insulating film disposed on the upper surface of the substrate and covering a sidewall of the active pattern; a power rail disposed on the lower surface of the substrate and extending in the first direction; a trench formed in the substrate and exposing a portion of the power rail; and a metal pattern filling at least a portion of the trench and connected to the power rail, wherein a bottom surface of the trench is substantially coplanar with the lower surface of the substrate, wherein a sidewall of the trench has a convex shape, and wherein at least a portion of the field insulating film is disposed in the trench.
20240120279.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeong Hyuk YIM of Suwon-si (KR) for samsung electronics co., ltd., Wan Don KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Bae LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyo Seok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Geun Woo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/535, H01L21/768, H01L23/528, H01L29/06, H01L29/417, H01L29/423, H01L29/775
Abstract: a semiconductor device may include a first film and a second film defining parts of a trench, a plug conductive film, a via, and a wiring in the trench. the trench may include a second sub-trench having a second width below a first sub-trench having a first width. the plug conductive film may extend from a first side of the first film to penetrate a bottom face of the trench. an uppermost face of the plug conducive film may be in the trench. the via may include an insulating liner between the plug conductive film and the first film. the uppermost face of the plug conductive film and at least a part of a side wall of the plug conductive film may be in contact with the wiring. an upper face of the insulating liner may be exposed by a bottom face of the second sub-trench.
20240120280.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungdon Mun of Suwon-si (KR) for samsung electronics co., ltd., Shanghoon Seo of Suwon-si (KR) for samsung electronics co., ltd., Jihwang Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangjin Baek of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong Hwang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/56, H01L23/00, H01L25/00, H01L25/16, H01L25/18, H10B80/00
Abstract: a semiconductor package includes a first redistribution structure, a first semiconductor device mounted on the first redistribution structure, a molding layer surrounding the first semiconductor device, a second redistribution structure disposed on the molding layer and the first semiconductor device, a plurality of vertical connection conductors vertically extending in the molding layer and electrically connecting the first redistribution pattern to the second redistribution pattern, a second semiconductor device mounted on the second redistribution structure, the second semiconductor device and the first semiconductor device vertically and partially overlapping each other, a heat dissipation pad structure contacting an upper surface of the first semiconductor device, and a heat dissipation plate disposed on the heat dissipation pad structure and spaced apart from the second semiconductor device along a first straight line extending in a horizontal direction that is parallel to the upper surface of the first semiconductor device.
20240120286.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeonseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Eungkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongyoun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjeong HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/31, H01L23/498, H01L25/10
Abstract: provided is a semiconductor package including a lower redistribution structure, an internal semiconductor chip on an upper surface of the lower redistribution structure, an upper redistribution structure electrically connected to the lower redistribution structure through a conductive post, and a molding layer between the upper redistribution structure and the lower redistribution structure, the molding layer being adjacent to the internal semiconductor chip, wherein the upper redistribution structure includes an insulating layer including a redistribution pattern and a first material configured to transmit light, and a fiducial mark formed of the first material, and a lower surface of the fiducial mark is in contact with an upper surface of the molding layer.
Inventor(s): Sang Won PARK of Suwon-si (KR) for samsung electronics co., ltd., A Yeong CHA of Suwon-si (KR) for samsung electronics co., ltd., Byeong-Hwan SON of Suwon-si (KR) for samsung electronics co., ltd., Hye Jin LEE of Suwon-si (KR) for samsung electronics co., ltd., Jung Hyun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jong Hee HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, G03F7/00
Abstract: provided is an overlay mark. the overlay mark comprises a substrate, a lower overlay in the substrate, a pattern layer on the substrate, and an upper overlay defining an opening on the pattern layer. the lower overlay does not overlap the upper overlay in a thickness direction of the substrate.
20240120299.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JIHOON KIM of () for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
Abstract: a semiconductor package includes a first semiconductor structure including a first semiconductor substrate and a lower through structure that penetrates the first semiconductor substrate, a connection structure on the first semiconductor structure and a second semiconductor structure on the connection structure, the second semiconductor structure including a second semiconductor substrate and an upper through structure that penetrates the second semiconductor substrate, where the connection structure includes a lower curved pad on the lower through structure, and an upper curved pad on the lower curved pad, where a top surface of the lower curved pad includes a curved surface, where a bottom surface of the upper curved pad includes a curved surface, and where the upper curved pad is connected to the upper through structure.
Inventor(s): Youngja Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, B08B3/12
Abstract: a solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. the solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. the condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. the condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. the cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. as a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.
20240120318.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyung Don Mun of Suwon-si (KR) for samsung electronics co., ltd., Sang Cheon Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/522, H10B80/00
Abstract: a semiconductor package includes a buffer die, semiconductor chip stacks stacked on the buffer die, each of the semiconductor chip stacks including a plurality of first semiconductor chips and a second semiconductor chip on the plurality of first semiconductor chips, and a mold layer covering an upper surface of the buffer die and side surfaces of the semiconductor chip stacks. each of the first semiconductor chips and the second semiconductor chip includes a wiring part including multilayer wirings, an upper connection structure on the wiring part and having a plurality of upper conductive pads and a lower connection structure under the wiring part and having a plurality of lower conductive pads, and the second semiconductor chip further includes a redistribution layer on the upper connection structure and having an insulating layer and a plurality of redistribution pads in the insulating layer.
20240120319.SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunsoo CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Younglyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/48, H01L23/522
Abstract: a semiconductor package includes a first semiconductor structure including a first semiconductor layer having a first active surface and a first circuit device thereon and a first inactive surface and first bonding layer; a second semiconductor structure on the first semiconductor structure and including a second semiconductor layer having a second active surface and second circuit device thereon and a second inactive surface, a second frontside bonding layer, and a second backside bonding layer on the second inactive surface; and a third semiconductor structure on the second semiconductor structure and including a third semiconductor layer having a third active surface including a third circuit device thereon and a third inactive surface, and a third bonding layer, wherein the first bonding layer is bonded to the second frontside bonding layer, and the third bonding layer is bonded to the second backside bonding layer.
20240120351.IMAGE SENSORS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngrae Kim of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuck Moon of Suwon-si (KR) for samsung electronics co., ltd., Jueun Park of Suwon-si (KR) for samsung electronics co., ltd., Jaeho Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeongjin Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor includes a substrate and a pixel separation portion disposed in the substrate and separating first pixels and second pixels from each other. the first pixels and the second pixels are alternately arranged in a first direction and a second direction which intersect each other. each of the first pixels has a first width in the first direction. each of the second pixels has a second width in the first direction, which is narrower than the first width. the pixel separation portion includes a main separation portion between the first and second pixels, and protrusions, each of which protrudes from a side surface of the main separation portion in at least one of the first and second directions. ones of the protrusions protrude into a respective one of the first pixels to divide the respective one of the first pixels into a plurality of sub-pixels.
20240120357.IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jonguk KIM of Suwon-si (KR) for samsung electronics co., ltd., Heegeun JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: an image sensor includes a substrate having a plurality of first pixel regions configured to generate image information and a plurality of second pixel regions configured to detect phase information, a grid pattern on the substrate and dividing a plurality of spaces corresponding to each of the plurality of first pixel regions and the plurality of second pixel regions. the image sensor also includes a plurality of color filters respectively in first spaces of the plurality of spaces, excluding second spaces corresponding to the plurality of second pixel regions, a plurality of polarization patterns respectively in the second spaces and partitioning the second spaces, and a microlens layer including a plurality of first microlenses respectively on the plurality of color filters.
Inventor(s): Radwanul Hasan SIDDIQUE of Monrovia CA (US) for samsung electronics co., ltd., Yibing Michelle WANG of Temple City CA (US) for samsung electronics co., ltd., Mahsa TORFEH of Los Angeles CA (US) for samsung electronics co., ltd., Tze-Ching FUNG of Diamond Bar CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
Abstract: a pixel for an image sensor is disclosed that includes a photodiode, a thin-film layer and a reflective layer. the photodiode includes a first side and a second side that is opposite the first side, and receives incident light on the first side. the thin-film layer is formed on the first side of the photodiode and provides a unidirectional phase-shift to light passing from the photodiode to the thin-film layer. the thin-film layer has a refractive index that less than a refractive index of material forming the photodiode. the unidirectional phase-shift may be a unidirectional it phase shift at a target near-infrared light wavelength. the reflective layer is formed on the second side of the photodiode and reflects light passing from the photodiode to the reflective layer toward the first side of the photodiode. the reflective layer may be a thin-film layer, a distributed bragg reflector layer, or a metal.
