Murata Manufacturing Co., Ltd. patent applications on September 26th, 2024
Patent Applications by Murata Manufacturing Co., Ltd. on September 26th, 2024
Murata Manufacturing Co., Ltd.: 27 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H01M10/0525 (5), H01M10/0568 (3), H01M10/0567 (3), H01G4/30 (2), H03H9/02 (2) H01M10/0568 (3), B01D29/05 (1), H01L29/41708 (1), H05K1/0283 (1), H04B1/0078 (1)
With keywords such as: layer, surface, electrode, substrate, portion, main, metal, part, including, and connected in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Miki IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Miwako NISHIKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toshikazu KAWAGUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takashi KONDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): B01D29/05, B01D29/78, B01D39/20, C12M1/12, C12M1/28
CPC Code(s): B01D29/05
Abstract: a filtration recovery method for filtering and recovering a liquid containing a filtering object that includes: sinking a filtration recovery device including a filtration filter having a plurality of through-holes, an inlet for introducing the liquid, an outlet for discharging the liquid, and a holder having a flow path communicating the inlet and the outlet, and the filtration filter is arranged in the flow path, into the liquid containing the filtering object contained in a liquid storage container with one end side of the holder provided with the outlet so as to capture the filtering object with the filtration filter; introducing the liquid from the outlet of the holder of the filtration recovery device; closing the outlet of the holder of the filtration recovery device; and recovering the filtering object together with the liquid held in the holder of the filtration recovery device.
Inventor(s): Fumiya KUROKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yasuhiro AIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): B81B7/00, B81C1/00
CPC Code(s): B81B7/007
Abstract: a mems device includes a first substrate with a mems structure, a second substrate facing the first substrate with an interval therebetween, a first joint portion that includes a eutectic layer including a eutectic alloy of different metals between the first and second substrates and that surrounds the mems structure and is joined to the first and second substrates, a conductive contact layer between the first and second substrates and that is in contact with the first and second substrates and does not melt at a temperature at which the plural types of metal undergo a metal eutectic reaction, and an insulating layer located on the contact layer and electrically insulated.
Inventor(s): Fumiya KUROKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yasuhiro AIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): B81C1/00, B81B7/00
CPC Code(s): B81C1/00301
Abstract: a mems device includes a first substrate having a mems structure, a second substrate opposing the first substrate with an interval therebetween in an opposing direction, a first joint portion that includes a eutectic layer including as a main material, a eutectic alloy of plural types of metal, that is provided between the first and second substrates and surrounds the mems structure as viewed in the opposing direction, and that is joined to the first and second substrates, and a contact layer that is provided between the first and second substrates and is in contact with the first and second substrates. the contact layer includes a portion of the plural types of metal included in the first joint portion.
Inventor(s): Kosuke SUGIURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takeshi TORITA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01B1/08, H01B5/00
CPC Code(s): H01B1/08
Abstract: a conductive film including: a film including particles of a layered material including one or plural layers; and a titanium oxide. the one or plural layers includes a layer body represented by: mx, wherein m is at least one metal of group 3, 4, 5, 6, or 7, and contains ti, x is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n and 5 or less, and a modifier or terminal t existing on a surface of the layer body, wherein t is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom, and a proportion of tetravalent titanium to divalent, trivalent, and tetravalent titanium in the conductive film, as determined by x-ray photoelectron spectroscopy, is more than 2% by mol and 57% by mol or less.
20240321487. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tomoya OOSHIMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yuuta HOSHINO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru NAKANO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Koichi YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Miki SASAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01C7/04, H01C1/14
CPC Code(s): H01C7/041
Abstract: an electronic component that includes: a base body; a glass film covering at least a part of an outer surface of the base body; and an underlayer electrode covering a part of a surface of the glass film, wherein the base body contains a mn oxide, the underlayer electrode contains a conductive metal and a glass component, the base body has a reaction layer containing a composite oxide of mn and the conductive metal at an end portion of the underlayer electrode, and the reaction layer has a void.