Inventor(s): Sunme Lim of Suwon-si (KR) for samsung electronics co., ltd., Joongwon Jeon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/423, H01L29/66, H01L29/775
Abstract: a semiconductor device may include a substrate including a first and a second row region, wherein a surface of the substrate is disposed in a first direction and a second direction perpendicular to the first direction, a first nanosheet structure on the first row region and including active segments disposed in the first direction, and the active segments having different widths in the second direction; and a second nanosheet structure on the second row region, the second nanosheet structure spaced apart from the first nanosheet structure in the second direction, and wherein the second nanosheet structure is symmetrical to the first nanosheet structure in the first direction. in a plan view, in each of the first and second nanosheet structures, transition regions between adjacent ones of the active segments have one of a same first angle and a second angle with respect to the first direction.
20240120392.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunjung Lee of Suwon-si (KR) for samsung electronics co., ltd., Donggon Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jeongwon Hwang of Suwon-si (KR) for samsung electronics co., ltd., Sukhoon Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/423, H01L29/775, H01L29/786
Abstract: a semiconductor device includes a substrate including active regions extending in a first direction; a device isolation layer surrounding the active regions on the substrate; gate structures intersecting the active regions and extending on the substrate in a second direction; source/drain regions on the active regions; contact plugs connected to the source/drain regions, respectively; a vertical buried structure penetrating through at least a portion of the device isolation layer, and in contact with the contact plugs; a vertical insulating layer covering at least a portion of side surfaces of the vertical buried structure; a horizontal buried structure below the vertical buried structure; a first conductive barrier covering at least a portion of an upper surface and side surfaces of the horizontal buried structure; and a metal-semiconductor compound pattern between the vertical buried structure and the first conductive barrier, wherein the vertical buried structure is between source/drain regions.
20240120393.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jisoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Myung Il KANG of Suwon-si (KR) for samsung electronics co., ltd., Ji Wook KWON of Suwon-si (KR) for samsung electronics co., ltd., Jung Han LEE of Suwon-si (KR) for samsung electronics co., ltd., Subin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/48, H01L29/06, H01L29/423, H01L29/775, H01L29/786
Abstract: a semiconductor device includes a substrate, a first sheet pattern on the substrate, a gate electrode on the substrate and surrounding the first sheet pattern, a first source/drain pattern and a second source/drain pattern respectively connected to a first end and a second end of the first sheet pattern, a contact blocking pattern on a lower side of the second source/drain pattern, a first source/drain contact extending in a first direction and connected to the first source/drain pattern, and a second source/drain contact connected to the second source/drain pattern and extending in the first direction to contact an upper surface of the contact blocking pattern. a depth from an upper surface of the gate electrode to a lowermost portion of the first source/drain contact may be greater than a depth from the upper surface of the gate electrode to the upper surface of the contact blocking pattern.
20240120400.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dong Hoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., In Chan HWANG of Suwon-si (KR) for samsung electronics co., ltd., Hyo Jin KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L27/088, H01L29/06, H01L29/08, H01L29/417, H01L29/66, H01L29/775, H01L29/786
Abstract: a semiconductor device includes first lower nanosheets; an upper isolation layer on the first lower nanosheets; first upper nanosheets on the upper isolation layer; a first upper source/drain region on the first upper nanosheets; a second upper source/drain region on the first upper nanosheets; a first gate electrode surrounding the first lower nanosheets, the upper isolation layer, and the first upper nanosheets; a first gate cut on a side of the first gate electrode and extending from a lower surface of the first gate electrode to an upper surface of the first gate electrode; a first through via inside the first gate cut and insulated from the first gate electrode; a first upper source/drain contact on and electrically connected to the first upper source/drain region; and a second upper source/drain contact on the first upper source/drain region and electrically connecting the second upper source/drain region with the first through via.
Inventor(s): Sungil PARK of Suwon-si (KR) for samsung electronics co., ltd., Jae Hyun PARK of Hwaseong-si (KR) for samsung electronics co., ltd., Kyungho KIM of Suwon-si (KR) for samsung electronics co., ltd., Cheoljin YUN of Yongin-si (KR) for samsung electronics co., ltd., Daewon HA of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L29/786
Abstract: a semiconductor device includes a lower channel pattern and an upper channel pattern stacked on a substrate in a first direction perpendicular to a top surface of the substrate, lower source/drain patterns on the substrate and at a first side and a second side of the lower channel pattern, upper source/drain patterns stacked on the lower source/drain patterns and at a third side and a fourth side of the upper channel pattern, a first barrier pattern between the lower source/drain patterns and the upper source/drain patterns, and a second barrier pattern between the first barrier pattern and the upper source/drain patterns. the first barrier pattern includes a first material and the second barrier pattern includes a second material, wherein the first material and the second material are different.
Inventor(s): Jeeeun YANG of Suwon-si (KR) for samsung electronics co., ltd., Sangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Euntae KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwanghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonil JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/45, H01L21/02, H01L21/443, H01L29/66, H01L29/786
Abstract: provided are a semiconductor device and a method of manufacturing the same. the semiconductor device includes a lower electrode on a substrate, a metal oxide on the lower electrode, a buffer on the metal oxide, an oxide channel in the buffer, a gate insulating layer in the oxide channel, a gate electrode in the gate insulating layer, and an upper electrode on the gate electrode, and the buffer may include a silicide material.
Inventor(s): Jeeeun YANG of Suwon-si (KR) for samsung electronics co., ltd., Sangwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Euntae KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwanghee LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonil JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L29/423, H01L29/66
Abstract: a semiconductor device and a method of manufacturing the same are provided. the semiconductor device includes a lower electrode provided on a substrate, a buffer layer provided on the lower electrode and including first indium, an oxide semiconductor layer provided on the buffer layer and including second indium, a gate electrode provided apart from the oxide semiconductor layer, and an upper electrode provided on the oxide semiconductor layer, wherein a content of the first indium is greater than a content of the second indium.
Inventor(s): Sangyoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Junsig KUM of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Seungtae KO of Suwon-si (KR) for samsung electronics co., ltd., Jungyub LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/08, H01Q1/24, H01Q3/02
Abstract: an electronic device includes an antenna board configured for massive mimo. the antenna board is coupled to a filter board using signal contacts with elasticity and ground contacts with elasticity. the configuration of the signal contacts and the ground contacts permits a satisfactory accumulated tolerance in terms of component precision.
Inventor(s): Chanju PARK of Suwon-si (KR) for samsung electronics co., ltd., Junhwa OH of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk WI of Suwon-si (KR) for samsung electronics co., ltd., Jungi JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q21/24
Abstract: according to various embodiments disclosed in the present document, an antenna module and/or an electronic device including same may comprise: a communication circuit part; an antenna part stacked-up on or above the communication circuit part and comprising multiple antenna elements; and a network part disposed between the communication circuit part and the antenna part. the antenna part may comprise: at least one first subarray formed of a combination of some of the antenna elements; and at least one second subarray formed of a combination another of the antenna elements, and disposed to be point symmetric to the first subarray. the network part may comprise: a first transmission port corresponding to a transmission input terminal of the first subarray; a first reception port corresponding to a reception input terminal of the first subarray; a second transmission port corresponding to a transmission input terminal of the second subarray; and a second reception port corresponding to a reception input terminal of the second subarray. with respect to symmetric points of the first subarray and the second subarray, the first transmission port may be disposed to be point symmetric to the second reception port, and the first reception port may be disposed to be point symmetric to the second transmission port. various other embodiments are possible.
20240120643.ELECTRONIC DEVICE COMPRISING ANTENNA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunghyup Lee of Suwon-si (KR) for samsung electronics co., ltd., Hoonsang Yoo of Suwon-si (KR) for samsung electronics co., ltd., Jungsik Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q21/30
Abstract: an electronic device includes: a plate; a side frame provided at an edge of the plate, the side frame including a first sidewall extending in at least one axial direction and including at least one conductive portion; a printed circuit board provided on a surface of the plate and including at least one ground area; a key assembly provided on the side frame and including a first flexible circuit board connected to the printed circuit board; and at least one antenna module including: the at least one conductive portion; a first connection member provided inside the first sidewall, the first connection member being electrically connected to the at least one conductive portion and the first flexible circuit board; a second connection member provided inside the first sidewall and spaced apart from the first connection member, the second connection member being electrically connected to the at least one conductive portion and the first flexible circuit board; and a third connection member between the first connection member and the second connection member, the third connection member being electrically connected to the at least one conductive portion and the at least one ground area.
Inventor(s): Junhwa OH of Suwon-si (KR) for samsung electronics co., ltd., Chanju PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungi JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sanghyuk WI of Suwon-si (KR) for samsung electronics co., ltd., Sungtae CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q21/28, H01Q1/24, H01Q1/38, H01Q21/06
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate beyond a 4g communication system such as lte. the antenna module may comprise: a communication circuit; an antenna unit comprising a plurality of first antenna elements forming a sub-array; a feeding network unit that is disposed below the antenna unit, and is configured to provide at least one first transmission line that is branched to the positions of the plurality of first antenna elements so that the plurality of first antenna elements form the same phase; a mounting unit that is disposed below the feeding network unit, and comprises a plurality of vias such that transmit and/or receive power of the communication circuit is provided to the antenna unit; and a routing unit that is disposed between the feeding network unit and the communication circuit, and is configured to provide at least one second transmission line that extends from a position corresponding to an output end of the communication circuit to a position corresponding to an input end of the feeding network unit in at least one layer.