20240321516. CERAMIC ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takuya GOITSUKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G2/24, H01G2/10, H01G4/012, H01G4/30
CPC Code(s): H01G2/24
Abstract: to provide ceramic electronic component capable of increasing strength of identification mark against physical impact from outside while suppressing decrease in recognition accuracy of identification mark. ceramic electronic component includes element body containing ceramic as main material, and identification mark formed on surface of element body, at least a part of identification mark protruding from surface of element body. element body includes first portion that surrounds identification mark and is in contact with outer edge portion of identification mark when viewed from thickness direction orthogonal to surface of element body, and second portion surrounding first portion when viewed from thickness. first portion is raised with respect to second portion.
20240321517. CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Haruki Kobayashi of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akio Masunari of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/228
CPC Code(s): H01G4/228
Abstract: a capacitor that includes: an insulating substrate having a first main surface and a second main surface opposite to the first main surface; a capacitance forming part facing the first main surface, the capacitance forming part comprising a conductive metal porous body, a dielectric film covering a surface of the metal porous body, and a conductive film covering the dielectric film; a first external connection line connected to the conductive metal porous body; a second external connection line connected to the conductive film; and a support part in the insulating substrate, the support part supporting the capacitance forming part and protruding from the first main surface toward the capacitance forming part, and surrounded by and joined to the capacitance forming part.
Inventor(s): Akira ISHIZUKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shinichi KOKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yasuyuki SHIMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/232, H01G4/012, H01G4/248, H01G4/30
CPC Code(s): H01G4/232
Abstract: a multilayer ceramic capacitor includes end-surface external electrodes and side-surface external electrodes. the end-surface external electrodes are respectively provided at end surfaces of a multilayer body and are respectively connected to end-surface connecting internal electrodes. the side-surface external electrodes are respectively provided at the side surfaces of the multilayer body and respectively connected to side-surface connecting internal electrodes. the end-surface connecting internal electrodes each include end surface opposing portion opposing the side-surface connecting internal electrode b adjacent in a lamination direction, and an end surface lead-out portion extending from the end surface opposing portion to one of the end-surface external electrodes. the side-surface connecting internal electrodes each include a side surface opposing portion opposing the end-surface connecting internal electrodes adjacent in the lamination direction, and a side surface lead-out portion extending from the side surface opposing portion to one of the side-surface external electrodes.
20240321522. FILM CAPACITOR AND RESIN FILM_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Shunsuke AKIBA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/33, H01G4/18
CPC Code(s): H01G4/33
Abstract: a film capacitor that includes: a dielectric film; and a metal layer on at least one surface of the dielectric film. the dielectric film is a resin film made of a cured product of a first organic material having multiple hydroxy groups in a molecule and a second organic material having multiple isocyanate groups in a molecule. an intensity ratio of a first peak at 1680 cmto 1770 cmderived from carbonyl groups in urethane bonds to a second peak at 1560 cmto 1620 cmderived from aromatic rings in a fourier-transform infrared spectroscopy (ft-ir) spectrum of the resin film is 0.50 to 0.94.
20240321721. STRETCHABLE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Keisuke NISHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yui NAKAMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Nobuyasu HORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L23/498
CPC Code(s): H01L23/4985
Abstract: a stretchable device that includes: a first substrate having a first main surface and a second main surface facing each other; a first wiring on the first main surface and extending along the first main surface; a second wiring adjacent to the first wiring; a second stretchable substrate having a third main surface and a fourth main surface facing each other, the second stretchable substrate connected to the first stretchable substrate; a stretchable third wiring on the fourth main surface and extending along the fourth main surface; and a stretchable fourth wiring adjacent to the third wiring, wherein a shortest distance between the first wiring and the second wiring is shorter than a shortest distance between the third wiring and the fourth wiring.
Inventor(s): Sébastien IOCHEM of Caen (FR) for murata manufacturing co., ltd., Stéphane BOUVIER of Cairon (FR) for murata manufacturing co., ltd.
IPC Code(s): H01L23/62, H01L21/027, H01L25/16, H01L27/06
CPC Code(s): H01L23/62
Abstract: a resistor-capacitor component that includes: a capacitor having at least a first electrode structure and a second electrode structure separated by a dielectric structure; an insulating layer on the second electrode structure, the insulating layer having contact holes distributed across a surface of the insulating layer, each of the contact holes delimiting an opening onto the second electrode structure having a corrugated edge; and a conductive layer on the insulating layer and filling the contact holes to form electrical contacts with the second electrode structure.