Inventor(s): Jeonggyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Jongyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Seungwoo JWA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02M3/158, H02M1/08, H02M1/14
Abstract: a converter of a wireless communication system includes a first circuit configured to perform a buck operation, a second circuit configured to perform a boost operation, an inductor coupling the first circuit and the second circuit, and a third circuit including a first resistor and a first diode. the first circuit includes a first field effect transistor (fet), a second fet, a first capacitor, and a first drive circuit. the second circuit includes a third fet, a fourth fet, a second capacitor, a first zener diode, and a second drive circuit, and the first zener diode. the third circuit is coupled to a first node to which the first drive circuit and the first capacitor are coupled and is coupled to a second node to which the second drive circuit, the second capacitor, and the first zener diode are coupled.
Inventor(s): Kyunghyun Yoon of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeol Bae of Suwon-si (KR) for samsung electronics co., ltd., Jongsoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangmin Yoo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F3/45
Abstract: disclosed is an amplifier that includes a first-first (1-1) transistor and a first-second (1-2) transistor to which differential input signals are applied to gate terminals, respectively; a second-first (2-1) transistor including: one end connected to the 1-1 transistor, a gate terminal configured to receive an operating signal, and the other end configured to output one of differential output signals; a second-second (2-2) transistor including: one end connected to the 1-2 transistor, a gate terminal configured to receive the operating signal, and the other end configured to output the other one of the differential output signals; and a switch connected to one end of the 1-1 transistor and one end of the 1-2 transistor. the switch is configured to turn on based on the 1-1 transistor, the 1-2 transistor, the 2-1 transistor, and the 2-2 transistor being turned off.
Inventor(s): Seunghoon JEE of Suwon-si (KR) for samsung electronics co., ltd., Youngoo YANG of Suwon-si (KR) for samsung electronics co., ltd., Hyunuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Kyoungtae KIM of Suwon-si (KR) for samsung electronics co., ltd., Changwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngyoon WOO of Suwon-si (KR) for samsung electronics co., ltd., Yi Fei CHEN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F1/56, H03F3/24
Abstract: a doherty power amplifier of a wireless communication system is provided. the doherty power amplifier includes a first stage including a first power amplifier and a second power amplifier. the doherty power amplifier includes a second stage including a third power amplifier and a fourth power amplifier. the doherty power amplifier includes a coupler between the first stage and the second stage. the doherty power amplifier includes a load impedance connected to the second stage. a bias of the first power amplifier is applied differently from a bias of the second power amplifier. a bias of the third power amplifier is applied in the same manner as a bias of the fourth power amplifier.
Inventor(s): Seong Joong KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung Tak RYU of Daejeon (KR) for samsung electronics co., ltd., Kent Edrian LOZADA of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): H03F3/45
Abstract: a continuous time op-amp includes a differential op-amp configured to produce, and output through output lines, output signals amplified based on a difference between input signals inputted to the differential op-amp, and a common mode feedback (cmfb) circuit configured to feed a common mode voltage back to the op-amp through a feedback line in continuous time through a capacitive coupled path, wherein the cmfb circuit includes: feedback capacitors connected between the output lines and the feedback line; switched capacitors charged based on a common mode reference voltage; and switching elements configured to control a connection between the feedback capacitors and the switched capacitors.
Inventor(s): Jusung LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonsik YU of Suwon-si (KR) for samsung electronics co., ltd., Youngwoo JO of Suwon-si (KR) for samsung electronics co., ltd., Wooseok KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03L7/091, H03L7/089
Abstract: a phase-locked loop device and its operating method are provided. the phase-locked loop device includes a voltage controlled oscillator configured to generate an output clock signal, a divider configured to divide the output clock signal into first and second phase division signals having a constant phase difference, a sampling phase frequency detector configured to sample a sampling voltage based on the first phase division signal and output any one of the sampling voltage, a first supply voltage, and a second supply voltage based on the second phase division signal, a transconductance circuit configured to output a conversion current based on a hold voltage, and a loop filter configured to generate a voltage control signal based on the conversion current and output the voltage control signal to the voltage controlled oscillator.
Inventor(s): Joonggeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Daechul JEONG of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeol BAE of Suwon-si (KR) for samsung electronics co., ltd., Jongsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangmin YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H03F3/195, H03F3/24
Abstract: a radio-frequency (rf) chip includes a mixer configured to mix a local oscillation signal with a baseband signal to output an rf signal, an amplification stage configured to amplify the rf signal through a plurality of unit amplifiers operating in response to a first control signal, and a compensation capacitor bank provided between the mixer and the amplification stage. the compensation capacitor bank is configured to adjust a capacitance of the compensation capacitor bank based on a second control signal, the second control signal being complementary to the first control signal.
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
Abstract: apparatuses and methods for codebook subset restriction for coherent joint transmission in wireless networks. a method includes receiving information about a channel state information (csi) report associated with n>1 groups of antenna ports. the information indicates (i) a coherent joint transmission (cjt) codebook, (ii) a rank restriction, and (iii) ncodebook subset restrictions (cbsrs). the method further includes identifying, based on the rank restriction, a set sof one or more rank values allowed for the csi report; identifying, based on the ncbsrs, sets s, . . . , s; determining the csi report associated with the ngroups of antenna ports based on the cjt codebook, the set s, and the sets s, . . . , s; and transmitting the csi report. for n=1, . . . , n, the set sis associated with n-th groups of antenna ports of the ngroups of antenna ports. the set sincludes spatial-domain (sd) basis vectors that are allowed for the csi report.
Inventor(s): Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Subbarayudu Mutya of Bangalore (IN) for samsung electronics co., ltd., Anoop Perumudi Veedu of Bangalore (IN) for samsung electronics co., ltd., Nishant of Bangalore (IN) for samsung electronics co., ltd., Ashok Kumar Reddy Chavva of Bangalore (IN) for samsung electronics co., ltd., Jagadeesh Gurugubelli of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, G01S5/02, H04B7/0404, H04W24/08, H04W52/02, H04W68/00
Abstract: the disclosure relates to a method and system for adaptive antenna configuration in a user equipment comprising one or more antenna modules, each of the one or more antenna modules comprising a plurality of patch elements. the method comprises: determining whether a signal strength of the ue is above a signal threshold, determining whether a mobility of the ue is below a mobility threshold based on determining that the signal strength is above the signal threshold, determining at least one active antenna module based on determining that the mobility of the ue is below the mobility threshold, and deactivating at least one patch element in the at least one antenna module.
Inventor(s): Sandy Saab of Plano TX (US) for samsung electronics co., ltd., Shadi Abu-Surra of Plano TX (US) for samsung electronics co., ltd., Gang Xu of Allen TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/155, H04W64/00
Abstract: a method for positioning based system design for smart repeaters with adaptive beamforming capabilities is implemented by an electronic device. in certain embodiments, the electronic device is a smart repeater. the method includes obtaining user equipment (ue) location information indicating a location of a ue. the method includes translating, based on a prediction engine, the ue location information to a beam index associated with a beam to serve the ue at the location of the ue. the method includes receiving, from an external communication device via a first wireless communication channel, traffic intended for the ue. the method includes forward-transmitting, via a second wireless communication channel, the traffic via the beam formed at a transmit (tx) antenna of the electronic device.
Inventor(s): Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunseok RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jonghyun BANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/1829, H04L1/1812, H04W28/04
Abstract: the disclosure relates to a communication method for converging an iot technology with a 5g communication system for supporting a higher data transfer rate beyond the 4g system; and a system therefor. the disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail business, security and safety services, etc.), based on 5g communication technologies and iot-related technologies. a method and terminal are provided. the method includes receiving first sidelink control information (sci) and first data corresponding to the first sci, the first sci including first priority information, receiving second sci and second data corresponding to the second sci, the second sci including second priority information, identifying whether first feedback information associated with the first data or second feedback information associated with the second data is transmitted based on the first priority information or the second priority information when a resource for the first feedback information and a resource for the second feedback information are overlapped, and transmitting one of the first feedback information or the second feedback information which is associated with higher priority.
Inventor(s): Jiwoong JEONG of Suwon-si (KR) for samsung electronics co., ltd., Youngsung KHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W76/10, H04W76/30
Abstract: a method performed by a near-real time (rt) radio access network (ran) intelligent controller (ric) is provided. the method includes receiving, from an e2 node, an e2 removal request message for removing a connection between the near-rt ric and the e2 node through an e2 interface, and transmitting, to the e2 node, an e2 removal response message through the e2 interface, in which the e2 node comprises an o-ran distributed unit (o-du), an o-ran central unit-control plane (o-cu-cp), an o-ran central unit-user plane (o-cu-up), or a base station that communicates with the near-rt ric via the e2 interface, and the e2 interface provided for communication between the near-rt ric and the e2 node supports an e2 application protocol (e2ap) for communication over the e2 interface.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00
Abstract: a method performed by a terminal in a wireless communication system is provided. the method includes receiving, from a base station, first information indicating at least one dmrs type, via an rrc signaling, receiving, from the base station, second information indicating whether to activate an enhanced dmrs type corresponding to the at least one dmrs type, via a mac-ce signaling, and in case that the second information indicates activation of the enhanced dmrs type, receiving, from the base station, a pdsch or transmitting, to the base station, a pusch based on the enhanced dmrs type.
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B7/06
Abstract: method and apparatuses for channel state information (csi) reporting based on a window of basis vectors are provided. a method includes receiving a configuration about a csi report including information about nnon-zero power (nzp) csi-reference signal (rs) resources, where n≥1, and a parameter codebooktype set to type-ii-cjt-r18 or type-ii-portselection-cjt-r18. the method further includes determining, for each layer l=1, . . . , v, an indicator for indicating an index of a strongest coefficient among kcoefficients, where kis a total number of non-zero coefficients that are associated with z nzp csi-rs resources and z≤n, and a number of bits pfor the indicator. the method further includes transmitting the csi report including, for each layer, pbits for the indicator. when codebooktype=type-ii-cjt-r18, a value of pdepends on a value of kor a value of �l. when codebooktype=type-ii-portselection-cjt-r18, the value of pdepends on a value of 2m�l.
Inventor(s): Yongwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Andrey KIM of Suwon-si (KR) for samsung electronics co., ltd., Maksim DERIABIN of Suwon-si (KR) for samsung electronics co., ltd., Jieun EOM of Suwon-si (KR) for samsung electronics co., ltd., Rakyong CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L9/00, H04L9/06
Abstract: an apparatus including a receiver and a processor configured to generate a modulus switch ciphertext by performing modulus switching with respect to data received by the receiver, the modulus switching including mapping a component of an input ciphertext generated from the received data to an odd number, generate a blind rotated ciphertext by performing a blind rotation operation based on the modulus switched ciphertext, and generate encrypted data, as a homomorphic encryption operation result, by performing key switching based on the blind rotated ciphertext.
Inventor(s): Sangmin Park of Suwon-si (KR) for samsung electronics co., ltd., Gajin Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L51/10, G06F40/30, H04L51/04
Abstract: an electronic device includes a speaker; a display; a memory; and a processor operatively connected to the speaker, the display, and the memory. the processor is configured to: identify an input indicating to search a multimedia content stored in the memory, the multimedia content comprising a first text and a plurality of images, the input comprising a third text, generate a second text representing the plurality of images, identify, based on the first text and the second text, a portion of the multimedia content, which is matched to the third text, and output, via at least one of the speaker or the display, the portion of the multimedia content.
Inventor(s): Dohyoung KIM of Seoul (KR) for samsung electronics co., ltd., Minkyung KIM of Seoul (KR) for samsung electronics co., ltd., Wansoo LIM of Seongnam-si (KR) for samsung electronics co., ltd., Youngmi KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04L67/06, G06F3/0482, G06F3/04845, G06F16/182, H04L67/10, H04L67/1095, H04L67/561, H04L67/5682, H04L67/5683, H04L67/60
Abstract: an apparatus and method for sharing data between a cloud server and at last one terminal are provided. the method includes displaying, when a data type is selected on a setting menu screen of a cloud service, meta information of real data corresponding to the selected data type, the meta information being downloaded from a server, downloading, when a piece of meta information is selected, the real data corresponding to the selected piece of meta information from the server, and deleting, when the downloaded real data is consumed completely, the consumed real data.
Inventor(s): Byunggun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Younseob SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/60, G10L15/02, G10L19/005, G10L19/012, G10L25/78, H04R25/00
Abstract: an electronic device according to an embodiment of the disclosure includes: a microphone, a communication module including a first communication circuit configured to provide a call channel with a first external electronic device and a second communication circuit configured to provide a communication channel with a second external electronic device, a processor electrically connected with the communication module. the processor is configured to: allow the electronic device operating in a first transmission mode and the first external electronic device to establish a call connection with each other through the first communication circuit, identify whether there is an utterance of a user wearing the second external electronic device, while the call connection is maintained, and operate in a second transmission mode different from the first transmission mode, based on a voice signal of the user to be transmitted to the first external electronic device not being recognized, while the call connection is maintained, and operate in the first transmission mode, based on the voice signal of the user to be transmitted to the first external electronic device being recognized, while the call connection is maintained.
Inventor(s): Sunghyun KYUNG of Suwon-si (KR) for samsung electronics co., ltd., Sangheon KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangtak LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeunwook LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72403, G06F3/041, H04M1/02
Abstract: an electronic device is provided, which includes a first housing having a first surface, a second surface facing an opposite direction to the first surface, and a first lateral member surrounding a first space between the first surface and the second surface and a second housing, which is connected to the first housing to be foldable about a folding axis by using a hinge structure, and having, in an unfolded state, a third surface facing same direction as the first surface, a fourth surface facing an opposite direction to the third surface, and a second lateral member surrounding a second space between the third surface and the fourth surface. the electronic device includes a first display provided on at least a portion of the first surface and at least a portion of the third surface.
Inventor(s): Yingen Xiong of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): H04N13/128, G06T3/00, G06T7/593, G06T19/00, H04N13/111, H04N13/239, H04N13/271
Abstract: a method includes obtaining a stereo image pair including a first image and a second image. the method also includes generating a first feature map of the first image and a second feature map of the second image, the first and second feature maps including extracted positions associated with pixels in the images. the method further includes generating a disparity map between the first and second images based on a dense depth map. the method also includes generating a verified depth map based on a pixelwise comparison of predicted positions and the extracted positions associated with at least some of the pixels in at least one of the images, the predicted positions determined based on the disparity map. in addition, the method includes generating a first virtual view and a second virtual view to present on a display panel of an vst ar device based on the verified depth map.
Inventor(s): Sunwoong JOO of Suwon-si (KR) for samsung electronics co., ltd., Jongin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/611, G06F3/16, H04N7/14, H04N23/63, H04N23/695
Abstract: an electronic apparatus including: an interface; a display; and a processor configured to: acquire an image captured by a camera while the camera is connected through the interface, obtain information about a position where the camera is placed with respect to the display among a plurality of positions where the camera is placeable with respect to the display, select a motion identification model corresponding to the position where the camera is placed with respect to the display among a plurality of motion identification models prepared based on data corresponding to the plurality of positions, identify a motion of a user from the image captured by the camera based on the selected motion identification model, and perform a function based on the identified motion of the user.
Inventor(s): Hyoungjin YOO of Suwon-si (KR) for samsung electronics co., ltd., Daejong NOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/69, H04N23/63
Abstract: an electronic device is provided. the electronic device includes a first camera, a second camera including a lens moving within a movable range, a display, a processor, and a memory operatively connected to the processor. in response to the execution of a function related to the first camera, the electronic device may display a first preview image of a first magnification acquired through the first camera through the display. the processor may move the lens included in the second camera from a starting position to a preset first position configured based on the movable range of the lens while the first preview image of the first magnification is displayed. in response to an input requesting a zoom function to a second magnification, the processor may move the lens of the preset first position to a second position corresponding to the second magnification. the processor may acquire a second preview image corresponding to the second magnification through the second camera based on the lens moved to the second position.
Inventor(s): Choongho RHEE of Suwon-si (KR) for samsung electronics co., ltd., Byonggwon SONG of Suwon-si (KR) for samsung electronics co., ltd., Jangwoo YOU of Suwon-si (KR) for samsung electronics co., ltd., Jaekwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinmyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Wontaek SEO of Suwon-si (KR) for samsung electronics co., ltd., Yongseop YOON of Suwon-si (KR) for samsung electronics co., ltd., Byungkyu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/21, G01K7/36
Abstract: a thermal image sensor includes a substrate; a composite layer including an absorption layer and a sensor array layer provided below the absorption layer, the sensor array layer including a plurality of temperature sensing cells, the composite layer having a pattern formed therein, and the pattern including at least one hole penetrating through the absorption layer; and a support separating the substrate from the composite layer.
20240121525.ELECTRONIC DEVICE INCLUDING A CAMERA_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeoncheol JO of Suwon-si (KR) for samsung electronics co., ltd., Inah MOON of Suwon-si (KR) for samsung electronics co., ltd., Dongsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyoung PARK of Suwon-si (KR) for samsung electronics co., ltd., Shuichi SHIMOKAWA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/57, H04N23/51, H04N23/60, H04N25/40, H04N25/615, H04N25/706, H04N25/772
Abstract: an electronic device may include an image sensor, a processor, and a memory. the image sensor may include at least one photo diode, a transfer gate connecting the at least one photo diode to a first node (fd1 node), a first capacitor connected to the first node and having first capacitance, a dynamic range gate (drg) connected between the first node and a second node (fd2 node), a second capacitor connected to the second node and having second capacitance, and a micro controller unit. other various embodiments identified through the specification are possible.