Inventor(s): Florent LALLEMAND of Herouville Saint-Clair (FR) for murata manufacturing co., ltd., François LECORNEC of Caen (FR) for murata manufacturing co., ltd., Maxime LEMENAGER of Caen (FR) for murata manufacturing co., ltd., Florent TANAY of Carpiquet (FR) for murata manufacturing co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L28/91
Abstract: an integrated device that includes: a substrate; a metal barrier layer above the substrate; a layer including a porous region of anodized metal having a plurality of substantially straight pores that extend from a top surface of the porous region, perpendicularly to the top surface of the porous region, towards the metal barrier layer so as to reach the metal barrier layer, wherein the porous region includes a zone of pores that open onto the metal barrier layer surrounded by peripheral pores that are plugged up at their bottom ends by an oxide plug of the metal barrier, and the porous region further includes: an island of pores plugged up at their bottom end by an oxide plug of the metal barrier, and/or a protuberance of pores plugged up at their bottom end by an oxide plug of the metal barrier.
Inventor(s): Kenji SASAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Koji INOUE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Shinnosuke TAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Satoshi GOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masao KONDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L29/417, H01L23/00, H01L23/48, H01L23/528, H01L27/082, H01L29/205, H01L29/737
CPC Code(s): H01L29/41708
Abstract: a mesa structure including a collector layer, a base layer, and an emitter layer laminated on a substrate is formed. an emitter electrode electrically connected to the emitter layer is disposed on the mesa structure. moreover, a base electrode electrically connected to the base layer is disposed on the mesa structure. a collector electrode is disposed in such a manner as to surround the mesa structure in plan view, and the collector electrode is electrically connected to the collector layer. the emitter electrode includes a first part and a second part. in plan view, the base electrode surrounds the first part of the emitter electrode, and the second part of the emitter electrode surrounds the base electrode.
20240322188. SOLID-STATE BATTERY_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tatsushiro HIRATA of Kyoto (JP) for murata manufacturing co., ltd., Keisuke SHIMIZU of Kyoto (JP) for murata manufacturing co., ltd., Katsuaki HIGASHI of Kyoto (JP) for murata manufacturing co., ltd., Takahiro HAYAKAWA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M4/66, H01M10/0525, H01M10/0562
CPC Code(s): H01M4/668
Abstract: provided is a solid-state battery capable of further reducing cracks due to expansion of the battery during charging. a solid-state battery includes: a battery element in which a positive electrode layer, a negative electrode layer, and a solid electrolyte layer interposed between the positive electrode layer and the negative electrode layer are stacked; an end-face electrodes provided on an end face of the battery element; and an insulating layer provided between the positive electrode layer or the negative electrode layer and the end-face electrodes, in which the insulating layer contains a heat-resistant resin.
Inventor(s): Masayuki IHARA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0568, H01M10/0525
CPC Code(s): H01M10/0568
Abstract: a secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. the electrolytic solution includes an electrolyte salt. the electrolyte salt includes an imide anion represented by formula (1).
Inventor(s): Masayuki IHARA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0568, H01M10/0525, H01M10/0567
CPC Code(s): H01M10/0568
Abstract: a secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. the electrolytic solution includes an electrolyte salt. the electrolyte salt includes at least one of a first imide anion represented by formula (1) or a third imide anion represented by formula (3).
20240322251. SECONDARY BATTERY_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Masayuki IHARA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0568, H01M10/0525, H01M10/0567
CPC Code(s): H01M10/0568
Abstract: a secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. the electrolytic solution includes a first electrolyte salt and a second electrolyte salt. the first electrolyte salt includes a first anion and a first cation. the second electrolyte salt includes a second anion and a second cation. the first anion includes at least one of a first imide anion represented by formula (1), a second imide anion represented by formula (2), a third imide anion represented by formula (3), or a fourth imide anion represented by formula (4). the second anion includes at least one of a hexafluorophosphate ion (pf), a tetrafluoroborate ion (bf), or a bis(fluorosulfonyl)imide ion (n(fso)). a sum of a content of the first cation in the electrolytic solution and a content of the second cation in the electrolytic solution is greater than or equal to 0.7 mol/kg and less than or equal to 2.2 mol/kg. a ratio of a number of moles of the second anion in the electrolytic solution to a number of moles of the first anion in the electrolytic solution is greater than or equal to 13 mol % and less than or equal to 6000 mol %.