Inventor(s): Eunsub SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/67, H03M1/56, H04N25/571, H04N25/709, H04N25/771, H04N25/78
Abstract: an image sensor includes a pixel array, an analog-to-digital conversion circuit, and an image signal processor. a pixel of the pixel array generates a first analog signal based on a quantity of charge accumulated during a first exposure time and generate a second analog signal based on a quantity of charge accumulated during a shorter second exposure time. the analog-to-digital conversion circuit may generate a first digital signal based on the first analog signal and a first ramp signal and may generate a second digital signal based on the second analog signal and a second ramp signal. the image signal processor may generate image data based on the first and second digital signals. the first ramp signal may be different from the second ramp signal in terms of at least one of a ramping time or a ramping start voltage level.
20240121539.ELECTRONIC DEVICE INCLUDING SPEAKER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonrae CHO of Suwon-si (KR) for samsung electronics co., ltd., Kiwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Taeeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Myungcheol LEE of Suwon-si (KR) for samsung electronics co., ltd., Woojin CHO of Suwon-si (KR) for samsung electronics co., ltd., Byounghee LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/02
Abstract: an electronic device includes a housing including a speaker hole, and a speaker module in the housing. the speaker module includes a speaker including a first surface outputting an audio signal, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface. the speaker module includes a first housing including a first portion including a first opening overlapping the first surface when viewed from above and a second portion disposed on the first portion, a second housing attached to the first housing and including a duct extending from the first opening to the speaker hole, a first space extending from the first opening through the duct to the speaker hole, and a second space in the first housing, being disconnected from the first space by the speaker. the second portion is configured to seal the second space.
20240121543.ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Young-Bae PARK of Seoul (KR) for samsung electronics co., ltd., Byoung-Hee LEE of Seoul (KR) for samsung electronics co., ltd., Jae-Hee YOU of Gyeonggi-do (KR) for samsung electronics co., ltd., Tae-Eon KIM of Seoul (KR) for samsung electronics co., ltd., Han-Bom PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Sun-Young LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Byoung-Uk YOON of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyung-Hee LEE of Seoul (KR) for samsung electronics co., ltd., Ho-Chul HWANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/02, H04M1/03, H04N23/54, H04R1/34, H04R3/00
Abstract: an electronic device according to various embodiments of the present invention may comprise: a housing comprising a first surface facing in a first direction and a second surface facing in a second direction that is opposite to the first direction, the first surface comprising an at least partially transparent part and at least one opening formed adjacent to the at least partially transparent part; a camera positioned inside the housing, the camera comprising an image sensor facing in the first direction through the at least partially transparent part of the housing; and an acoustic component arranged between the first surface and the second surface, the acoustic component comprising a vibration plate configured to generate a sound such that the same moves in at least one direction selected from the first and second directions, a first passage formed in a third direction that is substantially perpendicular to the first direction such that the generated sound passes through the same, and a second passage formed along a fourth direction that is different from the third direction so as to connect the first passage and the at least one opening; a wireless communication circuit positioned inside the housing and electrically connected to the acoustic component so as to provide the acoustic component with a signal regarding the sound; a display exposed through the first surface and positioned adjacent to the camera; and a processor positioned inside the housing and electrically connected to the camera, the acoustic component, the wireless communication circuit, and the display. various other embodiments are also possible.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Ankit SRIVASTAV of Bangalore (IN) for samsung electronics co., ltd., Sarvesha Anegundi GANAPATHI of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W8/22, H04W4/06, H04W76/40
Abstract: the present disclosure describes method and system for notifying resource capability of user equipment. in accordance with the embodiments, the method includes determining an event related to one or more multimedia multicast-broadcast service (mbms) service of interest to the ue in receive only mode (rom) session when a system information related to mbms is not broadcasted by a serving cell after transmission of an interest indication for mbms service to the serving cell wherein the event indicates one of: (a) the ue is not interested in the one or more mbms service through the rom session; and (b) the ue is not in reception of the one or more mbms service through the rom session; and transmitting a rom service interest indication for the one or more mbms service through the rom session corresponding to the determined event to the serving cell.
Inventor(s): Kangjin YOON of Suwon-si (KR) for samsung electronics co., ltd., Duckey LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyewon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jonghoe KOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/0431, H04L9/08, H04L9/32, H04L9/40, H04W12/06, H04W28/18, H04W72/56
Abstract: a method of a local bundle assistant (lba) negotiating a certificate with a secondary platform bundle manager (spbm) in a wireless communication system including: transmitting a request message requesting information of certificates supported by a secondary secure platform (ssp) to a secondary platform bundle loader (spbl) of the ssp; receiving the information of certificates supported by the ssp including information of certificate issuers corresponding to a family identifier from the spbl; transmitting the information of certificates supported by the ssp to the spbm; and receiving a certificate of the spbm for key agreement, information of public key identifiers of certificate issuers to be used by the ssp, and information of the family identifier from the spbm.
Inventor(s): Rajavelsamy RAJADURAI of Bangalore (IN) for samsung electronics co., ltd., Rajendran ROHINI of Bangalore (IN) for samsung electronics co., ltd., Varini GUPTA of Bangalore (IN) for samsung electronics co., ltd., Nivedya Parambath SASI of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W12/084
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose a method for providing restricted service access in a wireless network by a first network entity (i.e., target amf entity ()). the method includes requesting a nrf entity () to grant an access-token to access a second network entity (i.e., initial amf entity ()). further, the method includes receiving a message comprising a restricted service access to the second network entity based on the access-token. further, the method includes sending a restricted ue context transfer request to the second network entity based on the message comprising the restricted service access. further, the method includes receiving a ue context transfer response from the second network entity based on the restricted ue context transfer request.
Inventor(s): Lyesuk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/71, H04L9/08, H04W12/03, H04W12/30, H04W12/42
Abstract: an apparatus for remote control of an electronic device is provided. the apparatus includes a communication module, a memory, and a processor. the processor may be configured to obtain key information associated with a first electronic device, receive a virtual identification (id) and location information based on the key information from a second electronic device, identify the first electronic device corresponding to the virtual id using the key information, encrypt a remote control function request message for the first electronic device using the key information, transmit the encrypted remote control function request message to the second electronic device, receive, from the second electronic device, a remote control function request processing result message encrypted in the first electronic device, obtain a remote control function request processing result, and other embodiments may be provided by decrypting the encrypted remote control function request processing result message using the key information.
Inventor(s): Tushar Vrind of Bangalore (IN) for samsung electronics co., ltd., Debabrata Das of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W16/22, H04B7/185, H04W24/02
Abstract: the present disclosure provides a system and a method for aerial-assisted federated learning at a federated learning (fl) server. the method includes receiving a plurality of parameter sets and trajectory information indicating a coverage range by the fl server from a plurality of user equipment (ues) and an aerial cell, respectively. further, the fl server selects at least one ue from the plurality of ues based on the received plurality of parameter sets and the received trajectory information. additionally, the fl server triggers an activation of the aerial link between the aerial cell and the selected at least one ue to include the selected at least one ue to a set of federated ues associated with the fl server.
Inventor(s): Sandy Saab of Plano TX (US) for samsung electronics co., ltd., Shadi Abu-Surra of Plano TX (US) for samsung electronics co., ltd., Gang Xu of Allen TX (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W16/28, H01Q3/22, H04L5/00, H04W16/26
Abstract: a smart repeater includes a transceiver configured to receive a reference signal, receive, from a base station (bs), a subcarrier allocation for a plurality of user equipments (ues), receive, from the bs, a downlink (dl) beam associated with the plurality of ues, and retransmit the dl beam. the smart repeater further includes a processor, operatively coupled to the transceiver, the processor configured to determine a beam split configuration for the dl beam based on the subcarrier allocation, and cause the transceiver to retransmit the dl beam according to the beam split configuration. to retransmit the dl beam according to the beam split configuration the transceiver is further configured to generate a frequency dependent beam for each of the plurality of ues, and direct the frequency dependent beam for each of the plurality of ues to a ue associated with the frequency dependent beam.
Inventor(s): Kwonjong LEE of Suwon-si (KR) for samsung electronics co., ltd., Minchul KIM of Suwon-si (KR) for samsung electronics co., ltd., Juho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungsoo JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04B17/318, H04B17/336
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). particularly, a method for operating a ue in a wireless communication system according to various embodiments of the present disclosure may include a step of receiving, from a base station, information indicating that cli measurement is triggered by identifying the ue as a victim ue, a step of receiving one or more cell-level reference signals from one or more ues in a second cell adjacent to a first cell in which the ue is positioned, after the cli measurement is triggered, and a step of transmitting, to the base station, a cell-level measurement report including a result of measuring rsrp of the one or more received cell-level rss.
Inventor(s): Xingyu HAN of Beijing (CN) for samsung electronics co., ltd., Dingye ZHANG of Beijing (CN) for samsung electronics co., ltd., Hong WANG of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/10
Abstract: the disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting a higher data transmission rate. a method and a device of measurement reporting related to user experience, and a method performed by a first node in a wireless communication network are provided. the method includes receiving, from a third node, third information, and receiving, from a second node, fifth information. the fifth information includes at least one of configuration information of a radio bearer, configuration information of a radio bearer carrying a measurement report, configuration information of a signaling radio bearer (srb), configuration information related to a measurement, configuration information related to a duration, or information for requesting or indicating the duration. the third information includes information on at least one measured cell.
Inventor(s): Abhinav JAIN of Uttar Pradesh (IN) for samsung electronics co., ltd., Amit JAIN of Uttar Pradesh (IN) for samsung electronics co., ltd., Prabhat KUMAR of Uttar Pradesh (IN) for samsung electronics co., ltd., Ankit GULERIA of Uttar Pradesh (IN) for samsung electronics co., ltd.
IPC Code(s): H04W28/02
Abstract: certain example embodiments relate to a method for selecting wireless ridelity (wi-fi) channel for mitigating and/or reducing interference, wherein the method may detect the presence of nearby access points and determine the number of access points by an access point detector module. the method may determine the minimum value of received signal strength indicator (rssi) by the access point detector module, and may determine the congestion information from the nearby devices by a peer congestion observer module. furthermore, the method may calculate at least one weighted parameter and select a preferred channel to create a hotspot for communication by a channel selector module.
Inventor(s): Yongtae Lim of Suwon-si (KR) for samsung electronics co., ltd., Keonyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyeonsoo Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04W36/00, H04W36/08, H04W76/20
Abstract: according to various embodiments, an electronic device comprises: memory storing instructions and at least one processor. the instructions, when executed by at least one processor, may cause the electronic device to: receive at least one radio resource control (rrc) reconfiguration message from a serving cell; perform measurement for at least one neighboring cell based on information associated with conditional reconfiguration confirmed on the basis of the at least one rrc reconfiguration message; and perform at least one procedure for handover to a target cell satisfying a specified condition, based on which a radio link failure with the serving cell is detected and at least a part of the measurement result for the at least one neighboring cell satisfies the specified condition confirmed based on the information associated with the conditional reconfiguration.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/02, H04W48/08
Abstract: a method and apparatus for cell barring in a wireless communication system are provided. the method includes determining whether system information block type 1 (sib1) is acquired from a cell, considering the cell as barred, if the acquiring the sib1 fails, determining whether the cell is a licensed cell or an unlicensed cell and excluding the cell and other cells on a same frequency with the cell as a candidate for cell selection or reselection for a pre-defined period, if the cell is a licensed cell and cell selection or reselection to intra-frequency cells is not allowed.
Inventor(s): Abhishek Sehgal of Frisco TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/24, H04W74/08
Abstract: methods and apparatuses for prioritization handling for mid packet wake up protection after obss pd spatial reuse are disclosed. a method for wireless communication performed by a communication device comprises transmitting and receiving traffic for an application in an overlapping basic service set preamble detection (obss-pd) operation; and reducing a transmission power of the communication device, to reduce adding interference to an inter-basic service set (inter-bss) physical layer protocol data unit (ppdu) that the communication device is transmitting over, based on energy detection (ed) and in accordance with a channel access procedure or a transmission power reduction procedure.
Inventor(s): Kyungjoo SUH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W48/16
Abstract: the disclosure provides a method of supporting communication by using a satellite in a wireless communication system including transmitting, by a user equipment (ue), a registration request message for accessing a public land mobile network (plmn) to an access and mobility management function (amf) through a satellite radio access network (ran), receiving, by the ue, a registration reject message from the amf through the satellite ran in response to the transmitted registration request message, and storing the plmn in a plmn list not allowed in a current location of the ue based on a cause value included in the received registration reject message.
Inventor(s): June HWANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Soenghun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/12, H04W72/232
Abstract: the present disclosure relates to a 5generation (5g) or 6th generation (6g) communication system for supporting a higher data transmission rate. according to an embodiment of the present disclosure, a method performed by a user equipment (ue) in a wireless communication system may be provide. the method may include: receiving, from a base station (bs), configuration information about cross carrier scheduling (ccs); when ccs from a secondary cell (scell) to a primary cell (pcell) or a primary scell (pscell) is configured via the configuration information, monitoring a physical downlink control channel (pdcch) of the scell or a pdcch of the pcell or the pscell; and identifying scheduling information about the pcell or the pscell, based on the monitoring.
Inventor(s): Youngseok Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1263, H04W72/23
Abstract: the devices, systems, and techniques described herein provide for efficient integration of machine learning techniques into wireless communication system frameworks. user equipment may perform communication with base stations based on communication models generated through machine learning. data may be collected from various communication environments to optimize communication models (e.g., to train communication models, provide inputs to communication models, etc.). according to embodiments of the present disclosure, user equipment may update parameters (e.g., parameters for controlling wireless communication systems) to provide the user equipment with various data (e.g., data subsequent to modifying parameters of the wireless communication system) for enabling effective training and implementation of communication models that are implemented based on machine learning. accordingly, user equipment may efficiently manage communication models based on various data, and user equipment may thus perform communication operations within wireless communication systems with improved performance (e.g., based on the generated and updated optimal communication models).
Inventor(s): Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Seunghoon CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/21, H04L1/1829, H04W72/23
Abstract: provided is a method of a terminal in a wireless communication system, including receiving dci for scheduling physical uplink shared control channel (pusch) transmission, determining a number of coded modulation symbols per layer for transmission of csi part 1, based on a number of code blocks associated with a ul-sch, c, a value kfor an r-th code block of the code blocks and a number of bits of the csi part 1, o, wherein in case that the dci includes cbgti and the cbgti indicates that the r-th code block associated with the ul-sch of the pusch transmission is not for transmission, the value kis determined as 0, and else, the value kis determined as a size of the r-th code block for the ul-sch of the pusch transmission; and transmitting, to a base station, the csi part 1 on the pusch based on the number of coded modulation symbols per layer.
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L5/00
Abstract: apparatuses and methods for enhancement to standalone operation for higher frequency range in a wireless communication system. a method includes receiving a synchronization signals and physical broadcast channel (ss/pbch) block and determining a set of configurations for a control resource set (coreset#0) to receive a typeo physical downlink control channel (type0-pdcch). the set of configurations includes a multiplexing pattern between the coreset#0 and the ss/pbch block; a number nrof resource blocks (rbs) for the coreset#0; a number nof symbols for the coreset#0; and a frequency offset between the coreset#0 and the ss/pbch block. for a first multiplexing pattern between the coreset#0 and the ss/pbch block, the frequency offset between the coreset#0 and the ss/pbch block is determined as one of 0, n−n, or (n−n)/. the method further includes receiving the type0-pdcch based on the set of configurations for the coreset#0 over a downlink channel.
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04W72/1263
Abstract: methods and apparatuses for transmission configuration indication (tci) state indication and association for control and data channels. a method performed by a user equipment (ue) includes receiving first information for first and second groups of configured tci states; receiving, in a downlink control information (dci), a first indicated tci state of a tci codepoint; and receiving second information for a first control resource set (coreset). the method further includes identifying, based on the first information, whether the first indicated tci state is associated with the first or second group of configured tci states; identifying, based on the second information, whether the first coreset is associated with the first or second group of configured tci states; and based on identifying that the first indicated tci state and the first coreset are associated with the same group of configured tci states, receiving physical downlink control channel (pdcch) candidates in the first coreset according to the first indicated tci state.
Inventor(s): Anil AGIWAL of Allen TX (US) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/08
Abstract: the disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, configuration information associated with a sidelink (sl) listen-before-talk (lbt) failure recovery, identifying a counter value associated with the sl lbt failure detection, based on an sl lbt failure indication received from a lower layer, and in a case where the counter value is greater than or equal to a threshold value, triggering the sl consistent lbt failure.
Inventor(s): Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/12, H04W60/06
Abstract: the disclosure relates to a 5generation (5g) or pre-5g communication system for supporting a data transmission rate higher than that of a 4generation (4g) system, such as long-term evolution (lte). the disclosure provides a method for operating a terminal in a wireless communication system, the method including: performing communication with an access and mobility management function (amf) in a first network; and transmitting a radio resource control (rrc) message including information on the amf in a second network.
Inventor(s): Kunil YUM of Seoul (KR) for samsung electronics co., ltd., Yangsoo Kwon of Seoul (KR) for samsung electronics co., ltd., Jungmin Park of Seoul (KR) for samsung electronics co., ltd., Junho Lee of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/14, H04B7/01, H04B7/06, H04L1/00, H04W24/10, H04W72/51
Abstract: a method of performing device-to-device (d2d) communication by a first device includes obtaining at least one measurement value corresponding to a relative velocity between the first device and a second device; adjusting at least one transmission parameter based on the at least one measurement value; providing the adjusted at least one transmission parameter to the second device; and transmitting data to the second device based on the adjusted at least one transmission parameter.