Inventor(s): Isao TAMAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Haruhiko MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Norihide FUJIMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hideki IMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M50/129
CPC Code(s): H01M50/129
Abstract: an exterior material that includes: a metal layer; a first thermoplastic resin layer on a first principal surface side of the metal layer; and a second thermoplastic resin layer on a second principal surface side of the metal layer, in which a first melting point of the first thermoplastic resin layer and a second melting point of the second thermoplastic resin layer are both higher than 260� c.
20240322672. Power Converter_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Gregory Szczeszynski of Hollis NH (US) for murata manufacturing co., ltd.
IPC Code(s): H02M1/32, H02M3/07, H02M3/158
CPC Code(s): H02M1/325
Abstract: circuits and methods for protecting a multi-level power converter using no more than two high-voltage fet switches while allowing all or most other power switches to be low-voltage fet switches. some embodiments provide protective high-voltage top and bottom fets designed to saturate before the remaining low-power fet switches saturate. other embodiments may use only low-power fets for the power switches but provide protective circuits configured to be in an always-on (conducting) state when in normal power conversion operation, and to quickly switch to an off (non-conducting) state in the event of transients or a fault condition. optionally, one or more of the protective circuits may be used in a controlled manner to limit or block current flow during certain types of fault conditions and/or to limit in-rush current during startup of a power converter.
20240322758. POWER AMPLIFIER CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yuuma NOGUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kiichiro TAKENAKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Tomohide ARAMATA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takeshi KOGURE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takaya WADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, H03F3/24
CPC Code(s): H03F1/0233
Abstract: a power amplifier circuit includes a power amplifier configured to amplify radio-frequency signal, a supply voltage terminal coupled to the power amplifier, and a bypass capacitor coupled between ground and a supply voltage path connecting the supply voltage terminal to the power amplifier. a supply voltage (v) is configured to be supplied to the power amplifier through the supply voltage terminal, and the supply voltage (v) is configured to vary across multiple discrete voltage levels within a single frame of radio-frequency signals. the first bypass capacitor has an electrostatic capacity equal to or higher than a specific value that is determined to cause the power amplifier circuit with the first supply voltage to have a higher efficiency than a threshold efficiency. in some exemplary embodiments, the bypass capacitor has an electrostatic capacity equal to or higher than 1.4 nanofarads.
Inventor(s): Hiromasa SAEKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masaya TAMURA of Toyohashi-shi (JP) for murata manufacturing co., ltd., Masaya TAKAGI of Toyohashi-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H7/01, H04B1/525
CPC Code(s): H03H7/0115
Abstract: a noise elimination circuit includes a coupling line and a resonance unit, and is connected between a first transmission line and a second transmission line to eliminate noise between the first and second transmission lines. the coupling line is connected to the first and second transmission lines. the resonance unit includes a plurality of resonance circuits connected in parallel to the coupling line. a band pass filter includes the coupling line and the resonance unit. a real part and an imaginary part of an admittance between the transmission lines are canceled out by the noise elimination circuit.
20240322788. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Chihiro SHODA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yasuaki SHIN of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoshihisa OKANO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Junpei YASUDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/145, H03H9/02, H03H9/05, H03H9/10, H03H9/64, H03H9/72
CPC Code(s): H03H9/145
Abstract: an acoustic wave device includes a package substrate including a first main surface, and an acoustic wave element chip on the first main surface and including a piezoelectric layer including second and third main surfaces facing each other, and idt electrodes at the second main surface on a side of the first main surface. the first main surface includes first and second sides facing each other. the second main surface a first edge portion closer to the first side than the second side, and a second edge portion facing the first edge portion. a first inter-outer peripheral edge distance between the first side and the first edge portion is longer than a second inter-outer peripheral edge distance between the second side and the second edge portion. the piezoelectric layer has a z-axis defining a crystal axis and inclined with respect to a thickness direction of the piezoelectric layer.