Inventor(s): Jeongseok YU of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04W24/10
Abstract: the disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting a higher data transmission rate. a method performed by a base station (bs) in a wireless communication system is provided. the method includes transmitting, to a user equipment (ue), a radio resource control (rrc) message including measurement configuration information through a direct path or an indirect path via a relay ue, and receiving, from the ue, a measurementreport message including measurement result through the direct path or the indirect path via the relay ue. further, the measurement result includes a first measurement result for direction communications (pc5) link and a second measurement result for uu link.
Inventor(s): Injae LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunghyup KIM of Suwon-si (KR) for samsung electronics co., ltd., Yebin NAM of Suwon-si (KR) for samsung electronics co., ltd., Daegeun YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05G2/00, G03F7/00
Abstract: an extreme ultraviolet light source device includes a chamber having a lower surface on which a condensing mirror is arranged, an intermediate focus, and a side surface between the lower surface and an upper surface a first exhaust port and a second exhaust port on the upper surface and spaced apart from the intermediate focus; a droplet supply adjacent to the side surface of the chamber, and configured to supply a droplet to generate the extreme ultraviolet light into the chamber; a light source configured to generate the extreme ultraviolet light by oscillating a laser; a catch adjacent to the side surface of the chamber, opposite to the droplet supply, and configured to receive the droplet discharged from the droplet supply unit; a first exhaust connected to the first exhaust port; and a second exhaust adjacent to the upper surface of the chamber, and connected to the second exhaust port.
20240121904.ELECTRONIC DEVICE INCLUDING DISPLAY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dooryong KIM of Suwon-si (KR) for samsung electronics co., ltd., Yunsik KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaemyung CHO of Suwon-si (KR) for samsung electronics co., ltd., Jingook KIM of Suwon-si (KR) for samsung electronics co., ltd., Yonghee JANG of Suwon-si (KR) for samsung electronics co., ltd., Sinyoung PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00, H04M1/02, H04M1/18, H05K5/02
Abstract: an electronic device is provided. the electronic device includes a hinge housing extending in a direction of a rotational axis, a first housing connected to one side of the hinge housing in a direction perpendicular to the rotational axis to rotate about the rotational axis relative to the hinge housing, a second housing connected to an opposite side of the hinge housing in a direction perpendicular to the rotational axis to rotate about the rotational axis relative to the hinge housing, and a flexible display including a bending area at least partially disposed in the hinge housing and formed to be a flat surface or a curved surface, a first area extending from the bending area in one direction perpendicular to the rotational axis, and a second area extending from the bending area in an opposite direction perpendicular to the rotational axis.
Inventor(s): Giuk KANG of Suwon-si (KR) for samsung electronics co., ltd., Dongmin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jaehun KO of Suwon-si (KR) for samsung electronics co., ltd., Younghun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hongsik PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, G06F1/16
Abstract: an electronic device according to various embodiments may include: a first housing; a second housing coupled to the first housing and configured to be slidable in a first direction; a flexible display having one end fixed to one of the first housing and the second housing, and including an information display area visible from the outside of the electronic device and configured to increase and/or decrease based on sliding of the second housing; and a hinge device including a hinge rotatably connecting the second housing to the first housing, wherein a rotation shaft of the hinge device may be inserted into an accommodation part extending in the first direction such that the rotation shaft is movable in the first direction in a process in which the second housing rotates relative to the first housing.
20240121941.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaecheon YONG of Suwon-si (KR) for samsung electronics co., ltd., Daehong KO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a substrate having first and second regions, semiconductor patterns spaced apart from each other in a first horizontal direction on the first region, wherein each of the semiconductor patterns has first side surfaces opposing each other in the first horizontal direction and second side surfaces opposing each other in a second horizontal direction, the first and second horizontal directions parallel to an upper surface of the substrate, the second horizontal direction perpendicular to the first horizontal direction, gate patterns surrounding an upper surface, a lower surface, and the first side surfaces of each of the semiconductor patterns, and a landing pattern spaced apart from the semiconductor patterns in the first horizontal direction on the second region and electrically connected to the gate patterns. the landing pattern includes a semiconductor material layer and a conductive material layer covering at least one surface of the semiconductor material layer.
20240121944.SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Young Woo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor memory device, including a substrate including an active region, a cell gate structure in the substrate and extended in a first direction, the cell gate structure including a cell gate trench, a cell gate insulating layer along an inner wall of the cell gate trench, a cell gate electrode on the cell gate insulating layer, a cell gate conductive layer on the cell gate electrode and a cell gate capping pattern filling the cell gate trench, a bit line structure crossing the cell gate structure, and an information storage connected to the active region, wherein the cell gate insulating layer includes an insertion portion between the cell gate conductive layer and the cell gate capping pattern, a lower portion in contact with the cell gate conductive layer, and an upper portion in contact with the cell gate capping pattern.
Inventor(s): Jin-Seong Lee of Suwon-si (KR) for samsung electronics co., ltd., Tai Uk Rim of Suwon-si (KR) for samsung electronics co., ltd., Ji Hun Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyo-Suk Chae of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor memory device comprises a substrate including a first source/drain region and a second source/drain region, a trench between the first source/drain region and the second source/drain region and formed in the substrate, a cell gate insulating layer on sidewalls and a bottom surface of the trench, a cell gate electrode on the cell gate insulating layer, a work function control pattern on the cell gate electrode, including n-type impurities and a cell gate capping pattern on the work function control pattern. the work function control pattern includes a semiconductor material. the work function control pattern includes a first region and a second region between the first region and the cell gate electrode. a concentration of the n-type impurities in the first region is greater than a concentration of the n-type impurities in the second region.
20240121947.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Eun A KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes active patterns disposed on a substrate and including central portions, respectively, bit lines extending in a first direction on the central portions of the active patterns, word lines intersecting the active patterns in a second direction intersecting the first direction, fence patterns disposed between the bit lines adjacent to each other on the word lines, a contact trench region intersecting the active patterns and the word lines in a third direction intersecting the first and second directions, and bit line contacts and filling insulation patterns alternately arranged in the third direction in the contact trench region. the first to third directions are parallel to a bottom surface of the substrate. the filling insulation patterns are disposed between the word lines and the fence patterns, respectively.
20240121950.SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaecheon YONG of Suwon-si (KR) for samsung electronics co., ltd., Daehong KO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
Abstract: a semiconductor device includes a substrate, a plurality of semiconductor patterns spaced apart from each other in a first horizontal direction on the substrate, where each of the plurality of semiconductor patterns has first side surfaces opposing each other in the first horizontal direction and second side surfaces opposing each other in a second horizontal direction, the first and second horizontal directions parallel to an upper surface of the substrate, the second horizontal direction perpendicular to the first horizontal direction, source/drain regions on the second side surfaces of each of the plurality of semiconductor patterns, a plurality of gate patterns surrounding upper surfaces, lower surfaces, and the first side surfaces of each of the plurality of semiconductor patterns, a plurality of conductive line patterns connecting the plurality of gate patterns to each other, and data storage structures in parallel to the plurality of semiconductor patterns in the second horizontal direction.
20240121952.VERTICAL MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sohyeon LEE of Suwon-si (KR) for samsung electronics co., ltd., Seahoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeduk LEE of Suwon-si (KR) for samsung electronics co., ltd., Tackhwi LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B41/27, H10B41/10, H10B43/10, H10B43/27
Abstract: a vertical memory device includes a substrate, first and second sub-semiconductor patterns, first and second common source contacts, and first and second cell structures. the substrate includes a first region and a second region having a same length as the first region in a first direction, the first region having a first width in a second direction perpendicular to the first direction, and the second region having a second width in the second direction that is less than the first width. the first sub-semiconductor pattern covers the first region, and a portion of the first sub-semiconductor pattern has a first thickness. the second sub-semiconductor pattern covers the second region and has a second thickness that is less than the first thickness. the first and second common source contacts are disposed on edges in the second direction of the first and second patterns, respectively.
20240121957.SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myunghoon Han of Suwon-si (KR) for samsung electronics co., ltd., Sehee Jang of Suwon-si (KR) for samsung electronics co., ltd., Hyunho Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/00, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/35
Abstract: a semiconductor device includes a gate electrode structure, a memory channel structure, a first division pattern, and first support patterns. the gate electrode structure includes gate electrodes spaced apart from each other on a substrate in a first direction perpendicular to an upper surface of the substrate, and each of the gate electrodes extends in a second direction parallel to the upper surface of the substrate. the memory channel structure extends through the gate electrode structure on the substrate. the first division pattern is formed on a sidewall of the gate electrode structure in a third direction parallel to the upper surface of the substrate and crossing the second direction, and extends in the second direction. the first support patterns are spaced apart from each other in the second direction on the first division pattern, and each of the first support patterns includes a conductive material.
Inventor(s): Samki KIM of Suwon-si (KR) for samsung electronics co., ltd., Nambin KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehun KIM of Suwon-si (KR) for samsung electronics co., ltd., Suhwan LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeongwon CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27
Abstract: a vertical semiconductor device includes; a pattern structure including a plurality of insulation patterns and a plurality of gate electrodes that are alternately and repeatedly stacked on a substrate, wherein the pattern structure includes a first gate electrode serving as a gate electrode of an erase transistor, wherein the first gate electrode is one of the plurality of gate electrodes; and a channel structure in a channel hole passing through the pattern structure, wherein the channel structure includes a data storage structure, a first channel, an undoped semiconductor liner, a doped semiconductor pattern, a filling insulation pattern and a capping pattern, wherein the data storage structure, the first channel, the undoped semiconductor liner, and the doped semiconductor pattern are sequentially disposed on a sidewall of the first gate electrode.
Inventor(s): So Hyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Kang-Oh Yun of Suwon-si (KR) for samsung electronics co., ltd., Dong Jin Lee of Suwon-si (KR) for samsung electronics co., ltd., Jun Hee Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B43/27
Abstract: a semiconductor memory device includes: a substrate including a first region and a second region, the first region includes a peripheral circuit and a first active region (far), and the second region includes memory cell blocks. the far includes a far first extension extending in a first direction, a far second extension extending in a second direction, and a far third extension extending in a third direction. the far first extension, the far second extension, and the far third extension form an angle greater than 90 degrees relative to one another. the device includes a first pass transistor circuit configured to transmit driving signals, and the first pass transistor circuit includes a far first gate structure on the far first extension, a far second gate structure on the far second extension, a far third gate structure on the far third extension, and a first shared source/drain.
SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
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- A61B5/00
- Samsung electronics co., ltd.
- A61L9/20
- A62B18/00
- A62B23/02
- A63B21/005
- A63B21/00
- A63B24/00
- B25J9/16
- B25J5/02
- B25J9/00
- B25J13/08
- B60W60/00
- G07C5/08
- B65F1/16
- C07F5/02
- C09K11/06
- H10K50/12
- H10K85/60
- C07F15/00
- H10K85/30
- D06F34/28
- D06F29/00
- D06F34/05
- F24F1/38
- F24F1/56
- F25D29/00
- F26B21/08
- F26B9/06
- F26B21/00
- F28F9/02
- F28F9/18
- G01B11/06
- G01B9/02
- G01C21/36
- G01C21/34
- G01C21/00
- G01C21/20
- G01C21/32
- G01L1/24
- G01B11/16
- G01L11/02
- G01N15/02
- G01N15/06
- G01R19/10
- G01R25/00
- G02B13/00
- G02B9/64
- H04N23/55
- H04N23/57
- H04N23/68
- G03F7/16
- G03F7/20
- H01L21/027
- H01L21/033
- H01L21/66
- G06F1/16
- G06F1/26
- G05F1/56
- G06F1/04
- H03K3/037
- G06F3/041
- G06F3/0481
- G06F3/0482
- G06F3/04842
- H04L67/06
- G06F3/04845
- G06F3/0485
- G06F3/06
- G06F12/02
- G06F16/174
- G06F3/14
- G06F3/0488
- G06F3/04883
- G06F3/04886
- G06F9/451
- G06T3/40
- H04M1/02
- G06F8/65
- A47L9/00
- A47L9/28
- G06F9/50
- G06F1/3228
- G06F1/329
- G06F9/30
- G06F9/38
- G06F9/48
- G06F12/10
- G06F13/16
- G06F13/40
- G06F13/42
- G06F16/33
- G06F16/583
- G06N3/0985
- G06F16/953
- G06F16/951
- G06F21/31
- G06F30/392
- G06N20/00
- G06F40/35
- G06F40/166
- G06N3/063
- G06N3/08
- G06N3/091
- G06N3/084
- G06T5/00
- G06T5/20
- G06T5/50
- G06T5/40
- G06T7/20
- G06T7/70
- G06T17/05
- G06T17/00
- G06T7/50
- G06T19/20
- G06V10/764
- G06T19/00
- G06V40/16
- G06T7/13
- G06T7/73
- G06V10/774
- G06V10/26
- G06V10/82
- G06V20/40
- G06V20/62
- G06T11/20
- G06V10/60
- G06V10/74
- G06V20/50
- G06V20/70
- G06V10/776
- G06V10/77
- G06V20/56
- G06V20/58
- G09G3/3275
- G10L15/08
- G10L15/22
- G10L15/18
- G10L15/28
- G10L15/30
- G10L17/10
- G10L17/18
- G10L25/78
- G11C7/06
- G11C5/14
- G11C7/22
- G11C7/18
- G11C5/06
- G11C7/12
- G11C11/16
- G11C11/402
- G11C11/39
- H01L27/102
- H01L29/66
- H01L29/749
- G11C11/4093
- G11C11/4074
- G11C11/4076
- G11C16/04
- H01L25/065
- H10B41/10
- H10B41/27
- H10B41/35
- H10B41/40
- H10B43/10
- H10B43/27
- H10B43/35
- H10B43/40
- H10B80/00
- H01J37/32
- H01L21/3065
- H01L21/02
- G02B27/14
- G02B27/28
- H01L21/687
- H01L21/12
- H01L21/302
- H01L21/768
- G03F7/00
- H01L23/544
- H10B12/00
- H01L21/67
- H01L21/285
- H01L21/673
- H01L21/677
- H01L21/68
- G03F7/40
- H01L23/31
- H01L21/56
- H01L23/00
- H01L25/00
- H01L23/48
- H10B10/00
- H01L23/498
- H01L23/367
- H01L23/373
- H01L23/522
- H01L21/8234
- H01L23/528
- H01L27/088
- H01L27/06
- H01L29/06
- H01L29/417
- H01L29/423
- H01L29/775
- H01L23/535
- H01L23/538
- H01L25/16
- H01L25/18
- H01L25/10
- B08B3/12
- H01L27/146
- H01L29/786
- H01L29/08
- H01L29/45
- H01L21/443
- H01Q1/08
- H01Q1/24
- H01Q3/02
- H01Q21/24
- H01Q21/30
- H01Q21/28
- H01Q1/38
- H01Q21/06
- H02M3/158
- H02M1/08
- H02M1/14
- H03F1/02
- H03F3/45
- H03F1/56
- H03F3/24
- H03L7/091
- H03L7/089
- H04B1/04
- H03F3/195
- H04B7/06
- G01S5/02
- H04B7/0404
- H04W24/08
- H04W52/02
- H04W68/00
- H04B7/155
- H04W64/00
- H04L1/1829
- H04L1/1812
- H04W28/04
- H04L5/00
- H04W76/10
- H04W76/30
- H04L9/00
- H04L9/06
- H04L51/10
- G06F40/30
- H04L51/04
- G06F16/182
- H04L67/10
- H04L67/1095
- H04L67/561
- H04L67/5682
- H04L67/5683
- H04L67/60
- H04M1/60
- G10L15/02
- G10L19/005
- G10L19/012
- H04R25/00
- H04M1/72403
- H04N13/128
- G06T3/00
- G06T7/593
- H04N13/111
- H04N13/239
- H04N13/271
- H04N23/611
- G06F3/16
- H04N7/14
- H04N23/63
- H04N23/695
- H04N23/69
- H04N25/21
- G01K7/36
- H04N25/57
- H04N23/51
- H04N23/60
- H04N25/40
- H04N25/615
- H04N25/706
- H04N25/772
- H04N25/67
- H03M1/56
- H04N25/571
- H04N25/709
- H04N25/771
- H04N25/78
- H04R1/02
- H04M1/03
- H04N23/54
- H04R1/34
- H04R3/00
- H04W8/22
- H04W4/06
- H04W76/40
- H04W12/0431
- H04L9/08
- H04L9/32
- H04L9/40
- H04W12/06
- H04W28/18
- H04W72/56
- H04W12/084
- H04W12/71
- H04W12/03
- H04W12/30
- H04W12/42
- H04W16/22
- H04B7/185
- H04W24/02
- H04W16/28
- H01Q3/22
- H04W16/26
- H04W24/10
- H04B17/318
- H04B17/336
- H04W28/02
- H04W36/30
- H04W36/00
- H04W36/08
- H04W76/20
- H04W48/02
- H04W48/08
- H04W52/24
- H04W74/08
- H04W60/04
- H04W48/16
- H04W72/12
- H04W72/232
- H04W72/1263
- H04W72/23
- H04W72/21
- H04W76/12
- H04W60/06
- H04W76/14
- H04B7/01
- H04L1/00
- H04W72/51
- H05G2/00
- H05K5/00
- H04M1/18
- H05K5/02