Inventor(s): Kazunori INOUE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/58, H03H9/02, H03H9/17, H03H9/60, H03H9/70
CPC Code(s): H03H9/585
Abstract: an acoustic wave device includes a first piezoelectric layer including a first main surface and a second main surface, a first support portion including a first support substrate that overlaps the first piezoelectric layer in a first direction, a first resonator provided on at least the first main surface of the first piezoelectric layer, a second piezoelectric layer including a third main surface and a fourth main surface, a second support portion including a second support substrate overlapping the second piezoelectric layer in the first direction, and a second resonator provided on at least the third main surface of the second piezoelectric layer. the first resonator and the second resonator each include a functional electrode. the support portion includes a space portion that overlaps at least a portion of the functional electrode of the resonator in a plan view in the first direction.
Inventor(s): Hideki MUTO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/00, H04B1/18
CPC Code(s): H04B1/0078
Abstract: a high frequency circuit includes: a switch that has terminals, and that switches connection and disconnection between the terminals; a filter that has a first pass band including at least a part of band a and that is connected to one of the terminals; another filter that has a second pass band including at least a part of band b and that is connected to another one of the terminals; and an acoustic wave resonator that has its first end connected to even another of the terminals and its second end connected to the terminal.
20240324099. STRETCHABLE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiromitsu ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Keisuke NISHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K1/02
CPC Code(s): H05K1/0283
Abstract: a stretchable device including: a stretchable substrate; a stretchable wiring on the stretchable substrate; a conductive member in contact with the stretchable wiring; a solder member on the conductive member and in contact with the conductive member; an electronic component electrically connected to the conductive member with the solder member interposed therebetween; and a first insulating layer covering at least a part of the stretchable wiring and continuous with the conductive member along an outer surface of an end portion of the stretchable wiring.
20240324158. MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshihito OTSUBO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Morio TAKEUCHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H05K9/00, H05K1/02
CPC Code(s): H05K9/0081
Abstract: a module includes: a first substrate having a first surface and a second surface facing opposite sides; and a second substrate having a third surface and a fourth surface facing opposite sides, wherein the second substrate is disposed to overlap the first substrate with the third surface facing the first substrate, while being spaced apart from the first substrate on the second surface side of the first substrate, the first substrate and the second substrate are electrically connected, an inductor is mounted on the third surface, and at least one shield electrode is fixed to the first substrate with the shield electrode being positioned so as to cross a path of a magnetic flux, and each of the at least one shield electrode is grounded.
Murata Manufacturing Co., Ltd. patent applications on September 26th, 2024
- Murata Manufacturing Co., Ltd.
- B01D29/05
- B01D29/78
- B01D39/20
- C12M1/12
- C12M1/28
- CPC B01D29/05
- Murata manufacturing co., ltd.
- B81B7/00
- B81C1/00
- CPC B81B7/007
- CPC B81C1/00301
- H01B1/08
- H01B5/00
- CPC H01B1/08
- H01C7/04
- H01C1/14
- CPC H01C7/041
- H01G2/24
- H01G2/10
- H01G4/012
- H01G4/30
- CPC H01G2/24
- H01G4/228
- CPC H01G4/228
- H01G4/232
- H01G4/248
- CPC H01G4/232
- H01G4/33
- H01G4/18
- CPC H01G4/33
- H01L23/498
- CPC H01L23/4985
- H01L23/62
- H01L21/027
- H01L25/16
- H01L27/06
- CPC H01L23/62
- H01L23/00
- CPC H01L28/91
- H01L29/417
- H01L23/48
- H01L23/528
- H01L27/082
- H01L29/205
- H01L29/737
- CPC H01L29/41708
- H01M4/66
- H01M10/0525
- H01M10/0562
- CPC H01M4/668
- H01M10/0568
- CPC H01M10/0568
- H01M10/0567
- H01M50/129
- CPC H01M50/129
- H02M1/32
- H02M3/07
- H02M3/158
- CPC H02M1/325
- H03F1/02
- H03F3/24
- CPC H03F1/0233
- H03H7/01
- H04B1/525
- CPC H03H7/0115
- H03H9/145
- H03H9/02
- H03H9/05
- H03H9/10
- H03H9/64
- H03H9/72
- CPC H03H9/145
- H03H9/58
- H03H9/17
- H03H9/60
- H03H9/70
- CPC H03H9/585
- H04B1/00
- H04B1/18
- CPC H04B1/0078
- H05K1/02
- CPC H05K1/0283
- H05K9/00
- CPC H05K9/0081
